Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/10/2009US7615851 Integrated circuit package system
11/10/2009US7615850 Method and device including reworkable alpha particle barrier and corrosion barrier
11/10/2009US7615848 Semiconductor device and a method of manufacturing the same
11/10/2009US7615845 Active shielding of conductors in MEMS devices
11/10/2009US7615844 Semiconductor device
11/10/2009US7615841 Design structure for coupling noise prevention
11/10/2009US7615837 Lithography device for semiconductor circuit pattern generation
11/10/2009US7615836 Magnetic self-assembly for integrated circuit packages
11/10/2009US7615835 Package for semiconductor acceleration sensor
11/10/2009US7615826 Electrostatic discharge protection semiconductor structure
11/10/2009US7615824 D/A converter circuit, semiconductor device incorporating the D/A converter circuit, and manufacturing method of them
11/10/2009US7615819 Semiconductor device
11/10/2009US7615813 Semiconductor device using fuse/anti-fuse system
11/10/2009US7615783 Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same
11/10/2009US7615781 Semiconductor wafer and semiconductor device, and method for manufacturing same
11/10/2009US7615780 DNA biosensor and methods for making and using the same
11/10/2009US7615776 Method of self-assembling electronic circuitry and circuits formed thereby
11/10/2009US7615712 Integrated circuit packages including damming and change protection cover for harsh environments
11/10/2009US7615506 Durable tungsten-doped tin-fluorophosphate glasses
11/10/2009US7615498 Method of manufacturing a semiconductor device
11/10/2009US7615489 Method for forming metal interconnects and reducing metal seed layer overhang
11/10/2009US7615485 Method of manufacture of contact plug and interconnection layer of semiconductor device
11/10/2009US7615481 Method of manufacturing multilevel interconnect structure and multilevel interconnect structure
11/10/2009US7615478 Fabrication method for electronic system modules
11/10/2009US7615477 Method of fabricating a BGA package having decreased adhesion
11/10/2009US7615474 Method for manufacturing semiconductor device with reduced damage to metal wiring layer
11/10/2009US7615462 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/10/2009US7615454 Embedded stressed nitride liners for CMOS performance improvement
11/10/2009US7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
11/10/2009US7615410 Chip-sized flip-chip semiconductor package and method for making the same
11/10/2009US7615395 Method for containing a device and a corresponding device
11/10/2009US7615255 electrolytically plating a layer of nickel over a substrate, then a nickel phosphorous layer on the nickel layer to form a nickel and nickel phosphorous duplex layer,depositing a tin or alloy layer on the nickel phosphorous layer to inhibit tin surface oxidation, improve solderability of substrate
11/10/2009US7615119 Apparatus for spin coating semiconductor substrates
11/10/2009US7614247 Cooling arrangement
11/10/2009US7614142 Method for fabricating an interposer
11/05/2009WO2009134012A2 Metal frame for electronic components
11/05/2009WO2009133930A1 Resin composition and sheet using the same
11/05/2009WO2009133717A1 Hermetic sealing cap
11/05/2009WO2009133625A1 Wiring board, process for producing the same, and process for manufacturing electronic device
11/05/2009WO2009133585A1 Heat transfer connector and constant temperature generator equipped therewith
11/05/2009WO2009132926A1 Electrical power unit
11/05/2009WO2009132922A2 Substrate-mounted circuit module comprising components in a plurality of contact planes
11/05/2009WO2009132723A1 Cooling arrangement comprising two semiconductor components disposed next to one another
11/05/2009WO2009132620A1 Cooling device for a plurality of power modules
11/05/2009WO2009132440A1 Mems device with independent rotation in two axes of rotation
11/05/2009WO2009132430A1 Modular heat sink and method for fabricating same
11/05/2009WO2009114406A3 Semiconductor die package including ic driver and bridge
11/05/2009WO2009108707A3 Micromodules including integrated thin film inductors and methods of making the same
11/05/2009WO2009101040A3 Microstructure modification in copper interconnect structure
11/05/2009WO2009093825A3 Semiconductor package and fabricating method thereof
