Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/22/2009US20090261461 Semiconductor package with lead intrusions
10/22/2009US20090261460 Wafer Level Integration Package
10/22/2009US20090261459 Semiconductor device having a floating body with increased size and method for manufacturing the same
10/22/2009US20090261458 Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode
10/22/2009US20090261455 Method for the production of a component structure
10/22/2009US20090261450 Electrical Fuse Structure and Method
10/22/2009US20090261448 Method of forming shallow trench isolation structures for integrated circuits
10/22/2009US20090261432 Interconnection system on a plane adjacent to a solid-state device structure
10/22/2009US20090261402 Method and structure for a semiconductor charge storage device
10/22/2009US20090261356 Sub-Mount, light emitting diode package and manufacturing method thereof
10/22/2009US20090261343 High-density nonvolatile memory and methods of making the same
10/22/2009US20090261326 Die testing using top surface test pads
10/22/2009US20090261173 Securities, chip mounting product, and manufacturing method thereof
10/22/2009US20090260137 Safety suit
10/22/2009DE10334433B4 Vorrichtung zur Unterbrechung des Stromflusses zu einem oder von einem Halbleiterkörper eines Halbleiterbauelements A device for interrupting the current flow to or from a semiconductor body of a semiconductor device
10/22/2009DE102008026765A1 Mikrowellen-Baugruppe Microwave assembly
10/22/2009DE102008018841A1 Verfahren zur Herstellung und Aufbau eines Leistungsmoduls Process for the preparation and structure of a power module
10/22/2009CA2720972A1 Carbon fiber carbon composite molded body, carbon fiber-reinforced carbon composite material and manufacturing method thereof
10/22/2009CA2719703A1 Wireless information carrier
10/21/2009EP2110956A2 Single-chip wireless transceiver
10/21/2009EP2110852A2 Method and system for mitigating risk of electrostatic discharge for a system on chip (SoC)
10/21/2009EP2110851A1 Film for sealing and semiconductor device using the same
10/21/2009EP2110850A2 Device for the mutual contacting of two wafers
10/21/2009EP2110849A2 Interconnect Structure Including Hybrid Frame Panel
10/21/2009EP2110848A1 Modifier for low dielectric constant film, and method for production thereof
10/21/2009EP2110401A1 Addition-curable silicone composition and cured product thereof
10/21/2009EP2109889A2 Sensing circuit for devices with protective coating
10/21/2009EP2109888A2 A system-in-package with through substrate via holes
10/21/2009EP2109887A1 Heat transport assembly
10/21/2009EP2109885A2 Compression clamping of semiconductor components
10/21/2009EP1966825B1 Process for the collective fabrication of 3d electronic modules
10/21/2009EP1665375B1 Solvent-modified resin compositions and methods of use thereof
10/21/2009EP1309998B1 Method for electrically connecting a semiconductor component to an electrical subassembly
10/21/2009EP0997935B1 Printed wiring board
10/21/2009CN201332514Y Full air-cooling IGBT induction heating equipment
10/21/2009CN201332106Y LED welding radiating device
10/21/2009CN201332098Y ESD protecting circuit of depletion type pHEMT chips
10/21/2009CN201332097Y 25 integration high-efficient LED support
10/21/2009CN201332096Y Colorful piranha LED
10/21/2009CN201332095Y Elliptical LED with double lighting effect
10/21/2009CN201332094Y Sub warhead LED with triple lighting effect
10/21/2009CN201332093Y Circuit baseboard and circuit board module
10/21/2009CN201332092Y IGBT module open type water-filled radiator
10/21/2009CN201331036Y High power LED heat radiating device
10/21/2009CN201331035Y High-power luminous LED illumination device based on semiconductor refrigeration heat radiation
10/21/2009CN201331033Y Radiating module structure of LED lamp
10/21/2009CN201330976Y LED road lamp
10/21/2009CN201330954Y Combined polar cooling high-power LED electronic lamp
10/21/2009CN101563777A Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon
10/21/2009CN101563776A Lead frame fixing material, lead frame and semiconductor device
