| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/26/2009 | CN100534148C Image pickup device and portable terminal equipped therewith |
| 08/26/2009 | CN100533969C Elastic-surface-wave-device mount substrate, high-frequency module using the same, and communication apparatus |
| 08/26/2009 | CN100533797C Covered devices in a semiconductor package |
| 08/26/2009 | CN100533789C Luminous device and manufacturing method thereof |
| 08/26/2009 | CN100533773C Uv-blocking layer for reducing uv-induced charging of silicon-oxide-nitride-oxide-silicon dual-bit flash memory devices in beol processing |
| 08/26/2009 | CN100533764C Semiconductor device module structure |
| 08/26/2009 | CN100533753C Method and apparatus for reducing optical crosstalk in CMOS image sensors |
| 08/26/2009 | CN100533752C Solid image pickup unit and camera module |
| 08/26/2009 | CN100533747C Pixel structure and method for repairing thereof |
| 08/26/2009 | CN100533745C Nonvolatile semiconductor memory elememnt and manufacturing method thereof |
| 08/26/2009 | CN100533743C Nonvolatile memory devices and methods of fabricating the same |
| 08/26/2009 | CN100533734C Active element array base plate |
| 08/26/2009 | CN100533733C Layout circuit with stable guiding current and IC chip with the same |
| 08/26/2009 | CN100533732C Semiconductor integrated circuit |
| 08/26/2009 | CN100533731C 半导体器件 Semiconductor devices |
| 08/26/2009 | CN100533730C High-frequency circuit module and radio communication apparatus |
| 08/26/2009 | CN100533727C Module for optical device and manufacturing method thereof |
| 08/26/2009 | CN100533725C Metal interconnection forming method of semiconductor device |
| 08/26/2009 | CN100533724C Electronic device |
| 08/26/2009 | CN100533723C Method for the production of an electrically-conducting frame, method for production of a surface mounting semiconductor component and conductor frame strips |
| 08/26/2009 | CN100533722C 半导体器件 Semiconductor devices |
| 08/26/2009 | CN100533721C Chip packaging structure and method of producing the same |
| 08/26/2009 | CN100533720C Semiconductor device, mounting structure, electro-optical device and electronic member manufacture method |
| 08/26/2009 | CN100533719C Semiconductor structure and forming method thereof |
| 08/26/2009 | CN100533718C Chip comprising at least one test contact configuration |
| 08/26/2009 | CN100533717C Lead pin, circuit, semiconductor device, and method of forming lead pin |
| 08/26/2009 | CN100533716C Heat radiator |
| 08/26/2009 | CN100533715C Heat sink and method of manufacturing the same |
| 08/26/2009 | CN100533714C Device and method for determining the temperature of a heat sink |
| 08/26/2009 | CN100533713C Method for controlling heat of circuit, apparatus, and system |
| 08/26/2009 | CN100533712C Optoelectronic device chip and method for making same |
| 08/26/2009 | CN100533711C Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device |
| 08/26/2009 | CN100533703C Technique for evaluating a fabrication of a semiconductor component and wafer |
| 08/26/2009 | CN100533473C Data carrier with a module with a reinforcement strip |
| 08/26/2009 | CN100533152C Acceleration sensor and method of manufacturing acceleration sensor |
| 08/26/2009 | CN100533082C Temperature control mechanism in a memory device |
| 08/26/2009 | CN100533047C Method for improving contact thermal resistance between large power heat pipe radiator and heating element |
| 08/25/2009 | US7580265 Heat sink, circuit board, and electronic apparatus |
| 08/25/2009 | US7580264 Power supply and fixing structure of heatsink and circuit board applicable to the same |
| 08/25/2009 | US7579815 Current controlling circuit arrangement and associated method for reducing crosstalk |
| 08/25/2009 | US7579699 Systems and methods for performing quantum computations |
| 08/25/2009 | US7579698 Photodetector sealing resin is a boride or an oxide of micro particles |
| 08/25/2009 | US7579697 Arrangement for high frequency application |
| 08/25/2009 | US7579696 Semiconductor device |
| 08/25/2009 | US7579695 Integration type semiconductor device and method for manufacturing the same |
| 08/25/2009 | US7579694 Electronic devices including offset conductive bumps |
| 08/25/2009 | US7579693 Mounting structure of ball grid array |
| 08/25/2009 | US7579692 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
| 08/25/2009 | US7579691 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
