H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/18/2009	CN101582397A Semiconductor device and manufacturing method thereof
11/18/2009	CN101582396A Semiconductor device and manufacturing of the same
11/18/2009	CN101582395A Wiring board
11/18/2009	CN101582394A Power MOSFET module with gate electrode resistance distribution
11/18/2009	CN101581880A Semiconductor package and method for making the same
11/18/2009	CN101581550A Evaporator for a cooling circuit
11/18/2009	CN101581444A Light emitting diode lighting device
11/18/2009	CN101581442A Method for producing substrate
11/18/2009	CN101581441A Substrate
11/18/2009	CN101581438A Lateral light-emitting diode
11/18/2009	CN101581408A LED bulb
11/18/2009	CN101581406A Thermotube type high-power LED lamp
11/18/2009	CN101581405A LED illuminator
11/18/2009	CN101580629A Method for fabricating resin composition for semiconductor packaging
11/18/2009	CN101580580A 热固化性组合物 Heat-curable composition
11/18/2009	CN100562239C Heat radiator
11/18/2009	CN100562238C Heat radiator
11/18/2009	CN100562237C Heat radiating device
11/18/2009	CN100562236C Heat radiating device
11/18/2009	CN100562235C Heat radiator
11/18/2009	CN100562233C Radiating module
11/18/2009	CN100562232C Heat tube radiating device
11/18/2009	CN100562231C Heat pipe radiator
11/18/2009	CN100562230C Heat pipe radiator
11/18/2009	CN100562223C Method of manufacturing substrate for circuit board and smart label having the substrate
11/18/2009	CN100562212C Insulation structure for high thermal condition and its manufacturing method
11/18/2009	CN100561860C Encapsulated component which is small in terms of height and method for producing the same
11/18/2009	CN100561818C Protection circuit for resisting power supply abrupt change of voltage
11/18/2009	CN100561760C Led light source device
11/18/2009	CN100561754C Integrated ball grid array optical mouse sensor packaging
11/18/2009	CN100561738C System and method of I/O ESD protection using multi-crystal silicon area
11/18/2009	CN100561737C Lamina ball grid array package piece of central welding-spot chip and manufacture method thereof
11/18/2009	CN100561736C Image sensory element packaging structure and image-forming module group applying same
11/18/2009	CN100561735C Power circuit package and fabrication method
11/18/2009	CN100561734C Semiconductor IC-embedded module
11/18/2009	CN100561732C Method of forming a semiconductor package and structure thereof
11/18/2009	CN100561731C Multi-speed interconnected reliability testing structure
11/18/2009	CN100561730C Semiconductor device and method for cutting electric fuse
11/18/2009	CN100561729C Making method for dual enchasing structure
11/18/2009	CN100561728C Semiconductor device and its manufacturing method
11/18/2009	CN100561727C 半导体器件安装板及半导体封装 The semiconductor device mounting board and the semiconductor package
11/18/2009	CN100561726C Circuit wiring board
11/18/2009	CN100561725C Directly electric connected flip chip encapsulation structure of semiconductor chip
11/18/2009	CN100561724C Semiconductor chip packaging structure and encapsulation method
11/18/2009	CN100561723C 半导体器件和其制造方法 The semiconductor device and the manufacturing method thereof
11/18/2009	CN100561722C Electronic component cooling apparatus
11/18/2009	CN100561721C Data memory heat radiating device
11/18/2009	CN100561720C Radiating module and its fixation structure
11/18/2009	CN100561719C Heat-emitting element cooling apparatus and heat sink
11/18/2009	CN100561718C Heak sink device
11/18/2009	CN100561717C Electronic component heat sink and its combination
11/18/2009	CN100561716C Surface mounted semiconductor device and method for manufacturing same
11/18/2009	CN100561715C Isolating ring substrate, mask plate and forming method thereof
11/18/2009	CN100561699C Monitoring of contact hole production
11/18/2009	CN100561696C Structure embedded with semiconductor chip and its manufacturing method
11/18/2009	CN100561693C Method for providing structural support for interconnect pad while allowing signal conductance
11/18/2009	CN100561400C Heat radiating device of notebook computer and its production method
11/18/2009	CN100561318C Connecting structure for conduction thin film and thin film transistor array panel including the same connection structure
11/18/2009	CN100560632C Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof
11/17/2009	US7620479 Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures
11/17/2009	US7619893 Heat spreader for electronic modules
11/17/2009	US7619885 Card fixing structure
11/17/2009	US7619738 Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection apparatus
11/17/2009	US7619489 Semiconductor integrated circuit
11/17/2009	US7619318 An encapsulant composition with a base at least partially filled with filler particles
11/17/2009	US7619317 Carrier structure for semiconductor chip and method for manufacturing the same
11/17/2009	US7619316 Semiconductor package and method for manufacturing the same
11/17/2009	US7619314 Integrated circuit package system including die stacking
11/17/2009	US7619313 Multi-chip module and methods
11/17/2009	US7619312 Method and apparatus for precisely aligning integrated circuit chips
11/17/2009	US7619310 Semiconductor interconnect and method of making same
11/17/2009	US7619309 Integrated connection arrangements
11/17/2009	US7619308 Multi-lid semiconductor package
11/17/2009	US7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
11/17/2009	US7619306 Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
11/17/2009	US7619305 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking
11/17/2009	US7619304 Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
11/17/2009	US7619303 Integrated circuit package
11/17/2009	US7619302 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
11/17/2009	US7619292 Semiconductor integrated device having solid-state image sensor packaged within and production method for same
11/17/2009	US7619290 Nanosensors
11/17/2009	US7619249 Thin film array panel and manufacturing method thereof
11/17/2009	US7618896 Semiconductor die package including multiple dies and a common node structure
11/17/2009	US7618886 Semiconductor device and method of manufacturing the same
11/17/2009	US7618849 Integrated circuit package with etched leadframe for package-on-package interconnects
11/17/2009	US7618845 Fabrication of an integrated circuit package
11/17/2009	US7618843 stacking and firing; dimensional stability without delamination and warp; insulations, dielectrics, magnetism, piezoelectric; resistor thick films; semiconductor devices such as communication modules, vehicle modules
11/17/2009	US7618832 Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same
11/17/2009	US7618713 Circuit-connecting material and circuit terminal connected structure and connecting method
11/17/2009	US7618575 Method for wafer scale molding of protective caps
11/17/2009	US7618573 Resin sealing method for electronic part and mold used for the method
11/17/2009	US7617966 Semiconductor device
11/17/2009	US7617593 Micromachine and method of fabricating the same
11/12/2009	WO2009137725A1 Nanostructure-based heating devices and method of use
11/12/2009	WO2009137653A2 Heat transfer assembly and methods therefor
11/12/2009	WO2009137450A1 Proximity optical memory module
11/12/2009	WO2009137387A1 Heat-management system for a cabinet containing electronic equipment
11/12/2009	WO2009137286A1 3-d integrated circuit lateral heat dissipation
11/12/2009	WO2009137200A1 Electromigration-compliant high performance fet layout
11/12/2009	WO2009136591A1 Semiconductor device

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