H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/12/2009	WO2009136535A1 Substrate incorporating esd protection function
11/12/2009	WO2009136495A1 Chip-size double side connection package and method for manufacturing the same
11/12/2009	WO2009136492A1 Jig for aligning leadframe
11/12/2009	WO2009136226A1 Semiconductor package having passive component bumps
11/12/2009	WO2009135737A1 Electrical bond connection arrangement
11/12/2009	WO2009135476A1 Controller having a frame
11/12/2009	WO2009120857A3 Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
11/12/2009	WO2009071645A3 Silicon-ceramic composite substrate
11/12/2009	US20090281745 Monitoring Plasma Induced Damage During Semiconductor Wafer Processes
11/12/2009	US20090280643 Optimal tungsten through wafer via and process of fabricating same
11/12/2009	US20090280642 Semiconductor device having multiple wiring layers and method of producing the same
11/12/2009	US20090280604 Heat radiation structure of semiconductor device, and manufacturing method thereof
11/12/2009	US20090278967 Solid-state image pickup device and electronic apparatus
11/12/2009	US20090278455 Methods and materials for the reduction and control of moisture and oxygen in oled devices
11/12/2009	US20090278265 Electronic component and resin packaging method for electronic component
11/12/2009	US20090278264 Semiconductor Chip Bump Connection Apparatus and Method
11/12/2009	US20090278263 Reliability wcsp layouts
11/12/2009	US20090278262 Multi-chip package including component supporting die overhang and system including same
11/12/2009	US20090278261 Semiconductor device and method for fabricating the same
11/12/2009	US20090278260 Redundancy design with electro-migration immunity and method of manufacture
11/12/2009	US20090278259 Semiconductor device and method for manufacturing semiconductor device
11/12/2009	US20090278258 Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same
11/12/2009	US20090278257 Method to assemble structures from nano-materials
11/12/2009	US20090278256 Semiconductor package enhancing variation of movability at ball terminals
11/12/2009	US20090278255 Semiconductor device
11/12/2009	US20090278254 Dielectric materials and methods for integrated circuit applications
11/12/2009	US20090278253 Semi-finished package and method for making a package
11/12/2009	US20090278252 Semiconductor device and method for manufacturing semiconductor device
11/12/2009	US20090278251 Pad Structure for 3D Integrated Circuit
11/12/2009	US20090278250 Method of Semiconductor Packaging and/or a Semiconductor Package
11/12/2009	US20090278249 Printed circuit board and method thereof and a solder ball land and method thereof
11/12/2009	US20090278248 Semiconductor device and method of fabrication
11/12/2009	US20090278247 Bonding pad sharing method applied to multi-chip module and apparatus thereof
11/12/2009	US20090278246 Semiconductor device
11/12/2009	US20090278245 Packaged electronic devices with face-up die having tsv connection to leads and die pad
11/12/2009	US20090278244 Ic device having low resistance tsv comprising ground connection
11/12/2009	US20090278243 Stacked type chip package structure and method for fabricating the same
11/12/2009	US20090278242 Stacked type chip package structure
11/12/2009	US20090278241 Semiconductor die package including die stacked on premolded substrate including die
11/12/2009	US20090278240 Semiconductor apparatus
11/12/2009	US20090278238 Tsvs having chemically exposed tsv tips for integrated circuit devices
11/12/2009	US20090278237 Through substrate via including variable sidewall profile
11/12/2009	US20090278236 Semiconductor device, wafer structure and method for fabricating semiconductor device
11/12/2009	US20090278232 Ruthenium silicide diffusion barrier layers and methods of forming same
11/12/2009	US20090278231 Semiconductor device and method for fabricating the same
11/12/2009	US20090278229 Efficient interconnect structure for electrical fuse applications
11/12/2009	US20090278228 Design structure for interconnect structure containing various capping materials for electrical fuse and other related applications
11/12/2009	US20090278227 Isolation trench structure
11/12/2009	US20090278190 Nonvolatile semiconductor memory
11/12/2009	US20090278179 Chip scale surface mount package for semiconductor device and process of fabricating the same
11/12/2009	US20090278178 Semiconductor device and method for fabricating the same
