Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/21/2009CN101561128A Super-power direct-cooling radiator for semiconductor lighting source substrate
10/21/2009CN101561126A Lighting device
10/21/2009CN101561090A LED lamp module with heat dissipating device
10/21/2009CN100553421C Heat radiator
10/21/2009CN100553413C Ceramic multilayer substrate
10/21/2009CN100553408C Substrate with embedded element and manufacturing method thereof
10/21/2009CN100553032C Transmission line pair
10/21/2009CN100553013C Organic electroluminescence device
10/21/2009CN100552998C LCD back light source
10/21/2009CN100552992C Technology for package of high power luminous element
10/21/2009CN100552990C LED module group
10/21/2009CN100552969C Organic light-emitting display device electrode substrate
10/21/2009CN100552967C AC illuminating body and AC illuminating device
10/21/2009CN100552963C Integrated circuit package body and manufacturing method thereof
10/21/2009CN100552952C Temperature detecting method, temperature detecting circuit and semiconductor device
10/21/2009CN100552949C Regulator circuit and semiconductor device therewith
10/21/2009CN100552948C Semiconductor chip mounting structure and method for manufacturing same
10/21/2009CN100552947C Electronic circuit device of power control system
10/21/2009CN100552946C Electronic packaging structure
10/21/2009CN100552945C White light LED packaging structure with silica substrate and its production method
10/21/2009CN100552944C Illuminating device
10/21/2009CN100552943C Stacked integrated circuit chip and packaging
10/21/2009CN100552942C Connecting module structure with passive element and its manufacturing method
10/21/2009CN100552941C Image sensing module
10/21/2009CN100552940C Lap connected structure of semiconductor component-buried loading board
10/21/2009CN100552939C Electrostatic discharge protection device and manufacturing method thereof
10/21/2009CN100552938C Operation method of fuse structure
10/21/2009CN100552937C Semiconductor device and memory card using the same
10/21/2009CN100552936C Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
10/21/2009CN100552935C Substrates bar, substrate structure and manufacturing method thereof
10/21/2009CN100552934C Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
10/21/2009CN100552933C Packaging structure and conducting wire rack thereof
10/21/2009CN100552932C Packaging structure capable of connecting output / input module
10/21/2009CN100552931C Chip encapsulation structure
10/21/2009CN100552930C Packaging for high speed integrated circuits
10/21/2009CN100552929C Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus and wiring substrate
10/21/2009CN100552928C Semiconductor chip and method for forming edge sealing structure on integrated circuit chip
10/21/2009CN100552927C Flip chip packaging structure with girth member and packaging method thereof
10/21/2009CN100552926C Semiconductor device, wiring board and manufacturing method thereof
10/21/2009CN100552925C Pixel structure and manufacturing method therefor
10/21/2009CN100552907C LED chip packaging structure with thick guide feet and manufacturing method thereof
10/21/2009CN100552906C Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure
10/21/2009CN100552890C Electronic structure and method for forming medium film
10/21/2009CN100552542C Patterning layers comprised of spin-on ceramic films
10/21/2009CN100552516C Electronic device with fan-out block possessing homogeneous impedance
10/21/2009CN100552365C Heat pipe
10/21/2009CN100552287C High power semiconductor lighting lamp
10/21/2009CN100551968C Epoxy resin composition for semiconductor encapsulation and semiconductor device
10/20/2009US7606048 Integrated circuit stacking system
10/20/2009US7606046 Semiconductor device and method for mitigating electrostatic discharge (ESD)
10/20/2009US7606036 Heat dissipation device
10/20/2009US7606031 Heat dissipating device
10/20/2009US7606030 Heat dissipation device
10/20/2009US7605962 Video processor alignment clamping
10/20/2009US7605597 Intra-chip power and test signal generation for use with test structures on wafers
10/20/2009US7605581 Apparatus and method for controlling die force in a semiconductor device testing assembly
10/20/2009US7605525 Plasma display panel assembly having a short circuit preventive unit
10/20/2009US7605481 Nickel alloy sputtering target and nickel alloy thin film
10/20/2009US7605480 Flip chip interconnection pad layout
10/20/2009US7605479 Stacked chip assembly with encapsulant layer
10/20/2009US7605478 Semiconductor package and method of manufacturing the same
10/20/2009US7605477 Stacked integrated circuit assembly
10/20/2009US7605476 Stacked die semiconductor package
10/20/2009US7605475 Semiconductor device
10/20/2009US7605474 Structure of polymer-matrix conductive film and method for fabricating the same
10/20/2009US7605472 Interconnections having double capping layer and method for forming the same
10/20/2009US7605471 Semiconductor devices and methods for manufacturing the same
10/20/2009US7605470 Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices
10/20/2009US7605469 Atomic layer deposited tantalum containing adhesion layer
10/20/2009US7605468 Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
10/20/2009US7605467 Package and electronic apparatus using the same
10/20/2009US7605466 Sealed wafer packaging of microelectromechanical systems
10/20/2009US7605465 Semiconductor device for high frequency power amplification
10/20/2009US7605464 Semiconductor device
10/20/2009US7605463 Interposer and method for producing the same and electronic device
10/20/2009US7605462 Universal substrate for a semiconductor device having selectively activated fuses
10/20/2009US7605461 Chip package structure
10/20/2009US7605460 Method and apparatus for a power distribution system
10/20/2009US7605459 Coreless substrate and manufacturing thereof
10/20/2009US7605458 Method and apparatus for integrating capacitors in stacked integrated circuits
10/20/2009US7605457 Semiconductor device and method of manufacturing the same
10/20/2009US7605455 Semiconductor device
10/20/2009US7605454 Memory card and method for devising
10/20/2009US7605453 Chip module and chip card
10/20/2009US7605452 Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
10/20/2009US7605451 RF power transistor having an encapsulated chip package
10/20/2009US7605450 High frequency arrangement
10/20/2009US7605446 Bipolar high voltage/power semiconductor device having first and second insulated gated and method of operation
10/20/2009US7605431 Electrostatic discharge protection apparatus for semiconductor devices
10/20/2009US7605428 High-voltage depletion mode MOSFET
10/20/2009US7605402 Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
10/20/2009US7605213 flame resistance, good fluidity and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant; halogen-free
10/20/2009US7605085 Method of manufacturing interconnecting structure with vias
10/20/2009US7605056 Method of manufacturing a semiconductor device including separation by physical force
10/20/2009US7605022 Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
10/20/2009US7605021 Manufacturing method of electronic device
10/20/2009US7605020 Semiconductor chip package
10/20/2009US7604868 Interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; superior low temperature rapid curability and a long pot life
10/20/2009US7604835 Resist pattern for metalization; catalyst on substrate exposed to vacuum ultraviolet radiation to break carbon to carbon double bonds; washed with surfactant to clean surface before metalization
10/20/2009US7604727 Electroplating method for a semiconductor device
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