Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/29/2009US20090269892 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
10/29/2009US20090269862 Alignment method of chips
10/29/2009US20090268498 Semiconductor memory device and method of performing data reduction test
10/29/2009US20090268147 Chip having a driving integrated circuit and liquid crystal display having the same
10/29/2009US20090267485 Phosphor and Manufacturing Method Therefore, and Light Emission Device Using the Phosphor
10/29/2009US20090267241 Substrate with Check Mark and Method of Inspecting Position Accuracy of Conductive Glue Dispensed on the Substrate
10/29/2009US20090267240 Method of manufacturing an overlay mark
10/29/2009US20090267239 Positive photosensitive resin composition
10/29/2009US20090267238 Bridges for interconnecting interposers in multi-chip integrated circuits
10/29/2009US20090267237 Method for manufacturing a semiconductor device
10/29/2009US20090267236 Through-Hole Via on Saw Streets
10/29/2009US20090267235 Reduced Inductance Interconnect for Enhanced Microwave and Millimeter-Wave Systems
10/29/2009US20090267234 Semiconductor Device and Method of Manufacturing a Semiconductor Device
10/29/2009US20090267233 Bonded semiconductor structure and method of making the same
10/29/2009US20090267232 Method of manufacturing an integrated circuit
10/29/2009US20090267231 Method of forming a semiconductor device having an etch stop layer and related device
10/29/2009US20090267230 Package structure for integrated circuit device and method of the same
10/29/2009US20090267229 Chip package structure
10/29/2009US20090267228 Intermetallic diffusion block device and method of manufacture
10/29/2009US20090267227 Plastic ball grid array ruggedization
10/29/2009US20090267226 High-contrast laser mark on substrate surfaces
10/29/2009US20090267225 Semiconductor device and method for manufacturing the same
10/29/2009US20090267224 Circuit device including rotated stacked die
10/29/2009US20090267223 MEMS Package Having Formed Metal Lid
10/29/2009US20090267222 Low Voltage Drop and High Thermal Performance Ball Grid Array Package
10/29/2009US20090267221 Semiconductor device
10/29/2009US20090267220 3-d stacking of active devices over passive devices
10/29/2009US20090267219 Ultra-thin chip packaging
10/29/2009US20090267218 Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area
10/29/2009US20090267217 Semiconductor device
10/29/2009US20090267216 Inkjet printed leadframes
10/29/2009US20090267215 Power module substrate, method for manufacturing power module substrate, and power module
10/29/2009US20090267214 Electronic circuit device and method for manufacturing same
10/29/2009US20090267213 Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
10/29/2009US20090267212 Semiconductor Device
10/29/2009US20090267211 Wafer level package and method of fabricating the same
10/29/2009US20090267210 Integrated circuit package and manufacturing method thereof
10/29/2009US20090267209 Semiconductor device
10/29/2009US20090267208 Semiconductor package having chip selection through electrodes and stacked semiconductor package having the same
10/29/2009US20090267207 Semiconductor device and manufacturing method thereof
10/29/2009US20090267206 Stacked semiconductor package
10/29/2009US20090267205 Zero-reflow TSOP stacking
10/29/2009US20090267204 Edge seal for a semiconductor device and method therefor
10/29/2009US20090267203 Multi-chip package for reducing test time
10/29/2009US20090267202 Semiconductor package
10/29/2009US20090267201 Vertical Transmission Structure
10/29/2009US20090267199 Isolation layer having a bilayer structure for a semiconductor device and method for forming the same
10/29/2009US20090267197 Semiconductor device for preventing the leaning of storage nodes and method for manufacturing the same
10/29/2009US20090267194 Semiconductor chip having tsv (through silicon via) and stacked assembly including the chips
10/29/2009US20090267193 Semiconductor device and method for manufacturing the same
10/29/2009US20090267181 Semiconductor device and manufacturing method thereof
10/29/2009US20090267180 Semiconductor device having a reduced fuse thickness and method for manufacturing the same
10/29/2009US20090267179 System for power performance optimization of multicore processor chip
10/29/2009US20090267172 Method of manufacturing an image sensing micromodule
10/29/2009US20090267171 Pre-encapsulated cavity interposer
10/29/2009US20090267160 Semiconductor device and method for manufacturing the same
