| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/16/2009 | CN101534115A Stepped capacitor array for a full binary weight capacitor |
| 09/16/2009 | CN101534069A Electric power conversion apparatus |
| 09/16/2009 | CN101533880A Light emitting diode (LED) encapsulation module |
| 09/16/2009 | CN101533852A Organic light-emitting display apparatus and method of manufacturing the same |
| 09/16/2009 | CN101533851A Pixel and organic light emitting display using the same |
| 09/16/2009 | CN101533849A Resistive memory devices and method of forming the same |
| 09/16/2009 | CN101533847A Integrative chip with thermoelectric cooling and heat elimination function |
| 09/16/2009 | CN101533844A Thin film transistor array substrate and maintenance method thereof |
| 09/16/2009 | CN101533840A Capacitor device, resistor device and attitude measurement system using same |
| 09/16/2009 | CN101533838A Mom capacitors integrated with air-gaps |
| 09/16/2009 | CN101533836A Large-array CMOS image sensor and manufacturing method thereof |
| 09/16/2009 | CN101533835A An active electron component |
| 09/16/2009 | CN101533832A Integrated chips of Micro-electro-mechanism system device and integrated circuit, and integration method |
| 09/16/2009 | CN101533830A Electrostatic discharge protecting device of high-voltage cushion |
| 09/16/2009 | CN101533829A Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus |
| 09/16/2009 | CN101533828A Semiconductor device and method for fabricating the same |
| 09/16/2009 | CN101533827A 半导体集成电路装置 The semiconductor integrated circuit device |
| 09/16/2009 | CN101533826A Semiconductor device and production method thereof |
| 09/16/2009 | CN101533825A Semiconductor package structure and technics thereof, and surface mounting type semiconductor package structure |
| 09/16/2009 | CN101533824A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533823A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533822A Mounting structure and electro optical device |
| 09/16/2009 | CN101533821A Chip carrier enhancing heat sinking efficiency and chip packaging structure thereof |
| 09/16/2009 | CN101533820A Chip carrier and chip packaging structure thereof |
| 09/16/2009 | CN101533819A Semiconductor packaging structure, lead frame and conductive part which are applied to semiconductor packaging structure |
| 09/16/2009 | CN101533818A Encapsulation structure of integrated circuit element and method for manufacturing same |
| 09/16/2009 | CN101533817A Semiconductor encapsulation structure with pins on bearing seat |
| 09/16/2009 | CN101533816A A conductive projection structure and a chip welded structure of display panel |
| 09/16/2009 | CN101533815A Semiconductor device and method of manufacturing the same |
| 09/16/2009 | CN101533814A Chip-level flip chip package structure |
| 09/16/2009 | CN101533813A Contact bonding pad for reducing parasitic capacitance and manufacturing method thereof |
| 09/16/2009 | CN101533812A Semiconductor package having side walls and method for manufacturing the same |
| 09/16/2009 | CN101533811A Structure of semiconductor chip with silicon through hole and stacking assembly thereof |
| 09/16/2009 | CN101533810A Pulsating heat pipe radiator having foam |
| 09/16/2009 | CN101533809A Honeycomb radiator |
| 09/16/2009 | CN101533808A Energy dissipation device |
| 09/16/2009 | CN101533807A Frit sealing system and method of manufacturing organic light emitting display device |
| 09/16/2009 | CN101533806A Flat panel display product with high leak tightness |
| 09/16/2009 | CN101533805A Pixel structure and manufacturing method thereof |
| 09/16/2009 | CN101533801A Optical device manufacturing method |
| 09/16/2009 | CN101533798A Electrostatic chuck |
| 09/16/2009 | CN101533792A Wafer level ic assembly method |
| 09/16/2009 | CN101533791A Method for manufacturing luminescence module and luminescence module |
| 09/16/2009 | CN101533785A Methods of forming a thin tim coreless high density bump-less package and structures formed thereby |
| 09/16/2009 | CN101533784A Light emitting diode encapsulating structure and production method thereof |
| 09/16/2009 | CN101533771A A laser marking method on wafer surface |
| 09/16/2009 | CN101533767A Semiconductor device, metal-insulator-metal capacitor and method for manufacturing same |
| 09/16/2009 | CN101533587A 等离子体显示装置 The plasma display apparatus |
| 09/16/2009 | CN101532657A Illuminating apparatus |
