Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/20/2009US7603772 Methods of fabricating substrates including one or more conductive vias
10/15/2009WO2009126544A1 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
10/15/2009WO2009126501A2 Reliability improvement in a compound semiconductor mmic
10/15/2009WO2009126412A1 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
10/15/2009WO2009126367A1 Leadframe for packaged electronic device with enhanced mold locking capability
10/15/2009WO2009126339A2 Metal-based microchannel heat exchangers made by molding replication and assembly
10/15/2009WO2009125779A1 Semiconductor device and method for manufacturing semiconductor device
10/15/2009WO2009125685A1 Sealing resin sheet
10/15/2009WO2009125459A1 Semiconductor device and method for manufacturing same
10/15/2009WO2009125250A1 Integrated circuit package, method of manufacturing an integrated circuit package and printed circuit board
10/15/2009WO2009124785A1 Embedded constrainer discs for reliable stacked vias in electronic substrates
10/15/2009WO2009099699A3 Shielded integrated circuit pad structure
10/15/2009WO2009095847A3 Lithography robustness monitor
10/15/2009WO2009089354A3 Methods and devices for wireless chip-to-chip communications
10/15/2009WO2009081356A3 Non-substrate type package with embedded power line
10/15/2009WO2009040670A3 Semiconductor device and manufacturing method therefor
10/15/2009WO2009034557A3 Method and apparatus for forming arbitrary structures for integrated circuit devices
10/15/2009WO2009016589A3 Tamper-resistant semiconductor device and methods of manufacturing thereof
10/15/2009US20090258992 Thermosetting Resin Composition and Semiconductor Sealing Medium
10/15/2009US20090256624 Antifuse and methods of operating and manufacturing the same
10/15/2009US20090256268 Partially underfilled solder grid arrays
10/15/2009US20090256267 Integrated circuit package-on-package system with central bond wires
10/15/2009US20090256266 Apparatus and method for a chip assembly including a frequency extending device
10/15/2009US20090256265 Semiconductor integrated circuit device
10/15/2009US20090256264 Semiconductor structure and method of making the same
10/15/2009US20090256263 Structure and method for hybrid tungsten copper metal contact
10/15/2009US20090256262 Semiconductor devices including porous insulators
10/15/2009US20090256261 Semiconductor device and manufacturing method thereof
10/15/2009US20090256260 Semiconductor device
10/15/2009US20090256259 Semiconductor device and method for manufacturing the same
10/15/2009US20090256258 Semiconductor chip with integrated via
10/15/2009US20090256257 Final via structures for bond pad-solder ball interconnections
10/15/2009US20090256256 Electronic Device and Method of Manufacturing Same
10/15/2009US20090256255 Composite interconnect
10/15/2009US20090256254 Wafer level interconnection and method
10/15/2009US20090256253 Continuously Referencing Signals Over Multiple Layers in Laminate Packages
10/15/2009US20090256252 Semiconductor Die Packages With Multiple Integrated Substrates, Systems Using the Same, and Methods Using the Same
10/15/2009US20090256251 Electronic device packages and methods of formation
10/15/2009US20090256250 Semiconductor device and programming method
10/15/2009US20090256249 Stacked, interconnected semiconductor package
10/15/2009US20090256248 Configuration terminal for integrated devices and method for configuring an integrated device
10/15/2009US20090256247 Semiconductor device and method including first and second carriers
10/15/2009US20090256246 Semiconductor packaging techniques
10/15/2009US20090256245 Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same
10/15/2009US20090256244 Semiconductor device packages with electromagnetic interference shielding
10/15/2009US20090256243 Low k interconnect dielectric using surface transformation
10/15/2009US20090256242 Method of forming an electronic device including forming a charge storage element in a trench of a workpiece
10/15/2009US20090256237 Semiconductor device, manufacturing method thereof, and data processing system
10/15/2009US20090256235 Semiconductor device
10/15/2009US20090256233 Isolation Structure in Memory Device and Method for Fabricating the Isolation Structure
