H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/25/2009	CN101587898A A semiconductor structure with an integrated circuit component and formation and operation method thereof
11/25/2009	CN101587894A Electrostatic discharge (esd) protection applying high voltage lightly doped drain (ldd) cmos technologies
11/25/2009	CN101587891A Semiconductor memory device and method for forming capacitor thereof
11/25/2009	CN101587890A Static discharge protective structure and layout method thereof
11/25/2009	CN101587889A Transistor distribution of static discharge protective circuit
11/25/2009	CN101587887A Light-emitting diode structure
11/25/2009	CN101587886A Electronic device package and fabrication method thereof
11/25/2009	CN101587885A Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/25/2009	CN101587884A Stacked chip packaging structure and manufacturing method thereof
11/25/2009	CN101587882A Encapsulation structure of luminous diode chip
11/25/2009	CN101587881A Module integrated circuit packaging structure with temperature compensation and control quartz oscillator
11/25/2009	CN101587880A Wired circuit board and producing method thereof
11/25/2009	CN101587879A Lead frame and resin-encapsulated semiconductor device
11/25/2009	CN101587878A Chip bearing device and chip packaging array
11/25/2009	CN101587877A Structure and manufacturing method of packaged base plate
11/25/2009	CN101587876A A semiconductor device and a semiconductor integrated circuit device
11/25/2009	CN101587875A Vertically electrically connected three-dimensional stacked chip packaging structure and manufacturing method thereof
11/25/2009	CN101587874A Chip with drive integrated circuit and corresponding liquid crystal display
11/25/2009	CN101587873A Dielectric layer structure for reducing stress and manufacturing method thereof
11/25/2009	CN101587872A Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
11/25/2009	CN101587871A Electronic device and method of manufacturing the same
11/25/2009	CN101587870A Semiconductor device
11/25/2009	CN101587869A Reversible leadless package and methods of making and using same
11/25/2009	CN101587868A Qfn semiconductor package and fabrication method thereof
11/25/2009	CN101587867A Substrate for insulated gate bipolar type transistor module
11/25/2009	CN101587866A Chip encapsulating structure and encapsulating method
11/25/2009	CN101587862A Method for forming insulating structure and semiconductor structure
11/25/2009	CN101587858A Semiconductor device interconnected structure and manufacturing method thereof
11/25/2009	CN101587857A Cover layer of semiconductor device interconnected structure and manufacturing method thereof
11/25/2009	CN101587849A Semiconductor device package having features formed by stamping
11/25/2009	CN101587848A Method for encapsulating optoelectronic components
11/25/2009	CN101587845A Packaging method and packaging structure of electronic volume label and personnel management-control method in dust free room
11/25/2009	CN101587844A Packaging structure and packaging method
11/25/2009	CN101587842A Chip packaging support plate and manufacture method thereof
11/25/2009	CN101587831A Semiconductor component structure and method for manufacturing semiconductor component
11/25/2009	CN101587824A Registration mark and manufacturing method thereof
11/25/2009	CN101587275A Electro-optical device and electronic apparatus
11/25/2009	CN101587273A Active matrix substrate and a liquid-crystal display device
11/25/2009	CN101586797A High-radiating light-emitting diode module and light-emitting diode lamps
11/25/2009	CN101586796A Heat sink built in cavity cylindrical light emitting diode wick
11/25/2009	CN101586795A 光源装置 The light source device
11/25/2009	CN101586794A Light-emitting diode lamp with heat radiation structure
11/25/2009	CN101586753A Light source unit and lighting system
11/25/2009	CN101586749A LED illuminating apparatus and a radiating structure thereof
11/25/2009	CN101586746A LED bulb and metal patchplug thereof
11/25/2009	CN100563414C Cooling device and projector
11/25/2009	CN100563405C Stereoscopic electronic circuit device, and relay board and relay frame used therein
11/25/2009	CN100563024C Package having exposed integrated circuit device
