Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/14/2009CN101557100A Bidirectional and reverse blocking battery switch
10/14/2009CN101556969A Enhanced silicon carbide metal semiconductor field effect transistor and manufacturing method thereof
10/14/2009CN101556962A Image sensor with sensing transistor having two gates and method of operating the same
10/14/2009CN101556958A Thin film transistor substrate and liquid crystal display device
10/14/2009CN101556954A Semiconductor device having vertical pillar transistors and method for manufacturing the same
10/14/2009CN101556952A Electronic paper device and driving basal plate thereof
10/14/2009CN101556951A Photo-thyristor valve body radiating with heat pipe
10/14/2009CN101556950A Stack structure of encapsulated wafer
10/14/2009CN101556949A Semiconductor device
10/14/2009CN101556948A Semiconductor device, method for manufacturing semiconductor device and gas for plasma cvd
10/14/2009CN101556947A Basal plate for reducing warpage degree and chip packaging structure provided with same
10/14/2009CN101556946A Method of forming a semiconductor package and structure thereof
10/14/2009CN101556945A Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
10/14/2009CN101556944A Structure and process for the formation of through-silicon-via
10/14/2009CN101556943A Anisotropic conductive film and circuits interconnection structure using the same
10/14/2009CN101556942A Anisotropic conductive film with excellent connection reliability and circuits interconnection structure using the same
10/14/2009CN101556941A Heat radiation structure of surface mounting high-power element
10/14/2009CN101556940A Semiconductor encapsulating structure with radiation fins
10/14/2009CN101556939A Ceramic encapsulated base and manufacture method thereof
10/14/2009CN101556930A Technique for evaluating a fabrication of a semiconductor component and wafer
10/14/2009CN101556901A Photoelectric element and manufacturing method thereof
10/14/2009CN101556828A Unit cell of nonvolatile memory device and nonvolatile memory device having the same
10/14/2009CN101556825A Integrated circuit
10/14/2009CN101556764A Method for driving passive matrix organic light emitting diode display device
10/14/2009CN101556417A FFS type TFT-LCD array substrate structure and manufacture method thereof
10/14/2009CN101556122A Heat dissipating device and heat transferring element thereof
10/14/2009CN101556035A Radiator structure of semiconductor lighting fixture
10/14/2009CN101556033A Lighting device and light engine thereof
10/14/2009CN101556032A 发光二极管灯具 LED lamp
10/14/2009CN101556027A High brightness LED lamp
10/14/2009CN100551213C Multi-layered wiring board, fabricating method, electronic device and electronic instrument
10/14/2009CN100551202C Composite dielectric composition and signal-matching embedded capacitor prepared using the same
10/14/2009CN100550449C LED waterproof encapsulation structure
10/14/2009CN100550429C MEMS device having contact and standoff bumps and related methods
10/14/2009CN100550421C 半导体装置 Semiconductor device
10/14/2009CN100550411C Display apparatus
10/14/2009CN100550409C Phase change memory with diode unit selective connection and its making method
10/14/2009CN100550403C Metal connection structure for CMOS image sensor integrated circuit and its making method
10/14/2009CN100550402C Electronic package for image sensor, and the packaging method thereof
10/14/2009CN100550401C Encapsulation structure for display devices
10/14/2009CN100550400C Active elements array substrates and manufacturing method therefor
10/14/2009CN100550398C Semiconductor device and manufacturing method thereof
10/14/2009CN100550397C Active matrix TFT array substrate and method of manufacturing the same
10/14/2009CN100550393C A multi-bit programmable non-volatile memory unit, array and the corresponding manufacturing method
10/14/2009CN100550392C Nonvolatile semiconductor memory device and manufacturing method thereof
10/14/2009CN100550385C Method and structure for self-aligned device contacts
10/14/2009CN100550380C Esd protection circuit and semiconductor structure
10/14/2009CN100550379C Semiconductor apparatus using back-side high-withstand-voltage integrated circuit