| 08/25/2009 | US7579690 Semiconductor package structure |
| 08/25/2009 | US7579689 Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for testing of the package |
| 08/25/2009 | US7579688 Heat radiation structure of semiconductor device, and manufacturing method thereof |
| 08/25/2009 | US7579687 Circuit module turbulence enhancement systems and methods |
| 08/25/2009 | US7579686 Thermal interface material with hotspot heat remover |
| 08/25/2009 | US7579685 Wafer level packaging cap and fabrication method thereof |
| 08/25/2009 | US7579684 Methods for packing microfeature devices and microfeature devices formed by such methods |
| 08/25/2009 | US7579683 Memory interface optimized for stacked configurations |
| 08/25/2009 | US7579682 Power semiconductor module |
| 08/25/2009 | US7579681 Super high density module with integrated wafer level packages |
| 08/25/2009 | US7579680 Packaging system for semiconductor devices |
| 08/25/2009 | US7579679 Chipcard with contact areas and method for producing contact areas |
| 08/25/2009 | US7579678 Semiconductor microphone unit |
| 08/25/2009 | US7579677 Semiconductor device and method for manufacturing thereof |
| 08/25/2009 | US7579676 Leadless leadframe implemented in a leadframe-based BGA package |
| 08/25/2009 | US7579675 Semiconductor device having surface mountable external contact areas and method for producing the same |
| 08/25/2009 | US7579674 Semiconductor package configuration with improved lead portion arrangement |
| 08/25/2009 | US7579673 Semiconductor device having electrical fuse |
| 08/25/2009 | US7579672 Semiconductor package with electromagnetic shielding capabilities |
| 08/25/2009 | US7579671 Semiconductor device and manufacturing method thereof |
| 08/25/2009 | US7579658 Devices without current crowding effect at the finger's ends |
| 08/25/2009 | US7579647 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 08/25/2009 | US7579632 Multi-channel ESD device and method therefor |
| 08/25/2009 | US7579628 Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave |
| 08/25/2009 | US7579626 Silicon carbide layer on diamond substrate for supporting group III nitride heterostructure device |
| 08/25/2009 | US7579583 Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
| 08/25/2009 | US7579553 Front-and-back electrically conductive substrate |
| 08/25/2009 | US7579269 Microelectronic spring contact elements |
| 08/25/2009 | US7579267 Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) |
| 08/25/2009 | US7579266 Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance |
| 08/25/2009 | US7579251 Aerosol deposition process |
| 08/25/2009 | US7579231 Semiconductor device and method of manufacturing the same |
| 08/25/2009 | US7579219 Semiconductor device with a protected active die region and method therefor |
| 08/25/2009 | US7579217 Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader |
| 08/25/2009 | US7579216 Method of manufacturing a semiconductor device |
| 08/25/2009 | US7578858 Making capacitor structure in a semiconductor device |
| 08/25/2009 | US7578338 Heat dissipating apparatus having micro-structure layer and method of fabricating the same |
| 08/20/2009 | WO2009102742A1 Solder interconnect pads with current spreading layers |
| 08/20/2009 | WO2009102741A1 Through substrate annular via including plug filler |
| 08/20/2009 | WO2009102056A1 Process for embedding metal and equipment for depositing metal in recesses |
| 08/20/2009 | WO2009101921A1 Electronic component, electronic apparatus, and method for producing base member |
| 08/20/2009 | WO2009101904A1 Semiconductor device and method for manufacturing the same |
| 08/20/2009 | WO2009101805A1 Semiconductor device and method for manufacturing the same |
| 08/20/2009 | WO2009101753A1 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device |
| 08/20/2009 | WO2009101733A1 Piezoelectric vibrator, manufacturing method of the piezoelectric vibrator, oscillator, electronic instrument and atomic clock |
| 08/20/2009 | WO2009101685A1 Semiconductor element module and method for manufacturing the same |
| 08/20/2009 | WO2009101664A1 Method for manufacturing semiconductor device |
| 08/20/2009 | WO2009101551A1 Light emitting device |
| 08/20/2009 | WO2009101040A2 Microstructure modification in copper interconnect structure |
| 08/20/2009 | WO2009100798A1 Modular cooling design |
| 08/20/2009 | WO2009100698A2 Method for low-temperature pressure sintering of a heat sink plate to the substrate of an electronic unit |