| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/08/2009 | US7585766 Methods of manufacturing copper interconnect systems |
| 09/08/2009 | US7585757 Semiconductor device and method of manufacturing the same |
| 09/08/2009 | US7585708 Method for manufacturing a thin-film transistor |
| 09/08/2009 | US7585700 Ball grid array package stack |
| 09/08/2009 | US7585699 Semiconductor package board using a metal base |
| 09/08/2009 | US7585540 Method for manufacturing wiring substrate |
| 09/08/2009 | US7584881 Low loop height ball bonding method and apparatus |
| 09/08/2009 | US7584537 Method for making a microcircuit card |
| 09/08/2009 | US7584535 Method of manufacturing multi-layer wiring board |
| 09/03/2009 | WO2009108707A2 Micromodules including integrated thin film inductors and methods of making the same |
| 09/03/2009 | WO2009108482A1 Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die |
| 09/03/2009 | WO2009108411A1 Microelectromechanical systems component and method of making same |
| 09/03/2009 | WO2009108300A2 Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards |
| 09/03/2009 | WO2009108171A1 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive |
| 09/03/2009 | WO2009108136A1 Substrate cavity semiconductor package |
| 09/03/2009 | WO2009107883A1 Method for manufacturing wafer stack |
| 09/03/2009 | WO2009107880A1 Flip chip packaging method using double layer type wafer level underfill, flip chip package manufactured using the same, and semiconductor device for the same |
| 09/03/2009 | WO2009107768A1 Method for formation of siliceous film and siliceous film formed by the method |
| 09/03/2009 | WO2009107742A1 Semiconductor device |
| 09/03/2009 | WO2009107229A1 Sheet structure, semiconductor device and method of growing carbon structure |
| 09/03/2009 | WO2009107205A1 Semiconductor device and method for manufacturing the same |
| 09/03/2009 | WO2009107171A1 Method for manufacturing thin film multilayer device, method for manufacturing display device, and thin film multilayer device |
| 09/03/2009 | WO2009106520A1 Bilayer metal capping layer for interconnect applications |
| 09/03/2009 | WO2009106074A1 An electromagnetic pump |
| 09/03/2009 | WO2009088659A3 Micropad formation for a semiconductor |
| 09/03/2009 | WO2009085609A3 3-d semiconductor die structure with containing feature and method |
| 09/03/2009 | WO2009085363A3 Ic disabling circuit |
| 09/03/2009 | WO2009043062A3 Wafer level packaged mems device |
| 09/03/2009 | WO2008153245A3 Semiconductor package module using anodized oxide layer and manufacturing method thereof |
| 09/03/2009 | WO2006028693A3 Stacked integrated circuit cascade signaling system and method |
| 09/03/2009 | US20090222672 Integrated Circuit That Uses A Dynamic Characteristic Of The Circuit |
| 09/03/2009 | US20090221925 Microelectronic Device With Integrated Energy Source |
| 09/03/2009 | US20090221108 Miniature optical element for wireless bonding in an electronic instrument |
| 09/03/2009 | US20090221104 Method of manufacturing a semiconductor device |
| 09/03/2009 | US20090219777 Multi-chip assembly and method for driving the same |
| 09/03/2009 | US20090219772 Three dimensional structure memory |
| 09/03/2009 | US20090219686 Gas ejector, electronic device, and gas-ejecting method |
| 09/03/2009 | US20090219069 Semiconductor integrated circuit device |
| 09/03/2009 | US20090218703 Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape |
| 09/03/2009 | US20090218702 Methods for bonding and micro-electronic devices produced according to such methods |
| 09/03/2009 | US20090218701 Inductively coupled integrated circuit with magnetic communication path and methods for use therewith |
| 09/03/2009 | US20090218700 Three dimensional structure memory |
| 09/03/2009 | US20090218699 Metal interconnects in a dielectric material |
| 09/03/2009 | US20090218698 Wafer-Level Integrated Circuit Package with Top and Bottom Side Electrical Connections |
| 09/03/2009 | US20090218697 Electronic device, method of manufacture of the same, and sputtering target |
| 09/03/2009 | US20090218696 Semiconductor device including a padding unit |
| 09/03/2009 | US20090218695 Low contact resistance metal contact |
| 09/03/2009 | US20090218694 Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus |
| 09/03/2009 | US20090218693 Low resistance high reliability contact via and metal line structure for semiconductor device |
| 09/03/2009 | US20090218692 Barrier for Copper Integration in the FEOL |
| 09/03/2009 | US20090218691 Bilayer metal capping layer for interconnect applications |
| 09/03/2009 | US20090218690 Reduced-Stress Through-Chip Feature and Method of Making the Same |
| 09/03/2009 | US20090218689 Flip chip semiconductor assembly with variable volume solder bumps |