11/25/2009	CN100563020C Method and structure of a multi-level cell resistance random access memory with metal oxides
11/25/2009	CN100563013C Semiconductor device and method of manufacturing the same
11/25/2009	CN100563012C An apparatus and associated method for making a virtual ground array structure that uses inversion bit lines
11/25/2009	CN100563011C Transistor nonvolatile memory cell and its related memory array
11/25/2009	CN100563010C Semiconductor structure
11/25/2009	CN100563007C Electrostatic discharge protection circuit and integrated circuit
11/25/2009	CN100563005C Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
11/25/2009	CN100563002C Structure and method for packing LED chip
11/25/2009	CN100563000C Semiconductor device and method for fabricating the same
11/25/2009	CN100562999C Circuit module
11/25/2009	CN100562998C Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate
11/25/2009	CN100562997C Interpolater provided between the semiconductor component and semiconductor packaging
11/25/2009	CN100562996C Semiconductor package structure
11/25/2009	CN100562995C Bottom substrate of package on package and manufacturing method thereof
11/25/2009	CN100562994C Packaging structure for maintaining pin supporting plane on mould sealing wafer
11/25/2009	CN100562993C Semiconductor grain and package structure
11/25/2009	CN100562992C Wafer structure of projection definization
11/25/2009	CN100562991C Semiconductor package structure and its forming method
11/25/2009	CN100562990C Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver
11/25/2009	CN100562989C Liquid crystal display device and its manufacture method
11/25/2009	CN100562972C High performance stress-enhanced mosfets using si:c and sige epitaxial source/drain and method of manufacture
11/24/2009	US7624365 Semiconductor integrated device and apparatus for designing the same
11/24/2009	US7623397 Semiconductor device
11/24/2009	US7623350 Thermal conducting medium protector
11/24/2009	US7623348 Heat sink and cooling apparatus
11/24/2009	US7623346 Electronic component unit and electronic apparatus
11/24/2009	US7622813 Oriented self-location of microstructures with alignment structures
11/24/2009	US7622812 Semiconductor module
11/24/2009	US7622811 Semiconductor assembly with component attached on die back side
11/24/2009	US7622810 Semiconductor device and manufacturing method thereof
11/24/2009	US7622809 Display device and sputtering target for producing the same
11/24/2009	US7622808 Semiconductor device and having trench interconnection
11/24/2009	US7622806 Laser mark on an IC component
11/24/2009	US7622805 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
11/24/2009	US7622804 Semiconductor device and method of manufacturing the same
11/24/2009	US7622803 Heat sink assembly and related methods for semiconductor vacuum processing systems
11/24/2009	US7622802 Electronic device with semiconductor chip including a radiofrequency power module
11/24/2009	US7622801 Thin planar semiconductor device
11/24/2009	US7622800 Stacked semiconductor packages and method therefor
11/24/2009	US7622799 Semiconductor device, interposer chip and manufacturing method of semiconductor device
11/24/2009	US7622798 Integrated circuit devices with stacked package interposers
11/24/2009	US7622796 Semiconductor package having a bridged plate interconnection
11/24/2009	US7622795 Light emitting diode package
11/24/2009	US7622794 COL (Chip-On-Lead) multi-chip package
11/24/2009	US7622793 Flip chip shielded RF I/O land grid array package
11/24/2009	US7622792 Semiconductor device and method of manufacturing the same
11/24/2009	US7622787 Process for high voltage superjunction termination
11/24/2009	US7622779 Interconnection architecture and method of assessing interconnection architecture
11/24/2009	US7622778 Semiconductor device having shallow trench isolation structure comprising an upper trench and a lower trench including a void
11/24/2009	US7622776 Semiconductor device
11/24/2009	US7622775 System for ESD protection with extra headroom in relatively low supply voltage integrated circuits
11/24/2009	US7622757 Semiconductor device having multiple wiring layers

1 ... 706 707 708 709 710 711 712 713 714 715 716 717 718 719 720 721 722 723 724 725 726 ... 2262