Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/28/2009CN101568246A Fixing piece and heat dissipating device using same
10/28/2009CN101568226A Multi-layer flexible printed circuit board and method of manufacturing the same
10/28/2009CN101567383A Ohmic electrode structure for silicon carbide and manufacturing method thereof
10/28/2009CN101567381A Organic electroluminescent device and electronic apparatus
10/28/2009CN101567378A Solid-state image pickup device and making method thereof
10/28/2009CN101567376A Method and apparatus for reducing optical crosstalk in CMOS image sensors
10/28/2009CN101567370A Coupling capacitance forming circuit, integrated circuit using same and correlative method thereof
10/28/2009CN101567369A Semiconductor element with auxiliary patterns and manufacture method thereof
10/28/2009CN101567368A Wafer circuit protection structure and manufacturing method thereof
10/28/2009CN101567367A Semiconductor device
10/28/2009CN101567365A Light-emitting chip packaging structure with high-efficiency radiating substrate and method for packaging light-emitting chip
10/28/2009CN101567364A Multichip package structure capable of arranging chips on pins
10/28/2009CN101567363A Ballast resistor of bipolar junction transistor emitter
10/28/2009CN101567362A Integrated circuit packages, semiconductor devices and testing methods thereof
10/28/2009CN101567361A Wafer alignment mark
10/28/2009CN101567360A Electrical fuse structure and method
10/28/2009CN101567359A Semiconductor device
10/28/2009CN101567358A Power bus
10/28/2009CN101567357A Electronic device provided with wiring board, and wiring board for such electronic device
10/28/2009CN101567356A Circuit board structure and manufacture method thereof
10/28/2009CN101567355A Semiconductor packaging base plate and manufacturing method thereof
10/28/2009CN101567354A Semiconductor packaging structure
10/28/2009CN101567353A Ball grid array base plate and manufacturing method thereof
10/28/2009CN101567352A Window-shaped ball grid array package base plate
10/28/2009CN101567351A Miniature radio frequency module and packaging method thereof
10/28/2009CN101567350A Semiconductor device
10/28/2009CN101567349A Flip-chip assembly and manufacture method thereof
10/28/2009CN101567348A Wafer structure with convex lumps and forming method thereof
10/28/2009CN101567347A Circuit board and method for jointing circuit board
10/28/2009CN101567346A Semiconductor package having chip selection through electrodes and stacked semiconductor package having same
10/28/2009CN101567345A Through-electrode, circuit board, semiconductor package and stacked semiconductor package
10/28/2009CN101567344A Semiconductor chip encapsulating structure capable of reaching front-surface electric conduction and preparing method thereof
10/28/2009CN101567343A Cooling plate structure for flip-chip packaging and manufacturing method thereof
10/28/2009CN101567342A Soaking plate heat dissipating device
10/28/2009CN101567341A Soaking plate heat dissipating device
10/28/2009CN101567340A Semiconductor chip protection film
10/28/2009CN101567334A Method to fabricate an ESD resistant tunneling magnetoresistive read transducer
10/28/2009CN101567333A Image sensor and encapsulating method thereof
10/28/2009CN101567326A Printed circuit board and method for forming same
10/28/2009CN101567322A Encapsulating structure and encapsulating method of chip
10/28/2009CN101567302A Alignment mark, forming method thereof and alignment method of semiconductor
10/28/2009CN101566772A Active component array substrate
10/28/2009CN101566767A Liquid crystal display panel
10/28/2009CN101566513A Pressure sensor module and electronic component
10/28/2009CN101566442A Serial-parallel type multi-evaporator loop heat pipe
10/28/2009CN101566332A Heat dissipation device and lighting equipment
10/28/2009CN101566331A Pulse thermal fin plate type radiator
10/28/2009CN101566330A Integrated led daylight lamp
10/28/2009CN101566329A Method for applying ultravacuum heat sink to modular high-power LED street lamp
10/28/2009CN101566328A Light emitting diode (LED) lighting module and light emitting diode (LED) lighting device
10/28/2009CN101566327A Street lamp and light-emitting diode lamp thereof
10/28/2009CN101566326A Illuminating device and light engine thereof
10/28/2009CN101566325A Light-emitting diode lamp
10/28/2009CN101566316A Light-emitting diode lamp
10/28/2009CN101566301A Vehicle lamp
10/28/2009CN101566299A LED automobile anti-fog lamp
10/28/2009CN101566291A Led路灯灯体 Led street light lamp body
10/28/2009CN101566284A LED lamp tube
10/28/2009CN101566281A LED fixture with heat-dissipating structure
10/28/2009CN101565600A Low-hardness high-flexibility double-component condensed type organic silicon potting adhesive composition
10/28/2009CN100556264C A graphite-metal compound heat dispersion base material making technology
10/28/2009CN100556263C Heat dissipating device
10/28/2009CN100556262C Heat radiation model set
10/28/2009CN100556260C Cooling system and method
10/28/2009CN100556233C Method for manufacturing an electronic module and an electronic module
10/28/2009CN100556229C Transmission line and wiring forming method
10/28/2009CN100555688C Surface mounting light emitting diode device
10/28/2009CN100555683C Nitride semiconductor device
10/28/2009CN100555664C Power type segregator metal oxide semiconductor fieldistor
10/28/2009CN100555653C Programmable resistive RAM and manufacturing method
10/28/2009CN100555646C Slight image chip packaging structure
10/28/2009CN100555641C TFT array substrate and manufacturing method thereof, and display device using such substrate
10/28/2009CN100555634C Semiconductor device
10/28/2009CN100555629C LED encapsulation structure
10/28/2009CN100555628C Semiconductor encapsulation structure with electromagnetic shielding function
10/28/2009CN100555627C Power semiconductor module
10/28/2009CN100555626C Semiconductor device, related method and printed circuit board
10/28/2009CN100555625C Image sensor module, method of manufacturing the same, and camera module using the same
10/28/2009CN100555623C Integrated circuit package with improved power signal connection
10/28/2009CN100555622C Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
10/28/2009CN100555621C Semiconductor device and method for manufacturing the same
10/28/2009CN100555620C Interconnect structures with engineered dielectrics with nanocolumnar porosity and its manufacture method
10/28/2009CN100555619C Substrate surface processing structure and method for production thereof
10/28/2009CN100555618C semiconductor chip packages comprising mounting structure and its electronic assembly and attachment method
10/28/2009CN100555617C Drive chip for LED
10/28/2009CN100555616C Electronic component, semiconductor device employing same, and method for manufacturing electronic component
10/28/2009CN100555615C Semiconductor package substrate structure and encapsulation method thereof
10/28/2009CN100555614C Tape automated bonding (TAB) package device and method for bonding the device on the glass panel
10/28/2009CN100555613C Selectively grooved cold plate for electronics cooling
10/28/2009CN100555612C Heat exchange apparatus with parallel flow
10/28/2009CN100555611C Method for producing heat radiator
10/28/2009CN100555610C Radiating apparatus
10/28/2009CN100555609C 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof
10/28/2009CN100555608C Semiconductor device and substrate for producing semiconductor device and production methods therefor
10/28/2009CN100555607C Semiconductor device and its making method and used jointing material and its making method
10/28/2009CN100555604C Display device module and method for manufacturing the same
10/28/2009CN100555598C Buried metal double mosaic board capacitor
10/28/2009CN100555593C Method for forming soldering projection
10/28/2009CN100555592C Chip package structure and its making method
10/28/2009CN100555590C Electronic device manufacturing method
1 ... 715 716 717 718 719 720 721 722 723 724 725 726 727 728 729 730 731 732 733 734 735 ... 2262