| 09/16/2009 | CN101532656A High-power LED street lamp |
| 09/16/2009 | CN101532655A Semiconductor solid illuminating lamp and illuminating method thereof |
| 09/16/2009 | CN101532653A Illumination lamp of light-emitting diode (LED) |
| 09/16/2009 | CN101532646A Illuminating apparatus and light source engine thereof |
| 09/16/2009 | CN101532643A Low color temperature warm white light emitting device and manufacturing method thereof |
| 09/16/2009 | CN101532626A Light-emitting-diode backlight device |
| 09/16/2009 | CN101532611A High-power LED light fitting |
| 09/16/2009 | CN101531805A Resin composition and semiconductor device empolying the same |
| 09/16/2009 | CN101531333A Sensor self-powered circuit based on MEMS, and manufacturing process thereof |
| 09/16/2009 | CN100542376C Multilayer ceramic substrate and its manufacturing method |
| 09/16/2009 | CN100542375C Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 09/16/2009 | CN100541936C Power delivery system for integrated circuits |
| 09/16/2009 | CN100541816C Semiconductor device and forming method thereof |
| 09/16/2009 | CN100541783C LSI package provided with interface module, and transmission line header employed in the package |
| 09/16/2009 | CN100541781C Silicon-controlled rectifier for electrostatic discharge protection circuits and structure thereof |
| 09/16/2009 | CN100541780C Programmable semiconductor device and methods of making and using same |
| 09/16/2009 | CN100541779C Semiconductor device and producing method thereof |
| 09/16/2009 | CN100541778C Method for preventing impedance of storage chip circumference from mismatching, storage system and template |
| 09/16/2009 | CN100541777C An electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts |
| 09/16/2009 | CN100541776C Lead frame |
| 09/16/2009 | CN100541775C Wiring construction between low temperature cold platform and room temperature outer housing and method |
| 09/16/2009 | CN100541774C Inner pin joint packaging |
| 09/16/2009 | CN100541773C Electronic device and method of manufacturing the same |
| 09/16/2009 | CN100541772C Trace design to minimize electromigration damage to solder bumps |
| 09/16/2009 | CN100541771C Semiconductor package having embedded passive elements and method for manufacturing the same |
| 09/16/2009 | CN100541770C Elastic electroconductive resin and electronic device |
| 09/16/2009 | CN100541769C Cooler, heat sink and electronic apparatus |
| 09/16/2009 | CN100541768C Cooling device |
| 09/16/2009 | CN100541767C 电子元件封装的制造方法以及电子元件封装 The method of manufacturing an electronic component package and an electronic component package |
| 09/16/2009 | CN100541766C Process for collectively producing a superimposed element microstructure |
| 09/16/2009 | CN100541753C Electronic device and method of manufacturing thereof |
| 09/16/2009 | CN100541749C Semiconductor apparatus and method of fabricating the apparatus |
| 09/16/2009 | CN100541748C Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
| 09/16/2009 | CN100541746C Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 09/16/2009 | CN100540494C Crystallized glass complex and sintered crystallized glass used in circuit board |
| 09/16/2009 | CN100540295C Multi-layered thermally conductive sheet |
| 09/15/2009 | US7589971 Reconfigurable heat sink assembly |
| 09/15/2009 | US7589970 Assembled structure of power semiconductor device and heat sink |
| 09/15/2009 | US7589967 Heat dissipation device |
| 09/15/2009 | US7589787 Solid state image sensing device |
| 09/15/2009 | US7589566 Semiconductor device provided with antenna ratio countermeasure circuit |
| 09/15/2009 | US7589426 Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
| 09/15/2009 | US7589425 Method of manufacturing a semiconductor device having damascene structures with air gaps |
| 09/15/2009 | US7589423 Semiconductor device and a method of manufacturing the same and designing the same |
| 09/15/2009 | US7589422 Micro-element package having a dual-thickness substrate and manufacturing method thereof |
| 09/15/2009 | US7589421 Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
| 09/15/2009 | US7589420 Print head with reduced bonding stress and method |
| 09/15/2009 | US7589419 Side connectors for RFID chip |
| 09/15/2009 | US7589418 Pressure contact power semiconductor module |
| 09/15/2009 | US7589417 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 09/15/2009 | US7589416 Substrate, electronic component, and manufacturing method of these |