10/14/2009CN100550378C Image sensor and fabricating method thereof
10/14/2009CN100550377C Single package containing multiple integrated circuit devices
10/14/2009CN100550376C Semiconductor device and fabricating method thereof
10/14/2009CN100550374C LED packaging structure and packaging method
10/14/2009CN100550373C Multichip packaging structure and its production method
10/14/2009CN100550371C 可堆叠式半导体封装结构 Stackable semiconductor package structure
10/14/2009CN100550370C Plane structure of LED illuminating device
10/14/2009CN100550369C Array capacitors with voids to enable a full-grid socket
10/14/2009CN100550368C Silicium control rectifier protecting electro-static discharge
10/14/2009CN100550367C Electronic device
10/14/2009CN100550366C Semiconductor chip
10/14/2009CN100550365C Electronic device and carrier substrate for same
10/14/2009CN100550364C Encapsulation structure and its encapsulation base plate
10/14/2009CN100550363C Terminal pad and solder junction structure, semiconductor device having the junction structure, and method of manufacturing the semiconductor device
10/14/2009CN100550362C A crystal wafer chip dimension encapsulation line and its making method
10/14/2009CN100550361C Packaging for high speed integrated circuits
10/14/2009CN100550360C Apparatus, system and manufacture method with bottom heat spreader
10/14/2009CN100550359C Thermal interconnect system and method of production thereof
10/14/2009CN100550358C Power conversion device and heat-conducting pipe used therein
10/14/2009CN100550357C Power conversion device and heat-conducting pipe used therein
10/14/2009CN100550356C Socket, system and method for coupling integrated circuit package to substrate
10/14/2009CN100550355C Substrate for mounting semiconductor chip and manufacturing method and semiconductor module
10/14/2009CN100550354C Enhanced encapsulation structure and its reinforced part
10/14/2009CN100550352C A stacked non-volatile memory device and methods for fabricating the same
10/14/2009CN100550347C Semiconductor device and method for manufacturing the same
10/14/2009CN100550346C Multi-metal intra-connection structure with optical shielding property and its production method
10/14/2009CN100550331C Spiral contactor manufacturing method
10/14/2009CN100550327C A common ball-limiting metallurgy for i/o site and its forming method
10/14/2009CN100550325C A thin film transistor and its making method
10/14/2009CN100550302C III nitride semi-conductor material and growing method thereof
10/14/2009CN100550186C Storage system
10/14/2009CN100549682C Measuring system and screening method for thermal conductivity assembly heat conductivity
10/14/2009CN100549515C Integral cooling system and LED illumination device with the same
10/13/2009US7602609 Cooling system and method of use
10/13/2009US7602071 Apparatus for dividing an adhesive film mounted on a wafer
10/13/2009US7602070 Room temperature metal direct bonding
10/13/2009US7602069 Micro electronic component with electrically accessible metallic clusters
10/13/2009US7602068 Dual-damascene process to fabricate thick wire structure
10/13/2009US7602066 Method of filling structures for forming via-first dual damascene interconnects
10/13/2009US7602065 Seal ring in semiconductor device
10/13/2009US7602064 Semiconductor device having an inspection hole striding a boundary
10/13/2009US7602063 Semiconductor device and manufacturing method therefor
10/13/2009US7602061 Semiconductor device and method for manufacturing semiconductor device
10/13/2009US7602060 Heat spreader in a flip chip package
10/13/2009US7602059 Lead pin, circuit, semiconductor device, and method of forming lead pin
10/13/2009US7602058 Flip-chip semiconductor device with improved power pad arrangement
10/13/2009US7602057 Signal light using phosphor coated LEDs
10/13/2009US7602056 On-die termination method for multi-chip packages
10/13/2009US7602055 Semiconductor device and method for fabricating the same
10/13/2009US7602054 Method of forming a molded array package device having an exposed tab and structure
10/13/2009US7602053 Leadframe of a leadless flip-chip package and method for manufacturing the same
10/13/2009US7602052 Semiconductor device
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