Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/05/2009DE112007003111T5 Verfahren zum Aufnehmen bestehender Siliziumchips in dreidimensional integrierte Stapel A method of capturing existing silicon chips in three-dimensional integrated stack
11/05/2009DE112004001975B4 Verfahren und Anordnung zur Verbindung von Teststrukturen oder Leitungsarrays zur Überwachung der Herstellung integrierter Schaltungen Method and arrangement for connection of test structures or line arrays for monitoring the manufacture of integrated circuits
11/05/2009DE102008021108A1 Sensor arrangement producing method, involves contacting sensor element and lead frame with contact connecting element, and covering sensor element by sealing compound, where region of sensor element is free from sealing compound
11/05/2009DE102008014113A1 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design
11/05/2009DE102008005547A1 Kontaktelement, Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul Contact element, the power semiconductor module and the circuit arrangement comprising a power semiconductor module
11/05/2009DE102008001449A1 Sensor arrangement for e.g. antilock brake system of automobile, has molded housing comprising recess, and sensor module connected with carrier such that heat transmission is provided between sensor module and carrier
11/05/2009DE10196917B4 Hochleistungsrippenaufbau für eine luftgekühlte Wärmeableitvorrichtung High performance rib construction for an air-cooled heat sink
11/05/2009CA2722783A1 Mems device with independent rotation in two axes of rotation
11/04/2009EP2114113A1 Conductor board and method for its production
11/04/2009EP2113941A1 Reference data encoding in image sensors
11/04/2009EP2113131A1 Electronic component
11/04/2009EP1794787B1 Lead frame for an electronic component and method for the production thereof
11/04/2009EP1291906B1 Fabrication method for a semiconductor device
11/04/2009EP1282922B1 Encapsulated microelectronic devices
11/04/2009CN201341296Y Heat radiating structure of communication machine box
11/04/2009CN201341295Y Heat radiating device of communication machine box
11/04/2009CN201341294Y Radiating module
11/04/2009CN201341293Y Fan fixed mount
11/04/2009CN201341292Y Compensating unit of radiator fastener
11/04/2009CN201341290Y Heat radiating device and radiator
11/04/2009CN201341289Y Heat radiator fastener
11/04/2009CN201341288Y Heat abstractor and radiator
11/04/2009CN201340859Y Slot type LED radiating module with high heat radiation
11/04/2009CN201340858Y LED heat dissipation structure
11/04/2009CN201340853Y SOP / MSOP / TSSOP lead frame structure
11/04/2009CN201340852Y CPU fan-less pipe heat conducting device for 1U top carriage type special computer
11/04/2009CN201340851Y Mounting type packaging casing of semiconductor power device
11/04/2009CN201340768Y Coating device of electronic element
11/04/2009CN201340608Y Molding-method SIM card encapsulating structure based on metal frame
11/03/2009US7613537 Method and system of recognizing ID marks appended on base materials, and method of manufacturing products by base materials with the ID marks
11/03/2009US7613010 Stereoscopic electronic circuit device, and relay board and relay frame used therein
11/03/2009US7613004 Heat sink with heat dissipating fins and method of manufacturing heat sink
11/03/2009US7613001 Heat dissipation device with heat pipe
11/03/2009US7612980 Method and structure for electrostatic discharge protection of photomasks
11/03/2009US7612601 Semiconductor integrated circuit device
11/03/2009US7612459 Multi-chip module and single-chip module for chips and proximity connectors
11/03/2009US7612458 Epoxy resin composition for semiconductor encapsulating use, and semiconductor device
11/03/2009US7612457 Semiconductor device including a stress buffer
11/03/2009US7612456 Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
11/03/2009US7612455 Layered structure for electron device including regions of different wettability, electron device and electron device array that uses such a layered structure
11/03/2009US7612454 Semiconductor device with improved contact fuse
11/03/2009US7612453 Semiconductor device having an interconnect structure and a reinforcing insulating film
11/03/2009US7612452 Method for manufacturing a semiconductor device and semiconductor device
11/03/2009US7612451 Reducing resistivity in interconnect structures by forming an inter-layer