11/05/2009US20090275194 Semiconductor device having multiple wiring layers and method of producing the same
11/05/2009US20090273913 Circuit arrangement having two semiconductor switching elements and one freewheeling element
11/05/2009US20090273102 Semiconductor Substrate and Method for Manufacturing the Same
11/05/2009US20090273101 Apparatus and Method for Preventing Configurable System-on-a-Chip Integrated Circuits from Becoming I/O Limited
11/05/2009US20090273100 Integrated circuit having interleaved gridded features, mask set and method for printing
11/05/2009US20090273098 Enhanced Architectural Interconnect Options Enabled With Flipped Die on a Multi-Chip Package
11/05/2009US20090273097 Semiconductor Component with Contact Pad
11/05/2009US20090273096 High Density Memory Device Manufacturing Using Isolated Step Pads
11/05/2009US20090273095 Rectangular-Shaped Controlled Collapse Chip Connection
11/05/2009US20090273094 Integrated circuit package on package system
11/05/2009US20090273093 Planar packageless semiconductor structure with via and coplanar contacts
11/05/2009US20090273092 Semiconductor module having an interconnection structure
11/05/2009US20090273091 Semiconductor device and metal line fabrication method of the same
11/05/2009US20090273090 Semiconductor device and method for manufacturing the same
11/05/2009US20090273089 Method for manufacturing semiconductor device and semiconductor device
11/05/2009US20090273088 Semiconductor Device and Method for Fabricating the Same
11/05/2009US20090273087 Closed-loop sputtering controlled to enhance electrical characteristics in deposited layer
11/05/2009US20090273086 Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices
11/05/2009US20090273085 CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES
11/05/2009US20090273084 Optically transparent wires for secure circuits and methods of making same
11/05/2009US20090273083 Electrically conductive fluid interconnects for integrated circuit devices
11/05/2009US20090273082 Methods and designs for localized wafer thinning
11/05/2009US20090273081 PAD CUSHION STRUCTURE AND METHOD OF FABRICATION FOR Pb-FREE C4 INTEGRATED CIRCUIT CHIP JOINING
11/05/2009US20090273080 Display device and manufacturing method of the same
11/05/2009US20090273079 Semiconductor package having passive component bumps
11/05/2009US20090273078 Electronic packages
11/05/2009US20090273077 Multi-lid semiconductor package
11/05/2009US20090273076 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same
11/05/2009US20090273075 Semiconductor device and manufacturing of the semiconductor device
11/05/2009US20090273074 Bond wire loop for high speed noise isolation
11/05/2009US20090273073 Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board
11/05/2009US20090273072 Semiconductor device and method for manufacturing the same
11/05/2009US20090273071 Ic chip mounting package and process for manufacturing the same
11/05/2009US20090273070 Liquid Resin Composition for Electronic Components and Electronic Component Device
11/05/2009US20090273069 Low profile chip scale stacking system and method
11/05/2009US20090273068 3-D Integrated Circuit Lateral Heat Dissipation
11/05/2009US20090273067 Multi-chip discrete devices in semiconductor packages
11/05/2009US20090273066 Semiconductor device and method
11/05/2009US20090273065 Interconnection of lead frame to die utilizing flip chip process
11/05/2009US20090273064 Semiconductor device and inspection method therefor
11/05/2009US20090273063 Semiconductor device
11/05/2009US20090273062 Semiconductor package heat spreader
11/05/2009US20090273056 Semiconductor device and method of manufacturing the same
11/05/2009US20090273055 Fuse Structure
11/05/2009US20090273009 Integrated CMOS porous sensor
11/05/2009US20090272984 Silicon Carbide on Diamond Substrates and Related Devices and Methods
11/05/2009US20090272974 Interposer chip and multi-chip package having the interposer chip
11/05/2009US20090272973 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line
11/05/2009US20090272566 Electrically conductive paste and multilayer ceramic substrate
11/05/2009US20090272285 Three-dimensional structures and methods of fabricating the same using a printing plate
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