| 09/03/2009 | US20090218688 Optimized passivation slope for solder connections |
| 09/03/2009 | US20090218687 Semiconductor Chip with Passivation Layer Comprising Metal Interconnect and Contact Pads |
| 09/03/2009 | US20090218686 Semiconductor, semiconductor module, method for manufacturing the semiconductor module, and mobile apparatus |
| 09/03/2009 | US20090218685 Semiconductor module and method of producing the same |
| 09/03/2009 | US20090218684 Autoclave capable chip-scale package |
| 09/03/2009 | US20090218683 Semiconductor Device |
| 09/03/2009 | US20090218682 Semiconductor chip |
| 09/03/2009 | US20090218681 Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same |
| 09/03/2009 | US20090218680 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive |
| 09/03/2009 | US20090218679 Chip package and process thereof |
| 09/03/2009 | US20090218678 Semiconductor ic-embedded substrate and method for manufacturing same |
| 09/03/2009 | US20090218677 Board-on-chip type substrates with conductive traces in multiple planes, semiconductor device packages including such substrates, and associated methods |
| 09/03/2009 | US20090218676 Semiconductor device |
| 09/03/2009 | US20090218675 Multipackage module having stacked packages with asymmetrically arranged die and molding |
| 09/03/2009 | US20090218674 Semiconductor module |
| 09/03/2009 | US20090218673 Semiconductor package having a bridge plate connection |
| 09/03/2009 | US20090218672 Solder resist material, wiring board using the solder resist material, and semiconductor package |
| 09/03/2009 | US20090218670 Storage medium and semiconductor package |
| 09/03/2009 | US20090218669 Multi-chip package structure and method of fabricating the same |
| 09/03/2009 | US20090218668 Double-side mountable MEMS package |
| 09/03/2009 | US20090218667 Smart cards and methods for producing a smart card |
| 09/03/2009 | US20090218666 Power device package and method of fabricating the same |
| 09/03/2009 | US20090218665 Power device package and method of fabricating the same |
| 09/03/2009 | US20090218664 Structure of a lead-frame matrix of photoelectron devices |
| 09/03/2009 | US20090218663 Lead frame based semiconductor package and a method of manufacturing the same |
| 09/03/2009 | US20090218660 Semiconductor substrate, semiconductor device and method of manufacturing the same |
| 09/03/2009 | US20090218655 Integrated passive devices |
| 09/03/2009 | US20090218652 Device comprising electrode pad |
| 09/03/2009 | US20090218644 Integrated Circuit, Memory Device, and Method of Manufacturing an Integrated Circuit |
| 09/03/2009 | US20090218640 Self Aligned Silicided Contacts |
| 09/03/2009 | US20090218626 Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device |
| 09/03/2009 | US20090218560 Method for reversibly mounting a device wafer to a carrier substrate |
| 09/03/2009 | US20090218079 Heat-emitting element cooling apparatus |
| 09/03/2009 | US20090217522 Process for producing multilayer printed wiring board |
| 09/03/2009 | US20090217518 Device-incorporated substrate and method of manufacturing thereof as well as printed circuit board and method of manufacturing thereof |
| 09/03/2009 | DE10319984B4 Vorrichtung zum Kühlen von Speichermodulen Device for the cooling of memory modules |
| 09/03/2009 | DE10229711B4 Halbleitermodul mit Mikrokühler Semiconductor module with micro-cooler |
| 09/03/2009 | DE102008011862A1 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung Miniature casing carrier arrangement with at least one miniature housing, and a method of manufacturing a carrier arrangement |
| 09/03/2009 | DE102005039323B4 Leitbahnanordnung sowie zugehöriges Herstellungsverfahren Interconnect arrangement and manufacturing method thereof |
| 09/03/2009 | DE102004036747B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit einer photoempfindlichen Polyimidschicht und entsprechend des Verfahrens hergestellte Vorrichtung A process for producing a semiconductor device having a photosensitive polyimide and produced in accordance with the process device |
| 09/03/2009 | DE10196942B4 Halbleiter-Leistungsmodul Semiconductor power module |
| 09/02/2009 | EP2096666A1 Method for forming wiring film, transistor, and electronic device |
| 09/02/2009 | EP2095420A1 Circuit arrangement for supplying an integrated circuit with energy |
| 09/02/2009 | EP2095419A1 Semiconductor chip shape alteration |
| 09/02/2009 | EP2095418A1 Wire and solder bond forming methods |
| 09/02/2009 | EP2095417A1 Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof |
| 09/02/2009 | EP2095416A1 Method of manufacturing openings in a substrate, a via in a substrate, and a semiconductor device comprising such a via |