Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/28/2009CN100555583C Semiconductor device and fabrication process thereof
10/28/2009CN100555366C Active matrix substrate, display, television set, method for producing active matrix substrate, and method for manufacturing display
10/28/2009CN100555049C Liquid crystal display and method for fabricating the same
10/28/2009CN100555047C Liquid crystal display device and method of fabricating the same
10/28/2009CN100554305C Encapsulant mixture having a polymer bound catalyst
10/28/2009CN100554138C Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
10/27/2009US7609523 Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
10/27/2009US7609522 Heat sink assembly
10/27/2009US7609520 Heat spreader with vapor chamber defined therein
10/27/2009US7609501 Manufacture including shield structure
10/27/2009US7609500 Universal energy conditioning interposer with circuit architecture
10/27/2009US7608932 Deterministic generation of an integrated circuit identification number
10/27/2009US7608931 Interconnect array formed at least in part with repeated application of an interconnect pattern
10/27/2009US7608929 Electrical connector structure of circuit board and method for fabricating the same
10/27/2009US7608928 Laminated body and semiconductor device
10/27/2009US7608927 Localized biasing for silicon on insulator structures
10/27/2009US7608926 Nonvolatile semiconductor memory device
10/27/2009US7608925 Relay board with bonding pads connected by wirings
10/27/2009US7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages
10/27/2009US7608923 Electronic device with flexible heat spreader
10/27/2009US7608922 Semiconductor device including amplifier and frequency converter
10/27/2009US7608921 Multi-layer semiconductor package
10/27/2009US7608920 Memory card and method for devising
10/27/2009US7608919 Interconnect packaging systems
10/27/2009US7608918 Semiconductor device
10/27/2009US7608917 Power semiconductor module
10/27/2009US7608916 Aluminum leadframes for semiconductor QFN/SON devices
10/27/2009US7608915 Heat dissipation semiconductor package
10/27/2009US7608914 Integrated circuit package with electrically isolated leads
10/27/2009US7608913 Noise isolation between circuit blocks in an integrated circuit chip
10/27/2009US7608912 Technique for creating different mechanical strain in different CPU regions by forming an etch stop layer having differently modified intrinsic stress
10/27/2009US7608911 Semiconductor device package having a semiconductor element with a roughened surface
10/27/2009US7608910 Semiconductor ESD device and methods of protecting a semiconductor device
10/27/2009US7608909 Suspended transmission line structures in back end of line processing
10/27/2009US7608904 Semiconductor device components with conductive vias and systems including the components
10/27/2009US7608896 Semiconductor device
10/27/2009US7608894 Electrostatic discharge protection device
10/27/2009US7608893 Multi-channel transistor structure and method of making thereof
10/27/2009US7608863 Submount assembly and method of preparing optical module
10/27/2009US7608855 Polymer dielectrics for memory element array interconnect
10/27/2009US7608789 Component arrangement provided with a carrier substrate
10/27/2009US7608533 Semiconductor die attachment for high vacuum tubes
10/27/2009US7608494 Thin film transistor array panel and a method for manufacturing the same
10/27/2009US7608487 B-stageable underfill encapsulant and method for its application
10/27/2009US7608486 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
10/27/2009US7608485 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
10/27/2009US7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
10/27/2009US7608326 Thermally conductive EMI shield
10/27/2009US7608315 Insulator with high thermal conductivity and method for producing the same
10/27/2009US7607560 Semiconductor die attachment for high vacuum tubes
10/27/2009US7607470 Synthetic jet heat pipe thermal management system
10/27/2009CA2372172C Lead frame moisture barrier for molded plastic electronic packages
10/22/2009WO2009129334A2 Three-dimensional semiconductor device structures and methods
10/22/2009WO2009129237A1 Thermal interface material delivery system
10/22/2009WO2009129198A1 Wafer level csp sensor
10/22/2009WO2009128855A1 Getter formed by laser-treatment and methods of making same
10/22/2009WO2009128592A1 Esd protective device possible low capacitance and stability special quality and thereof.
10/22/2009WO2009128462A1 Method of manufacturing a heat exchanger
10/22/2009WO2009128424A1 Thin film transistor type substrate, thin film transistor type liquid crystal display device and method for manufacturing thin film transistor type substrate
10/22/2009WO2009128372A1 Thin film transistor and method for manufacturing thin film transistor
10/22/2009WO2009128354A1 Light-emitting diode package
10/22/2009WO2009128337A1 Semiconductor device and method for manufacturing the same
10/22/2009WO2009128215A1 Carbon fiber carbon composite molded body, carbon fiber-reinforced carbon composite material and manufacturing method thereof
10/22/2009WO2009128035A1 High frequency field-effect transistor
10/22/2009WO2009127914A1 Method of sealing an air gap in a layer of a semiconductor structure and semiconductor structure
10/22/2009WO2009127780A1 Wiring board and method for manufacturing the same
10/22/2009WO2009127300A1 Microwave assembly
10/22/2009WO2009127246A1 Wireless information carrier
10/22/2009WO2009108300A3 Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards
10/22/2009WO2009105449A3 Flat leadless packages and stacked leadless package assemblies
10/22/2009WO2009086294A3 Leadframe receiver package for solar concentrator
10/22/2009US20090263986 Spring interconnect structures
10/22/2009US20090263964 Interconnections for integrated circuits
10/22/2009US20090263943 Method of fabricating semiconductor integrated circuit device
10/22/2009US20090263939 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
10/22/2009US20090263214 Fixture for p-through silicon via assembly
10/22/2009US20090261820 Wafer for electrically characterizing tunnel junction film stacks with little or no processing
10/22/2009US20090261535 Device and method for hermetically sealing a cavity in an electronic component
10/22/2009US20090261484 Liquid resin composition, semi-conductor device, and process of fabricating the same
10/22/2009US20090261483 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
10/22/2009US20090261482 Semiconductor package and method of making same
10/22/2009US20090261481 Wafer level package and method of fabricating the same
10/22/2009US20090261480 Integrated circuit and method of fabricating the same
10/22/2009US20090261479 Methods for pitch reduction
10/22/2009US20090261478 Semiconductor device and method for manufacturing the same
10/22/2009US20090261477 Semiconductor device and method of manufacturing the same
10/22/2009US20090261476 Semiconductor device and manufacturing method thereof
10/22/2009US20090261475 Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device
10/22/2009US20090261474 Wafer level package having a stress relief spacer and manufacturing method thereof
10/22/2009US20090261473 Low fabrication cost, fine pitch and high reliability solder bump
10/22/2009US20090261472 Power Semiconductor Module with Pressure Element and Method for Fabricating a Power Semiconductor Module with a Pressure Element
10/22/2009US20090261471 Rf power transistor package
10/22/2009US20090261470 Chip package
10/22/2009US20090261469 Semiconductor package and method for manufacturing the same
10/22/2009US20090261468 Semiconductor module
10/22/2009US20090261467 Semiconductor device
10/22/2009US20090261465 Semiconductor device and its manufacturing method
10/22/2009US20090261464 Getter Formed By Laser-Treatment and Methods of Making Same
10/22/2009US20090261463 Chip mounting device and chip package array
10/22/2009US20090261462 Semiconductor package with stacked die assembly
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