H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/27/2009	DE102008007002A1 Substratkontakt für moderne SOI-Bauelemente auf der Grundlage einer tiefen Grabenkondensatorkonfiguration Substrate contact for modern SOI devices based on a deep grave capacitor configuration
08/27/2009	DE102008006963A1 ESD-Leistungsklemmeinrichtung mit stabiler Einschaltfunktion ESD power clamp with stable switch-on
08/27/2009	DE102007011126B4 Halbleiterbauelement mit Anschlusskontaktfläche Semiconductor component with terminal contact surface
08/27/2009	DE102004001892B4 Verfahren zur Herstellung einer FBAR-Vorrichtung vom Wafer-Level-Package-Typ Process for the preparation of an FBAR device from the wafer-level package type
08/26/2009	EP2093798A2 MCM packages
08/26/2009	EP2093797A1 Method for aligning two substrates by microcoils
08/26/2009	EP2093793A2 Manufacturing method of semiconductor device
08/26/2009	EP2093791A2 Chip scale package with flip chip interconnect
08/26/2009	EP2092806A2 Circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound and method for the production and use thereof
08/26/2009	EP2092561A1 Bond pad structure and method for producing same
08/26/2009	EP2091999A2 Novel nanoparticle containing siloxane polymers
08/26/2009	EP1673809A4 Wiring protection element for laser deleted tungsten fuse
08/26/2009	EP1573602A4 Nested design approach
08/26/2009	EP1428246A4 Wafer level underfill and interconnect process
08/26/2009	EP1394734B1 Ic card
08/26/2009	EP1311190B1 Medical device for applying electrical pulses to muscle-tissue
08/26/2009	EP1303876B1 Method of forming copper interconnect capping layers with improved interface and adhesion
08/26/2009	CN201298982Y Heat radiator with a wind scooper
08/26/2009	CN201298981Y Double-piece type wing unfolding radiator
08/26/2009	CN201298978Y 电动自行车控制器 Electric Bicycle Controller
08/26/2009	CN201298966Y Surface mounting part
08/26/2009	CN201298946Y LED light fixture with controllable lamp body temperature
08/26/2009	CN201298805Y Water-cooling copper bar plug
08/26/2009	CN201298563Y 0603 LED with polar identification
08/26/2009	CN201298553Y A package structure of an integrated circuit chip of an electronic mouse
08/26/2009	CN201298552Y Ball-bar array packaged chip
08/26/2009	CN201298551Y High-voltage LED
08/26/2009	CN201298550Y Novel lead frame structure for semiconductor
08/26/2009	CN201298549Y A package structure of an LED constant current driving integrated circuit
08/26/2009	CN201297601Y Lamp heat radiation structure
08/26/2009	CN201297600Y Structural improvement of radiator
08/26/2009	CN201297586Y Lamp structure
08/26/2009	CN201297550Y 大功率的led车灯 High power led lights
08/26/2009	CN201297542Y An LED street lamp
08/26/2009	CN201297541Y High-power LED street lamp
08/26/2009	CN201297527Y LED bulb with radiator
08/26/2009	CN201297525Y LED lamp with good heat radiating structure
08/26/2009	CN101517845A Socket, module board, and inspection system using the module board
08/26/2009	CN101517832A Electric connector
08/26/2009	CN101517750A Electronic device module comprising an ethylene multi-block copolymer
08/26/2009	CN101517738A Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device
08/26/2009	CN101517737A Flip-chip interconnection through chip vias
08/26/2009	CN101517736A Cooling apparatus
08/26/2009	CN101517735A Shape memory based mechanical enabling mechanism
08/26/2009	CN101517734A Elastic contact and method for bonding between metal terminals using the same
08/26/2009	CN101517733A 层叠的集成电路芯片组装件 Stacked integrated circuit chip assembly
08/26/2009	CN101517728A Electronic device and method for making the same
08/26/2009	CN101517719A Method of manufacturing an integrated circuit
08/26/2009	CN101517718A Plastic packaged device with die interface layer
08/26/2009	CN101516993A Epoxy resin composition for semiconductor encapsulation and semiconductor device
08/26/2009	CN101516922A Benzoxazine-containing formulations polymerizable/curable at low temperature
