Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/08/2009US20090249619 Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components
10/08/2009DE112007002936T5 Plattierelement und Verfahren zum Herstellen desselben Of the same plating element and method for producing
10/08/2009DE102009011213A1 Halbleitermodul und Verfahren zum Herstellen desselben The same semiconductor module and method of producing
10/08/2009DE102008017580A1 Housing arrangement for electromagnetic radiation emitting component, has active layer, which is suitable to emit electromagnetic radiation and housing lower part with circulation unit for housing upper part
10/08/2009DE102008017553A1 Electronic system for use in transportation medium e.g. motor vehicle, has space formed between housing and electronic component and filled with binding material to absorb water or aqueous fluid resulting from condensation in housing
10/08/2009DE102008016431A1 Metalldeckschicht mit erhöhtem Elektrodenpotential für kupferbasierte Metallgebiete in Halbleiterbauelementen Metal coating layer with increased electrode potential for copper-based metal regions in semiconductor devices
10/08/2009DE102008016427A1 Drahtbonden auf reaktiven Metalloberflächen einer Metallisierung eines Halbleiterbauelements durch Vorsehen einer Schutzschicht Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
10/08/2009DE102005057401B4 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
10/08/2009DE102005045697B4 Halbleiterbauelement und Versorgungsleitungsanordnungsverfahren Semiconductor device and supply line assembly method
10/08/2009CA2720276A1 Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film
10/07/2009EP2107607A2 High frequency semiconductor circuit device
10/07/2009EP2107606A1 Movable electrical conductor
10/07/2009EP2107605A1 Semiconductor device and fabrication method for the semiconductor device
10/07/2009EP2107604A2 Power semiconductor module with hermetically sealed switching assembly and corresponding production method
10/07/2009EP2107603A1 Semiconductor device and fabrication method for the semiconductor device
10/07/2009EP2107600A2 Demountable interconnect structure
10/07/2009EP2107599A2 System And Method Of Forming A Wafer Scale Package
10/07/2009EP1774587B1 Wafer with improved conductive loops in the dicing lines
10/07/2009CN201323199Y Energy-saving rectifier diode
10/07/2009CN201323198Y Rectifier bridge
10/07/2009CN201323197Y Double-chip anti-reverse lead frame of integrated circuit
10/07/2009CN201323196Y Heavy-current half-wave rectifier bridge
10/07/2009CN201323195Y Triode
10/07/2009CN201323194Y Control chip of lighting emitting diode (LED) display screen
10/07/2009CN201323193Y Cooling plate of memory
10/07/2009CN201322285Y Light source component of LED grille lamp
10/07/2009CN201322284Y Heat dissipation device for LED spot lamp
10/07/2009CN201322283Y High power LED (light-emitting diode) street lamp
10/07/2009CN201322282Y High-power LED integrated light source
10/07/2009CN101553923A Edge connect wafer level stacking
10/07/2009CN101553922A Microelectronic package
10/07/2009CN101553920A Methods and apparatus for a Quad Flat No-Lead (QFN) package
10/07/2009CN101553919A Recyclying faulty multi-die packages
10/07/2009CN101553918A Semiconductor structure and method of assembly
10/07/2009CN101553917A Method of manufacturing stacked chip packages
10/07/2009CN101553914A Method of manufacturing openings in a substrate, a via in a substrate, and a semiconductor device comprising such a via
10/07/2009CN101553911A Electronic device and lead frame
10/07/2009CN101553910A Sealing material and mounting method using the sealing material
10/07/2009CN101553909A Sealing material and mounting method using the sealing material
10/07/2009CN101553908A Folded frame carrier for MOSFET BGA
10/07/2009CN101553103A Heat radiator with heat pipes and leveling manufacture method of heated parts of heat radiator with heat pipes
10/07/2009CN101553102A Heat radiating device, heat radiating device assembly and fixing device thereof
10/07/2009CN101553098A Fastener module
10/07/2009CN101553085A Preferential ground and via exit structures for printed circuit boards
10/07/2009CN101553082A Printed circuit board and setting method thereof
10/07/2009CN101552311A Package process of light emitting element
10/07/2009CN101552277A Array base plate of thin film transistor and fabrication method thereof
