Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/19/2009US20090283831 Electrostatic discharge (ESD) protection applying high voltage lightly doped drain (LDD) CMOS technologies
11/19/2009US20090283791 Multilayered lead frame for a semiconductor light-emitting device
11/19/2009US20090283765 Semiconductor unit
11/19/2009US20090283764 Teg pattern for detecting void in device isolation layer and method of forming the same
11/19/2009US20090283762 Semiconductor device and manufacturing method of the same
11/19/2009US20090283602 Integrated Circuit Transponder, Method of Producing an Integrated Circuit and Method of Producing a Transponder
11/19/2009US20090283599 Fabrication method of ic inlet, id tag, id tag reader and method of reading data thereof
11/19/2009US20090283311 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module, and electronic information device
11/19/2009US20090283143 Point contact solar cell
11/19/2009DE202009012036U1 Zusammenbaubarer Kühlkörper Zusammenbaubarer heatsink
11/19/2009DE202009010319U1 Elektronisches Bauelement Electronic component
11/19/2009DE102009017853A1 Halbleitervorrichtung und Verfahren A semiconductor device and method
11/19/2009DE102009017518A1 Schaltungsschutzvorrichtung einschließlich Widerstand und Sicherungselement Circuit protection device including resistor and fuse element
11/19/2009DE102009013818A1 Elektronische Vorrichtung und ihre Herstellung Electronic device and its manufacturing
11/19/2009DE102008063757A1 Halbleiterbauteil Semiconductor device
11/19/2009DE102008027761A1 Electronic component comprises semiconductor module and printed circuit board which is arranged above semiconductor module, where electrically conductive spring element is provided between semiconductor module and printed circuit board
11/19/2009DE102008022733A1 Functional unit i.e. flexible substrate layer, for use in electronic device of electronic system, has active/passive electronic components enclosed by flexible dielectric layer, and contacts at outer side of unit for contacting components
11/19/2009DE102005016650B4 Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen Power semiconductor module with blunt soldered connections and fasteners
11/19/2009DE10160763B4 Vorrichtung zur automatischen Rückführung von Kühlmittel Apparatus for the automatic return of coolant
11/18/2009EP2120521A1 A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof
11/18/2009EP2120517A1 A mutual connection structure between multi-layer boards and manufacturing method thereof
11/18/2009EP2120263A1 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
11/18/2009EP2120262A1 Structure of packaging substrate and method for making the same
11/18/2009EP2120261A1 Semiconductor package
11/18/2009EP2120260A2 Semiconductor unit with temperature sensor
11/18/2009EP2120259A1 Ball-bump bonded ribbon-wire interconnect
11/18/2009EP2119754A2 Light-emitting device
11/18/2009EP2119737A1 Electronic packaging
11/18/2009EP2118926A2 Passivation layer for a circuit device and method of manufacture
11/18/2009EP2118924A1 Plated pillar package formation
11/18/2009EP2118191A1 Thermal interface materials and methods for making thereof
11/18/2009CN201349390Y Heat dissipating device
11/18/2009CN201349389Y Heat radiating device
11/18/2009CN201349387Y Heat pipe type radiator
11/18/2009CN201349386Y Self-cooled heat pipe radiator
11/18/2009CN201349384Y High conduction and heat dissipation aluminum coated metal substrate structure
11/18/2009CN201349024Y Substrate of heat radiating circuit
11/18/2009CN201349023Y Substrate of heat radiating circuit
11/18/2009CN201349020Y Packaged large-power LED with radiator
11/18/2009CN201348998Y 影像感测模块 The image sensing module
11/18/2009CN201348994Y High-voltage direct current power transmission valve hall water transmission and distribution pipeline
11/18/2009CN201348233Y LED luminous heat radiation body
11/18/2009CN201348232Y Radiator structure of LED lamp
11/18/2009CN201348231Y Heat radiating structure of LED road lamp
11/18/2009CN201348230Y Radiator for high-power LED lamp
