Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2009
09/01/2009US7582936 Electro-static discharge protection circuit and method for fabricating the same
09/01/2009US7582921 Semiconductor device and method for patterning
09/01/2009US7582919 Functional coating of the SCFM preform
09/01/2009US7582909 Mounting and adhesive layer for semiconductor components
09/01/2009US7582899 Semiconductor device having overlay measurement mark and method of fabricating the same
09/01/2009US7582848 Energy-efficient, laser-based method and system for processing target material
09/01/2009US7582706 Low chlorine content epoxy resin
09/01/2009US7582552 Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
09/01/2009US7582512 Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
09/01/2009US7582503 Solid state image pickup device and method of producing solid state image pickup device
09/01/2009US7582134 first phase as a disperse metallic phase that is dispersed on a support of the second material phase selected from carbides, borides and nitrides, metal oxides, glass; ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed) which forms droplets of aerosol
09/01/2009US7581583 Heat dissipating device with adjusting member
08/2009
08/27/2009WO2009105449A2 Flat leadless packages and stacked leadless package assemblies
08/27/2009WO2009105411A2 Thermally conductive periodically structured gap fillers and method for utilizing same
08/27/2009WO2009105367A2 Integrated circuit package and method of manufacturing same
08/27/2009WO2009104684A1 Heat exchanger
08/27/2009WO2009104668A1 Wiring board and semiconductor device
08/27/2009WO2009104506A1 Printed wiring board, electronic device and method for manufacturing electronic device
08/27/2009WO2009104391A1 Low-loss small inductor element
08/27/2009WO2009104364A1 Method and apparatus for cutting substrate
08/27/2009WO2009104343A1 Semiconductor device and method for manufacturing semiconductor device
08/27/2009WO2009104328A1 Method for manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock
08/27/2009WO2009104327A1 Method for manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock
08/27/2009WO2009104310A1 Method of manufacturing piezoelectric oscillator, piezoelectric oscillator, oscillator, electronic apparatus, and radio controlled clock
08/27/2009WO2009104308A1 Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled watch
08/27/2009WO2009104233A1 Semiconductor device and method for manufacturing the same
08/27/2009WO2009104132A1 Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate
08/27/2009WO2009082431A3 Integrated circuit system with contact integration
08/27/2009WO2009077538A3 Process of assembly with buried marks
08/27/2009WO2009052817A3 Corrosion-resistant microchannel heat sink and semiconductor cooling device comprising said microchannel heat sink
08/27/2009WO2009052815A3 Microchannel heat sink for cooling semiconductor elements and method for treating the surfaces thereof
08/27/2009WO2007074941A8 Multilayer printed wiring board
08/27/2009WO2006106939A8 Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
08/27/2009US20090216102 Analyte Monitoring Device and Methods of Use
08/27/2009US20090216101 Analyte Monitoring Device and Methods of Use
08/27/2009US20090215261 Semiconductor device and method for manufacturing the same
08/27/2009US20090215244 Package Having Exposed Integrated Circuit Device
08/27/2009US20090212873 Semiconductor device
08/27/2009US20090212793 Structures for testing and locating defects in integrated circuits
08/27/2009US20090212447 Mark Structure for Coarse Wafer Alignment and Method for Manufacturing Such a Mark Structure
08/27/2009US20090212446 Semiconductor Device
08/27/2009US20090212445 Semiconductor integrated circuit
08/27/2009US20090212444 Semiconductor package and method of manufacturing the same
08/27/2009US20090212443 Integrated circuit package substrate having configurable bond pads
08/27/2009US20090212442 Integrated circuit package system with penetrable film adhesive
08/27/2009US20090212441 Semiconductor Interconnect Structure with Stacked Vias Separated by Signal Line and Method Therefor
08/27/2009US20090212440 Semiconductor device
08/27/2009US20090212439 Fluorine depleted adhesion layer for metal interconnect structure
08/27/2009US20090212438 Integrated circuit device comprising conductive vias and method of making the same
08/27/2009US20090212437 Semiconductor device
08/27/2009US20090212436 Semiconductor structure and method for forming the same