10/29/2009US20090267154 Mos comprising substrate potential elevating circuitry for esd protection
10/29/2009US20090267083 Trenched substrate for crystal growth and wafer bonding
10/29/2009US20090266593 Surface-mountable electronic device
10/29/2009US20090266588 Multilayer printed wiring board
10/29/2009DE112007003169T5 Mikroelektronischer Chip mit Lötabdeckungen auf Verbindungsstellen und Verfahren zum Herstellen desselben The same microelectronic chip with Lötabdeckungen on joints and method of making
10/29/2009DE112007000161B4 Multifinger-FET für Hochfrequenz Multi-finger FET for High Frequency
10/29/2009DE10259707B4 Magnetowiderstands-Sensorvorrichtung und Verwendung in einem Fahrzeug Magnetoresistive sensor device and use in a vehicle
10/29/2009DE102009015722A1 Halbleitermodul Semiconductor module
10/29/2009DE102009012522A1 Halbleiteranordnung und Herstellungsverfahren A semiconductor device and manufacturing method
10/29/2009DE102008030110A1 Heat sink for semiconductor device, has fin sections integrated into single piece and connecting side plates with each other, and plate made up of carbon and graphite ram material and included in opening that is limited by side plates
10/29/2009DE102008026627B3 Kühlsystem für LED-Chip-Anordnung Cooling system for LED chip array
10/29/2009DE102008024704A1 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils The optoelectronic device and method for producing an optoelectronic component
10/29/2009DE102008019238A1 Integrated circuit, has protection element, where amounts of discharge current pulses of polarities discharged via protection and semiconductor element are larger/smaller than amounts discharged via other semiconductor element, respectively
10/29/2009DE102008001414A1 Substrat-Schaltungsmodul mit Bauteilen in mehreren Kontaktierungsebenen Substrate circuit module with components in several contact-making
10/29/2009DE102008001413A1 Elektrische Leistungseinheit Electric power unit
10/29/2009DE102006053982B4 Three dimensional carrier structure i.e. molded interconnect device, for electronic or optoelectronic assembly, has metal coating representing electromagnetic screening structure together with metal seed layer formed in carrier material
10/28/2009EP2112875A2 Thermal management system and method for electronic equipment mounted on coldplates
10/28/2009EP2112873A2 Electric function unit and method for manufacturing a three-dimensional electric function unit
10/28/2009EP2112689A2 Heat exchange device
10/28/2009EP2112688A1 Semiconductor package
10/28/2009EP2112685A1 Semiconductor device and method for manufacturing the same
10/28/2009EP2112450A1 Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe
10/28/2009EP2112249A1 Systems and methods for thermal management of electronic components
10/28/2009EP2111688A1 Apparatus and method for controlling the motor power
10/28/2009EP2111638A1 Apparatus and method for semiconductor wafer bumping via injection molded solder
10/28/2009EP2111637A2 Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
10/28/2009EP2111636A1 High thermal performance packaging for circuit dies
10/28/2009EP2111635A1 Post-seed deposition process
10/28/2009EP1861877B1 Device for cooling electronic components
10/28/2009EP1430526B1 Method for forming metal-metal oxide etch stop/ electromigration barrier for integrated circuit interconnects and device
10/28/2009EP1397325B1 A method of producing a metal-containing composition.
10/28/2009EP1375623B1 Method of manufacturing a sealed container filled with an extrudable cross-linked grease-like heat radiating material
10/28/2009CN101569018A A sealed photovoltaic apparatus
10/28/2009CN101569012A A method of producing solid-state imaging device
10/28/2009CN101569010A Semiconductor device having low dielectric insulating film and manufacturing method of the same
10/28/2009CN101569009A Plastic surface mount large area power device
10/28/2009CN101569008A Semiconductor device and its fabrication method
10/28/2009CN101569007A Electronic component for surface mounting
10/28/2009CN101569003A Semiconductor device and method for manufacturing the same
10/28/2009CN101568999A Semiconductor device and process for producing the semiconductor device
10/28/2009CN101568732A Pulsating fluid cooling with frequency control
10/28/2009CN101568249A Electronic system and wind direction limit device thereof
10/28/2009CN101568248A Cooling apparatus for electronic device and electronic device including the same
10/28/2009CN101568247A Shielding insulating radiating system
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