11/03/2009US7612450 Semiconductor package including dummy board and method of fabricating the same
11/03/2009US7612449 Optimized power delivery to high speed, high pin-count devices
11/03/2009US7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
11/03/2009US7612447 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
11/03/2009US7612446 Structures to enhance cooling of computer memory modules
11/03/2009US7612445 Circuit apparatus and method of fabricating the apparatus
11/03/2009US7612444 Semiconductor package with flow controller
11/03/2009US7612443 Inter-chip communication
11/03/2009US7612442 Semiconductor device
11/03/2009US7612441 Image-sensing chip package module adapted to dual-side soldering
11/03/2009US7612440 Package for an integrated circuit
11/03/2009US7612439 Semiconductor package having improved thermal performance
11/03/2009US7612438 Active matrix substrate with height control member
11/03/2009US7612437 Thermally enhanced single inline package (SIP)
11/03/2009US7612436 Packaged microelectronic devices with a lead frame
11/03/2009US7612435 Method of packaging integrated circuits
11/03/2009US7612434 Electronic device having wiring substrate and lead frame
11/03/2009US7612433 Semiconductor device having self-aligned contact
11/03/2009US7612431 Trench polysilicon diode
11/03/2009US7612419 Wafer, semiconductor chip, and semiconductor device
11/03/2009US7612414 Overlapped stressed liners for improved contacts
11/03/2009US7612391 Semiconductor integrated circuit device
11/03/2009US7612386 High power light emitting diode device
11/03/2009US7612385 High power light-emitting diode package comprising substrate having beacon
11/03/2009US7612382 Method for defeating reverse engineering of integrated circuits by optical means
11/03/2009US7612374 TFT containing coalesced nanoparticles
11/03/2009US7612371 Structure to monitor arcing in the processing steps of metal layer build on silicon-on-insulator semiconductors
11/03/2009US7612370 Thermal interface
11/03/2009US7612295 Printed wiring board and method for manufacturing the same
11/03/2009US7612127 Curable resin composition
11/03/2009US7611996 Multi-stage curing of low K nano-porous films
11/03/2009US7611981 Optimized circuit design layout for high performance ball grid array packages
11/03/2009US7611961 Method for fabricating semiconductor wafer with enhanced alignment performance
11/03/2009US7611926 Thermosetting die bonding film
11/03/2009US7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
11/03/2009US7611924 Integrated circuit package with chip-side signal connections
11/03/2009US7611041 Semiconductor device, manufacturing method and apparatus for the same
11/03/2009US7610950 Heat dissipation device with heat pipes
10/2009
10/29/2009WO2009132324A1 Mems package having formed metal lid
10/29/2009WO2009131671A2 Die stacking with an annular via having a recessed socket
10/29/2009WO2009131217A1 Heat dissipating base body and electronic device using the same
10/29/2009WO2009131178A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity
10/29/2009WO2009131169A1 Al ALLOY FILM FOR DISPLAY DEVICE, DISPLAY DEVICE, AND SPUTTERING TARGET
10/29/2009WO2009131035A1 Thin-film transistor manufacturing method, and thin-film transistor
10/29/2009WO2009130958A1 Wiring board, semiconductor device and method for manufacturing semiconductor device
10/29/2009WO2009130890A1 Unit with power circuit mounted therein, and motor drive apparatus
10/29/2009WO2009130822A1 Multilayer wiring, semiconductor device, substrate for display and display
10/29/2009WO2009130544A1 Wireless communication unit and semiconductor device having a power amplifier therefor
10/29/2009WO2009130442A1 Method of applying a bump to a substrate
10/29/2009WO2009129947A1 Device comprising a multilayer board and light-emitting diodes
10/29/2009WO2009105367A3 Integrated circuit package and method of manufacturing same
10/29/2009WO2009092677A3 Construction of reliable stacked via in electronic substrates - vertical stiffness control method
10/29/2009WO2009050672A3 Magnetic detection of back-side layer
10/29/2009US20090269929 Non-plasma capping layer for interconnect applications
10/29/2009US20090269920 Method of forming interconnection line and method of manufacturing thin film transistor substrate
10/29/2009US20090269914 Process for forming a dielectric on a copper-containing metallization and capacitor arrangement
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