08/27/2009US20090212435 Power semiconductor device including a double metal contact
08/27/2009US20090212434 Methods of manufacturing semiconductor devices and a semiconductor structure
08/27/2009US20090212433 Structure and process for metallization in high aspect ratio features
08/27/2009US20090212432 Semiconductor device, its manufacturing method, and sputtering target material for use in the method
08/27/2009US20090212431 Thermally programmable anti-reverse engineering interconnects and methods of fabricating same
08/27/2009US20090212430 Carbon nanotube-based conductive connections for integrated circuit devices
08/27/2009US20090212429 Semiconductor Device and Method of Supporting a Wafer During Backgrinding and Reflow of Solder Bumps
08/27/2009US20090212428 Re-distribution conductive line structure and the method of forming the same
08/27/2009US20090212427 Solder Structures Including Barrier Layers with Nickel and/or Copper
08/27/2009US20090212426 Semiconductor device and manufacturing method thereof
08/27/2009US20090212425 Semiconductor device and a method of manufacturing the same
08/27/2009US20090212424 Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit
08/27/2009US20090212423 Stacked solder balls for integrated circuit device packaging and assembly
08/27/2009US20090212422 JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION
08/27/2009US20090212421 Polymer interlayer dielectric and passivation materials for a microelectronic device
08/27/2009US20090212420 integrated circuit device and method for fabricating same
08/27/2009US20090212419 Integrated circuit package system with overhang film
08/27/2009US20090212418 Thermal interface material design for enhanced thermal performance and improved package structural integrity
08/27/2009US20090212417 Semiconductor Device
08/27/2009US20090212416 Integrated circuit package and method of manufacturing same
08/27/2009US20090212415 Integrated circuit package system with external interconnects within a die platform
08/27/2009US20090212414 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
08/27/2009US20090212413 Ball grid array package layout supporting many voltage splits and flexible split locations
08/27/2009US20090212412 Semiconductor package accomplishing fan-out structure through wire bonding
08/27/2009US20090212411 Semiconductor device and manufacturing method therefor
08/27/2009US20090212410 Stack die packages
08/27/2009US20090212409 Stackable Semiconductor Package and Stack Method Thereof
08/27/2009US20090212408 Integrated circuit package system for stackable devices
08/27/2009US20090212407 Infinitely Stackable Interconnect Device and Method
08/27/2009US20090212406 Semiconductor device and method of manufacturing the same
08/27/2009US20090212405 Stacked die molded leadless package
08/27/2009US20090212404 Leadframe having mold lock vent
08/27/2009US20090212403 Thermally enhanced molded leadless package
08/27/2009US20090212402 Semiconductor device
08/27/2009US20090212401 Package system for shielding semiconductor dies from electromagnetic interference
08/27/2009US20090212400 Semiconductor device and manufacturing method and mounting method thereof
08/27/2009US20090212399 Electronic component and method of manufacturing the same
08/27/2009US20090212398 Semiconductor device
08/27/2009US20090212390 Inductively coupled integrated circuit and methods for use therewith
08/27/2009US20090212389 Semiconductor device with capacitor and fuse, and method for manufacturing the same
08/27/2009US20090212302 Substrate of liquid crystal device and method for manufacturing the same
08/27/2009US20090212295 Semiconductor device and method of fabricating the same
08/27/2009US20090212284 Electronic device and manufacturing thereof
08/27/2009DE112007002435T5 Kühlstruktur für Wärme erzeugendes Bauteil und Antriebseinheit, die diese enthält A cooling structure for heat-generating member and drive unit which contains these
08/27/2009DE102009007102A1 Elektrische Vorrichtung und Herstellungsverfahren Electric device and manufacturing method
08/27/2009DE102009006826A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
08/27/2009DE102009004833A1 Halbleiterleistungselement mit Vorspannungsschalter Semiconductor power device with bias switch
08/27/2009DE102008044411A1 Integrierte Schaltung mit einem Leistungs-MOS-Transistor An integrated circuit comprising a power MOS transistor
08/27/2009DE102008026841A1 Optoelektronisches Bauteil The optoelectronic device
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