10/15/2009US20090256229 Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device
10/15/2009US20090256216 Wafer Level CSP Sensor
10/15/2009US20090256215 Gated metal oxide sensor
10/15/2009US20090256188 Method for manufacturing semiconductor device and the semiconductor device
10/15/2009US20090256177 Semiconductor device including an ohmic layer
10/15/2009US20090256161 Power conversion apparatus
10/15/2009US20090255652 Heat exchange device and method
10/15/2009US20090255340 Semiconductor acceleration sensor device and method for manufacturing the same
10/15/2009DE202009009203U1 Konversionseinheit mit mehreren Konversionsmodulen und eine solche Konversionseinheit aufweisende optische Anordnung Conversion unit with multiple conversion modules and such conversion unit having optical arrangement
10/15/2009DE202009007008U1 Kompaktfluidkühler Compact fluid cooler
10/15/2009DE112008000040T5 Kühlstruktur für ein Wärme erzeugendes Bauteil und Antriebseinheit The cooling structure for a heat generating member and the drive unit
10/15/2009DE102009013215A1 Gleichrichterdiodengehäusestruktur Rectifier diode package structure
10/15/2009DE102009010196A1 Halbleiterbauelemente und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation
10/15/2009DE102008050840A1 Electrical module i.e. detector module, manufacturing method for X-ray measuring system of computer tomography scanner, involves soldering evaluation electronics of component with carrier substrate by low-temperature-guide
10/15/2009DE102008050838A1 Electric component for roentgen measuring system, has two semiconductor elements and contact element, where one semiconductor element is soldered on another semiconductor element, and contact element acts as tolerance compensation
10/15/2009DE102008017967A1 Resonanzfilter mit geringem Verlust Resonant filters with low loss
10/14/2009EP2109349A1 Printed circuit board with a conductive connection
10/14/2009EP2109141A1 Printed circuit board with a conductive connection
10/14/2009EP2109140A1 Apparatus and method for a chip assembly including a frequency extending device
10/14/2009EP2109139A2 Device for protecting an integrated circuit against a laser attack
10/14/2009EP2109138A1 Heat dissipating substrate and electronic device using the same
10/14/2009EP2109137A2 Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same
10/14/2009EP2108191A1 Electronic board and cold plate for said board
10/14/2009EP2108190A1 Electronic component module and method for production thereof
10/14/2009EP1989740B1 Solar cell marking method, and solar cell
10/14/2009EP1816175B1 Thermal interface material
10/14/2009CN201327843Y High-power LED bracket
10/14/2009CN201327842Y High-power LED bracket
10/14/2009CN201327833Y Pre-package structure of image module
10/14/2009CN201327831Y A failure solution circuit of integrated circuit
10/14/2009CN201327829Y Rectifier luminescent diode device
10/14/2009CN201327828Y Multi-chip surface-mounted LED module packaging structure
10/14/2009CN201327827Y Radiator buckling device
10/14/2009CN201327826Y Diode heat dissipation shell for automobile rectifier
10/14/2009CN201327002Y Radiator of LED (light-emitting diode) lighting device
10/14/2009CN201327001Y Led光源散热器 Led light radiator
10/14/2009CN201327000Y Radiator for high-power LED lamp
10/14/2009CN101558505A Thermoelectric module and metallized substrate
10/14/2009CN101558499A Structure and method for forming laterally extending dielectric layer in a trench-gate FET
10/14/2009CN101558491A Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
10/14/2009CN101558490A Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition
10/14/2009CN101558489A IC chip mounting package
10/14/2009CN101558488A Lid or case for sealing package and method for manufacturing the lid or the case
10/14/2009CN101557697A Heat radiation die set and radiation system applying phase change metal thermal interface material
10/14/2009CN101557696A Radiator unit
10/14/2009CN101557695A Radiating device
10/14/2009CN101557677A Printed circuit board
10/14/2009CN101557676A Printed circuit board
10/14/2009CN101557674A High density circuit board and manufacturing method thereof
10/14/2009CN101557104A Power surging protection device
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