08/26/2009	CN101516713A Cooling device for mobile body
08/26/2009	CN101516173A Piezoelectric air jet augmented cooling for electronic devices
08/26/2009	CN101516171A Radiation device
08/26/2009	CN101516170A Radiation device
08/26/2009	CN101516160A Flexible printed wiring board and electronic apparatus
08/26/2009	CN101515627A Semiconductor light emitting device
08/26/2009	CN101515602A Transparent conductive film glass
08/26/2009	CN101515596A 有机发光显示装置 The organic light emitting display device
08/26/2009	CN101515595A Package mounting light emitting device
08/26/2009	CN101515592A Substrate module, method for manufacturing substrate module, and electronic device
08/26/2009	CN101515591A Structure for sensing wafer, wafer-class sensing assembling structure and method for producing same
08/26/2009	CN101515590A Film transistor array substrate
08/26/2009	CN101515589A Pixel structure, display panel, optoelectronic device and method for forming same
08/26/2009	CN101515588A Radio frequency SOI LDMOS device with H-shaped gate
08/26/2009	CN101515587A Thin film transistor array substrate and method for producing same
08/26/2009	CN101515586A Radio frequency SOI LDMOS device with close body contact
08/26/2009	CN101515582A Semiconductor device
08/26/2009	CN101515581A Semiconductor element structure and method for making same
08/26/2009	CN101515580A SiCN medium diffusion barrier film for copper interconnection and preparation process thereof
08/26/2009	CN101515579A Semiconductor device and electronic device
08/26/2009	CN101515578A Semiconductor device and electronic device
08/26/2009	CN101515577A Connection pad structure, chip joint structure and method for detecting chip joint state
08/26/2009	CN101515576A Cof packaging structure, method of manufacturing the cof packaging structure, and method for assembling the cof packaging structure thereof
08/26/2009	CN101515575A Rectification circuit lead frame copper strip and manufacturing method thereof
08/26/2009	CN101515574A Chip package substrate, chip package body, and method for manufacturing chip package body
08/26/2009	CN101515573A Conductive structure used for semiconductor integrated circuit
08/26/2009	CN101515572A Novel LED and a high-power radiator of a radiating element
08/26/2009	CN101515563A Manufacturing method and semiconductor device of capping layer
08/26/2009	CN101515557A Fabricating low cost solder bumps on integrated circuit wafers
08/26/2009	CN101515555A Flip chip type square flat pinless encapsulation structure and manufacturing procedure thereof
08/26/2009	CN101515554A Semiconductor device manufacturing mehtod, semiconductor device, and wiring board
08/26/2009	CN101515552A Method for manufacturing light-emitting device
08/26/2009	CN101515550A Radiating modular structure of semiconductor package and manufacturing method thereof
08/26/2009	CN101515543A Gallium nitride membrane structure grown on silicon substrate and growing method thereof
08/26/2009	CN101514809A Illuminating apparatus
08/26/2009	CN101514808A Connection device for LED lamp and radiating fins
08/26/2009	CN101514791A Lightning protective street lamp structure
08/26/2009	CN101514782A Led lamp moudle
08/26/2009	CN101514281A Conductive silver ink for encapsulating LED and preparation method thereof
08/26/2009	CN101513662A Method for manufacturing radiator with radiating fins and structure of radiator
08/26/2009	CN101513661A Method for manufacturing radiator and radiator structure
08/26/2009	CN100534284C Heat radiator
08/26/2009	CN100534283C Combination of cooling device
08/26/2009	CN100534282C Heat radiating device
08/26/2009	CN100534281C Heat sink for heat pipe
08/26/2009	CN100534278C Fin for heat radiation and heat radiator using same
08/26/2009	CN100534276C Laminated socket contacts
08/26/2009	CN100534271C Method for producing printing-circuit board conducting hole
08/26/2009	CN100534268C Circuit board with at least one electronic component

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