10/21/2009CN101563775A Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same
10/21/2009CN101563774A IC chip mounting package and process for manufacturing the same
10/21/2009CN101563773A Method for incorporating existing silicon die into 3D integrated stack
10/21/2009CN101563765A Electronic, in particular microelectronic, functional group and method for its production
10/21/2009CN101563425A Curable silicone composition and electronic component
10/21/2009CN101562964A Heat-conducting medium protecting cover and heating abstractor with the protecting cover
10/21/2009CN101562963A Heat radiation device
10/21/2009CN101562962A Heat dissipating device
10/21/2009CN101562960A Heat dissipating device combination and fastener thereof
10/21/2009CN101562334A Power supply control circuit for electro-static discharge (ESD) protection
10/21/2009CN101562193A Organic electroluminescence apparatus
10/21/2009CN101562191A Photoelectric packaging part with cavity and production method thereof
10/21/2009CN101562190A Semiconductor apparatus and fabrication method of the same
10/21/2009CN101562188A Resistance structure for improving silicon-on-insulator (SOI) circuit ESD protection network
10/21/2009CN101562187A Silicon-on-insulator (SOI) circuit ESD global protecting structure
10/21/2009CN101562186A Pixel structure and repair method thereof
10/21/2009CN101562185A Film transistor array base plate
10/21/2009CN101562180A Integrated circuit structure
10/21/2009CN101562178A 半导体发光装置 The semiconductor light emitting device
10/21/2009CN101562177A Semiconductor device, and energy transmission device using the same
10/21/2009CN101562176A A device of a chip module comprising a frequency enlarging device and a method
10/21/2009CN101562174A LED chip encapsulating structure for backlight module and preparing method thereof
10/21/2009CN101562173A Novel wafer fixing structure
10/21/2009CN101562172A Semiconductor device
10/21/2009CN101562171A Integrated circuit module and display device comprising same
10/21/2009CN101562170A Suspension board with circuit and production method thereof
10/21/2009CN101562169A Lamination type base plate and chip packaging structure using same
10/21/2009CN101562168A Multiple-crystal grain modularized encapsulation structure and encapsulation method thereof
10/21/2009CN101562167A Device for solving coplanarity of large-scale integrated circuit lead frames
10/21/2009CN101562166A Semiconductor device and power supply unit utilizing the same
10/21/2009CN101562165A Semiconductor device
10/21/2009CN101562164A Light emitting diode seat body and forming method thereof
10/21/2009CN101562163A Semiconductor encapsulation structure by taking lead frame as substrate and applicable lead frame thereof
10/21/2009CN101562162A Pad structure of panel display device
10/21/2009CN101562161A Conductive structure of chip
10/21/2009CN101562160A IC card packaging part and production method thereof
10/21/2009CN101562159A Semiconductor device and manufacturing method thereof
10/21/2009CN101562158A Heat removal system for high-power semiconductor device
10/21/2009CN101562157A Chip encapsulation structure and support device thereof
10/21/2009CN101562156A Gallium nitride semiconductor element and light emitting diode
10/21/2009CN101562149A Panel, liquid crystal display and formation method of panel
10/21/2009CN101562144A Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
10/21/2009CN101562143A Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
10/21/2009CN101562140A Packaging method of improving antistatic capability of integrated circuit chip
10/21/2009CN101562128A Nitride semiconductor substrate and processing method thereof
10/21/2009CN101561994A Semiconductor device, display device and electronic device
10/21/2009CN101561609A Active array substrate, liquid crystal display panel and method for manufacturing active array substrate
10/21/2009CN101561608A Liquid crystal display device
10/21/2009CN101561130A LED lamp radiator with improved structure
10/21/2009CN101561129A Lamp provided with phase change radiator structure and LED
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