10/07/2009CN101552276A Semiconductor memory device and method of manufacturing the same
10/07/2009CN101552274A Semiconductor device and manufacturing and processing method thereof
10/07/2009CN101552273A Improved three-dimensional read only memory (ROM)
10/07/2009CN101552270A Pixel structure, thin-film transistor array substrate, display panel and display apparatus
10/07/2009CN101552267A Single-arm bridge type auto rectifier diode
10/07/2009CN101552265A Radiation image device
10/07/2009CN101552264A Power module
10/07/2009CN101552263A Wafer-level packaging of chip and packaging method thereof
10/07/2009CN101552262A Polycrystalline packaging unit and manufacture method thereof
10/07/2009CN101552261A Semiconductor integrated circuit and layout method for the same
10/07/2009CN101552260A Wiring structure
10/07/2009CN101552259A Semiconductor device
10/07/2009CN101552258A Fuse part of semiconductor device and method of fabricating the same
10/07/2009CN101552257A Semiconductor device capable of switching operation modes
10/07/2009CN101552256A Semiconductor device capable of switching operation modes and operation mode setting method therefor
10/07/2009CN101552255A Power semiconductor module with hermetically sealed switching assembly and corresponding production method
10/07/2009CN101552254A Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package
10/07/2009CN101552253A Array package substrate
10/07/2009CN101552252A High performance rare-earth electric blaster fuse frame material and production method thereof
10/07/2009CN101552251A Lead frame and package of semiconductor device
10/07/2009CN101552250A A lead frame and packaging of a semiconductor device
10/07/2009CN101552249A Semiconductor package structure having movable gain variation on circumsphere point
10/07/2009CN101552248A A semiconductor device and a manufacturing method thereof
10/07/2009CN101552247A 集成电路结构 Integrated circuit structure
10/07/2009CN101552246A Radiator with radiation-type radiation fins
10/07/2009CN101552245A Crystal coated packing structure and processing procedure thereof
10/07/2009CN101552244A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/07/2009CN101552243A 晶体单元 Crystal unit
10/07/2009CN101552225A Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof
10/07/2009CN101552216A Electronic device and method of manufacturing same
10/07/2009CN101552215A Crystal coated packing structure and packing process thereof
10/07/2009CN101552214A Multi-chip stacking method for halving routing procedure and structure thereof
10/07/2009CN101552211A Composite metal substrate and process thereof
10/07/2009CN101552184A A substrate structure and a formation method thereof, a terahertz device and a manufacturing method thereof
10/07/2009CN101551962A Full-color LED display device
10/07/2009CN101551871A Novel mobile phone card and implementation method thereof
10/07/2009CN101551095A Radiating device of multi-heat sources
10/07/2009CN101551094A Light emitting diode lamp with functions of heat convection and heat conduction and heat radiation module thereof
10/07/2009CN101551070A High efficient cooling high-power LED lamp
10/07/2009CN101550279A Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic
10/07/2009CN100548099C Thermally conductive forming body and method of manufacturing the same
10/07/2009CN100548098C Fan heat radiation module
10/07/2009CN100548097C Digital micromirror device mounting system
10/07/2009CN100548093C Grid array connector
10/07/2009CN100548090C Method for preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
10/07/2009CN100547888C Fluid driving component and heat transfer system
10/07/2009CN100547821C Housing body and method for production thereof
10/07/2009CN100547813C Compact light emitting device package with enhanced heat dissipation and method for making the package
10/07/2009CN100547805C Floating node structure of complementary metal oxide semi-image sensor and manufacturing method thereof
10/07/2009CN100547800C Thin film transistor array substrate and electronic ink display device
10/07/2009CN100547797C Semiconductor product manufacture method
10/07/2009CN100547785C Direct insertion LED and its making method
10/07/2009CN100547784C Internal connecting wire of multi-chip packing structure
1 ... 722 723 724 725 726 727 728 729 730 731 732 733 734 735 736 737 738 739 740 741 742 ... 2262