11/18/2009CN201348229Y High-efficiency heat radiation structure
11/18/2009CN201348228Y Radiating module of LED lamps
11/18/2009CN201348223Y LED lighting device
11/18/2009CN201348163Y High-power LED down lamp
11/18/2009CN101584259A Multilayer body, method for producing substrate, substrate and semiconductor device
11/18/2009CN101584052A Electrical current distribution in light emitting devices
11/18/2009CN101584044A An integrated circuit package and a method for dissipating heat in an integrated circuit package
11/18/2009CN101584043A A metallization layer stack without a terminal aluminum metal layer
11/18/2009CN101584042A Semiconductor chip shape alteration
11/18/2009CN101584041A 半导体装置 Semiconductor device
11/18/2009CN101584040A Microelectronic intercionnect substrate and packaging techniques
11/18/2009CN101584033A Microelectronic assemblies having compliancy and methods therefor
11/18/2009CN101583262A Liquid-cooled heat dissipation device
11/18/2009CN101583261A Heat transfer medium protective device
11/18/2009CN101583260A Heat radiator and manufacturing method thereof
11/18/2009CN101583259A Fastener and radiation device assembly using same
11/18/2009CN101583257A Fixing device combination
11/18/2009CN101583255A Electronic equipment chassis
11/18/2009CN101583239A Component-embedded printed circuit board, manufacture method thereof and electronic apparatus containing the same
11/18/2009CN101582651A Semiconductor unit
11/18/2009CN101582489A Compound encapsulation structure and method of organic electroluminescence device
11/18/2009CN101582472A Light emitting diode (LED) bracket structure and forming method thereof
11/18/2009CN101582441A Display apparatus
11/18/2009CN101582439A Organic light emitting display and method for making the same
11/18/2009CN101582437A Magnetic memory device
11/18/2009CN101582434A Image sensor packaging structure, manufacturing method thereof and camera module
11/18/2009CN101582431A Thin film transistor (TFT) array substrate and manufacture method thereof
11/18/2009CN101582427A Semiconductor device
11/18/2009CN101582425A Dynamic random access memory and memory array
11/18/2009CN101582424A Top-grate structure thin film transistor and manufacturing method thereof
11/18/2009CN101582423A Pixel structure and making method thereof
11/18/2009CN101582422A Display device
11/18/2009CN101582421A Testable electrostatic discharge protection circuit
11/18/2009CN101582420A Focusing infrared receiver with built-in reflective cup
11/18/2009CN101582419A Device and system for mini surface-mount device
11/18/2009CN101582417A Power module for controlling leading out of terminal spring
11/18/2009CN101582416A Electronic element wafer module and method for manufacturing the same
11/18/2009CN101582415A Semiconductor device
11/18/2009CN101582414A Power module by directly bonding power terminal
11/18/2009CN101582413A Power module with lower stray inductance
11/18/2009CN101582412A I/O pad structure
11/18/2009CN101582411A Semiconductor device and method for manufacturing the same
11/18/2009CN101582410A Semiconductor device having multilayer interconnection structure
11/18/2009CN101582409A Backend interconnect scheme with middle dielectric layer having improved strength
11/18/2009CN101582408A Semiconductor device and method for manufacturing the same
11/18/2009CN101582407A System, structure and method of manufacturing semiconductor substrate stack
11/18/2009CN101582406A Wiring board, method for manufacturing the same, and semiconductor package
11/18/2009CN101582405A Wire of plastics-sealed diode
11/18/2009CN101582404A Bridge lead wire
11/18/2009CN101582403A Semiconductor package featuring flip-chip die sandwiched between metal layers
11/18/2009CN101582402A Circuit base plate and light-emitting diode encapsulation
11/18/2009CN101582401A 芯片封装单元 Chip packaging unit
11/18/2009CN101582400A Chip packaging structure
11/18/2009CN101582399A Contact structure and joining structure
11/18/2009CN101582398A Ball-bump bonded ribbon-wire interconnect
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