11/12/2009	US20090278167 Semiconductor device including a plurality of chips and method of manufacturing semiconductor device
11/12/2009	US20090278138 Laminated structure and image display device
11/12/2009	US20090278126 Metal line substrate, thin film transistor substrate and method of forming the same
11/12/2009	US20090278123 Testing wiring structure and method for forming the same
11/12/2009	DE202008009018U1 Bezeichnungsschild mit Bezeichnungsträgerplatte für elektrische und elektronische Bauelemente Nameplate with marker carrier plate for electrical and electronic components
11/12/2009	DE202008006125U1 Heatpipe Heatpipe
11/12/2009	DE102009019030A1 Halbleiterbauelement Semiconductor device
11/12/2009	DE102008018793B3 Anordnung in Druckkontaktausführung mit einem Leistungshalbleitermodul Arrangement in pressure contact design with a power semiconductor module
11/12/2009	DE102008001671A1 Elektrische Bondverbindungsanordnung Electrical bonding arrangement
11/12/2009	DE102006040838B4 Elektronische Leistungspackung mit zwei Substraten mit mehreren Halbleiterchips und elektronischen Komponenten Electronic power pack with two substrates with a plurality of semiconductor chips and electronic components
11/12/2009	DE102006000936B4 Halbleiterbauelement mit Schutzschaltung gegen Lichtangriffe Semiconductor device with protection circuit against light attacks
11/12/2009	CA2723619A1 Nanostructure-based heating devices and method of use
11/12/2009	CA2720966A1 3-d integrated circuit lateral heat dissipation
11/11/2009	EP2117288A1 Heat-management system for a cabinet containing electronic equipment
11/11/2009	EP2117044A1 Printed circuit board and method of manufacuring the same
11/11/2009	EP2117037A1 Interlayer insulation film, interconnect structure, and methods for production thereof
11/11/2009	EP2116895A2 Laminated structure and image display device
11/11/2009	EP2116115A1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method
11/11/2009	EP2115774A2 Embedded inductor and method of producing thereof
11/11/2009	EP2115773A1 A quad flat no lead (qfn) integrated circuit (ic) package having a modified paddle and method for designing the package
11/11/2009	EP2115772A1 Electronic passive device
11/11/2009	EP2115652A2 Semiconductor device with backside tamper protection
11/11/2009	EP1605220B1 Heat sunk, laser module, laser device, and laser-processing device
11/11/2009	EP1309999B1 Semiconductor component and a method for identifying a semiconductor component
11/11/2009	CN201345370Y Encapsulation structure of light emitting diode and light emitting diode device
11/11/2009	CN201345363Y 埋入式电路板结构 Embedded circuit board structure
11/11/2009	CN201345362Y Lead wire frame
11/11/2009	CN201345361Y Lead wire frame
11/11/2009	CN201345360Y Self-cooling type microgroove group composite phase change integrated cooling and heat radiation device for controllable silicon device
11/11/2009	CN201345354Y Masking tape cutting and scrap tape separating device
11/11/2009	CN201345112Y IC (integrated circuit) chip
11/11/2009	CN201344508Y LED industrial and mining lamp with radiating device
11/11/2009	CN201344507Y LED lamp tube with radiating device
11/11/2009	CN201344506Y High-power single chip LED structure with novel heat radiation device
11/11/2009	CN201344504Y LED lamp and heat yielding structure thereof
11/11/2009	CN201344503Y Heat dissipation device for lamp
11/11/2009	CN201344426Y An embedded LED down lamp
11/11/2009	CN201344411Y LED (light-emitting diode) garden lamp
11/11/2009	CN201344405Y LED lamp bulb
11/11/2009	CN201344393Y Cylindrical LED lamp
11/11/2009	CN201344388Y LED bulb
11/11/2009	CN101578703A Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
11/11/2009	CN101578702A Potted integrated circuit device with aluminum case
11/11/2009	CN101578701A Cooling structure for semiconductor device
11/11/2009	CN101578697A High frequency package
11/11/2009	CN101578695A Semiconductor element mounting structure and semiconductor element mounting method
11/11/2009	CN101578394A Plated material having metal thin film formed by electroless plating, and method for production thereof
11/11/2009	CN101578393A Plated material having metal thin film formed by electroless plating, and method for production thereof
11/11/2009	CN101578030A Heat dissipation structure and manufacturing method thereof

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