Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/11/2009CN101578029A Phase-change temperature control device integrating heat pipe and foam metal core body
11/11/2009CN101578027A Electronic device and radiating unit thereof
11/11/2009CN101578026A Electronic device and radiating unit thereof
11/11/2009CN101578025A Dissipating device
11/11/2009CN101577418A Electrostatic discharge protection circuit and electronic system
11/11/2009CN101577346A Battery pack
11/11/2009CN101577288A Solid-state image pickup device and electronic apparatus
11/11/2009CN101577283A Thin film transistor array arrangement, organic light emitting display device having the same, and manufacturing method thereof
11/11/2009CN101577282A Semiconductor device and method of manufacturing the same
11/11/2009CN101577281A Semiconductor device and method of manufacturing the same
11/11/2009CN101577280A Display device
11/11/2009CN101577277A 半导体装置 Semiconductor device
11/11/2009CN101577276A Insulated gate semiconductor device
11/11/2009CN101577275A Modulation triggering type electrostatic discharge protection component
11/11/2009CN101577272A Luminescence module
11/11/2009CN101577271A Semiconductor device and its manufacturing method
11/11/2009CN101577270A Semi-conductor luminescence component
11/11/2009CN101577269A Bonding pad sharing method applied to multi-chip module and apparatus thereof
11/11/2009CN101577268A Package structure for stacked type integrated circuit chip
11/11/2009CN101577267A 芯片封装结构 Chip package structure
11/11/2009CN101577266A Monitoring plasma induced damage during semiconductor wafer processes
11/11/2009CN101577265A Test structure of breakdown voltage, analytic procedure applying same and wafer
11/11/2009CN101577264A Printed circuit board and method of manufacturing the same
11/11/2009CN101577263A Chip packaging structure and chip packaging coiling tape
11/11/2009CN101577262A Power semiconductor module system
11/11/2009CN101577261A Connection point structure as well as forming method and connecting structure thereof
11/11/2009CN101577260A Circuit substrate and light source module
11/11/2009CN101577259A Chip encapsulating structure
11/11/2009CN101577258A Electronic component and resin packaging method for electronic component
11/11/2009CN101577257A Electronic component
11/11/2009CN101577249A Semiconductor device with channel of fin structure and method for manufacturing the same
11/11/2009CN101577248A Array substrate and forming method thereof
11/11/2009CN101577247A Integrating metal with ultra low-K dielectrics
11/11/2009CN101577243A Semiconductor structure and manufacturing method thereof
11/11/2009CN101577237A Semiconductor device and method including first and second carriers
11/11/2009CN101577235A Separating and assembling semiconductor strips
11/11/2009CN101577233A Encapsulation structure of integrated circuit elements and manufacturing method thereof
11/11/2009CN101576242A Radiating method of high-power LED radiator and radiator for implementing same
11/11/2009CN101576241A Radiating method of LED radiator and radiator for implementing same
11/11/2009CN101576239A Light-emitting diode capable of radiating
11/11/2009CN101576238A Method and equipment for welding LED lamp bead
11/11/2009CN101576206A High-power LED lamp based on heat pipe for thermal conductivity
11/11/2009CN101575440A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/11/2009CN100559926C Heat sink with microchannel cooling for power devices
11/11/2009CN100559924C Liquid circulation type cooling system
11/11/2009CN100559923C Thermal solution and protection system for electronic devices
11/11/2009CN100559607C Active matrix type organic electroluminescent apparatus and method for producing the equipment
11/11/2009CN100559598C Pixel structure, display panel, photoelectrical device and its repair method
11/11/2009CN100559594C Nonvolatile memory
11/11/2009CN100559588C Display device and its making method
11/11/2009CN100559587C Grid driving circuit integrated on display panel and its making method
11/11/2009CN100559586C Integrated circuit chip with electrostatic discharge protection device
11/11/2009CN100559585C Semiconductor device and fuse blowout method
11/11/2009CN100559584C Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
11/11/2009CN100559583C LED module
11/11/2009CN100559582C Chip stack packaging structure and method of producing the same
11/11/2009CN100559580C Impedance matching external component connections with uncompensated leads
11/11/2009CN100559579C Semiconductor device having self-aligned contact and method of fabricating the same
11/11/2009CN100559578C 半导体器件 Semiconductor devices
11/11/2009CN100559577C Wafer packaging construction with array connecting pad and method of manufacturing the same
11/11/2009CN100559576C Semiconductor device, wiring of semiconductor device, and method of forming wiring
11/11/2009CN100559575C Wafer structure
11/11/2009CN100559574C Electrically shielded through-wafer interconnect
11/11/2009CN100559573C CPU heat radiation module
11/11/2009CN100559572C Electronic device and method of manufacturing the same
11/11/2009CN100559566C Method of forming line of semiconductor device
11/11/2009CN100559565C Semiconductor device and a method of manufacturing the same
11/11/2009CN100559562C Technique for efficiently patterning an underbump metallization layer using a dry etch process
11/11/2009CN100559561C Structure for packing chip with crystal cavity downward, and manufacturing method
11/11/2009CN100559560C Adhesive sheet for producing a semiconductor device
11/11/2009CN100559558C Manufacturing method for heat radiating base of surface adhesive diode support and construction thereof
11/11/2009CN100559557C Surface mounted package with die bottom spaced from support board
11/11/2009CN100559555C Device having enhanced stress state and related methods
11/10/2009US7616444 Gimballed attachment for multiple heat exchangers
11/10/2009US7616443 Cooling device for electrical power units of electrically operated vehicles
11/10/2009US7616441 Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module
11/10/2009US7616016 Probe card assembly and kit
11/10/2009US7616014 Pulsed I-V measurement method and apparatus
11/10/2009US7615874 Electronic component module
11/10/2009US7615873 Solder flow stops for semiconductor die substrates
11/10/2009US7615872 Semiconductor device
11/10/2009US7615871 Method and apparatus for attaching microelectronic substrates and support members
11/10/2009US7615870 Semiconductor device, manufacturing method thereof, and connection method of circuit board
11/10/2009US7615869 Memory module with stacked semiconductor devices
11/10/2009US7615868 Electrode, method for producing same and semiconductor device using same
11/10/2009US7615866 Contact surrounded by passivation and polymide and method therefor
11/10/2009US7615865 Standoff height improvement for bumping technology using solder resist
11/10/2009US7615864 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
11/10/2009US7615863 Multi-dimensional wafer-level integrated antenna sensor micro packaging
11/10/2009US7615862 Heat dissipating package structure and method for fabricating the same
11/10/2009US7615861 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
11/10/2009US7615860 Rigid-flex printed circuit board with weakening structure
11/10/2009US7615859 Thin semiconductor package having stackable lead frame and method of manufacturing the same
11/10/2009US7615858 Stacked-type semiconductor device package
11/10/2009US7615857 Modular three-dimensional chip multiprocessor
11/10/2009US7615856 Integrated antenna type circuit apparatus
11/10/2009US7615855 IC card and method of manufacturing the same
11/10/2009US7615854 Semiconductor package that includes stacked semiconductor die
11/10/2009US7615853 Chip-stacked package structure having leadframe with multi-piece bus bar
11/10/2009US7615852 Semiconductor component in a housing with mechanically inforcing flat conductor webs
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