H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2009
11/26/2009	US20090289363 Fine-Pitch Ball Grid Array Package Design
11/26/2009	US20090289362 Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias
11/26/2009	US20090289361 Semiconductor device and method of manufacturing a semiconductor device
11/26/2009	US20090289360 Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of ic during pressing
11/26/2009	US20090289359 Semiconductor package and methods of manufacturing the semiconductor package
11/26/2009	US20090289358 Semiconductor device, method of manufacturing the same, and substrate
11/26/2009	US20090289357 Semiconductor element and semiconductor device using the same
11/26/2009	US20090289356 Wirebondless Wafer Level Package with Plated Bumps and Interconnects
11/26/2009	US20090289355 Semiconductor manufacturing apparatus and semiconductor device
11/26/2009	US20090289354 Electronic module
11/26/2009	US20090289353 Covered devices in a semiconductor package
11/26/2009	US20090289352 Semiconductor device and a method for manufacturing the semiconductor device
11/26/2009	US20090289351 Semiconductor apparatus having both-side heat radiation structure and method for manufacturing the same
11/26/2009	US20090289350 Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package
11/26/2009	US20090289349 Hermetic sealing of micro devices
11/26/2009	US20090289348 Solution for package crosstalk minimization
11/26/2009	US20090289347 Circuit board, lead frame, semiconductor device, and method for fabricating the same
11/26/2009	US20090289346 Structure and manufacturing method of chip scale package
11/26/2009	US20090289345 Electronic device package and fabrication method thereof
11/26/2009	US20090289344 Semiconductor device
11/26/2009	US20090289343 Semiconductor package having an antenna
11/26/2009	US20090289342 Semiconductor Device and Semiconductor Device Manufacturing Method
11/26/2009	US20090289341 Semiconductor device
11/26/2009	US20090289340 Semiconductor device and method for manufacturing the same
11/26/2009	US20090289339 Semiconductor package and method for manufacturing the same
11/26/2009	US20090289338 Semiconductor package and method for manufacturing the same
11/26/2009	US20090289337 Lead Frame
11/26/2009	US20090289336 Semiconductor device and method for manufacturing thereof
11/26/2009	US20090289335 Integrated circuit package system with shield and tie bar
11/26/2009	US20090289334 Metal gate structure and method of manufacturing same
11/26/2009	US20090289333 Annealing a Buffer Layer for Fabricating Electronic Devices on Compliant Substrates
11/26/2009	US20090289331 Semiconductor chip and semiconductor device, and method of manufacturing the same
11/26/2009	US20090289325 Semiconductor Device with Crack Prevention Ring
11/26/2009	US20090289324 Mask overhang reduction or elimination after substrate etch
11/26/2009	US20090289322 Memory devices having a carbon nanotube
11/26/2009	US20090289318 Electronics device package and fabrication method thereof
11/26/2009	US20090289275 Light Emitting Device, Package, Light Emitting Device Manufacturing Method, Package Manufacturing Method and Package Manufacturing Die
11/26/2009	US20090289268 Light emitting apparatus and semiconductor apparatus, and method for manufacturing the same
11/26/2009	US20090289255 Flexible display device and manufacturing method thereof
11/26/2009	US20090289253 Semiconductor Wafer and Method of Forming Sacrificial Bump Pad for Wafer Probing During Wafer Sort Test
11/26/2009	US20090288805 Semiconductor package with a chip on a support plate
11/26/2009	DE112006000153B4 Anordnung mit einer elektronischen Komponente und einer Schaltungsplatine Arrangement with an electronic component and a circuit board
11/26/2009	DE102009022221A1 Halbleitervorrichtung mit beidseitiger Wärmeabstrahlungsstruktur und Verfahren zur Fertigung der Vorrichtung A semiconductor device with double-sided heat-radiating structure and method of manufacturing the device
11/26/2009	DE102008049777A1 Optoelektronisches Modul The optoelectronic module
11/26/2009	DE102008006960B4 Halbleiterbauelement mit selbstjustierter Kontaktstruktur und Verfahren zur Herstellung A semiconductor device with self-aligned contact structure and method for producing
11/26/2009	DE102007050417B4 Leistungsmodul mit einem in sich geschlossenen Kühlungssystem Power module with a self-contained cooling system
11/26/2009	DE102006044368B4 Verfahren zum Herstellen eines Substrats mit einem Hohlraum A method for producing a substrate with a cavity
11/26/2009	DE102005029464B4 Vorrichtung und Verfahren zum Ermitteln eines Kompensationssignals zum Kompensieren von Piezo-Einflüssen auf eine integrierte Halbleiterschaltung Apparatus and method for determining a compensation signal for compensating piezo influences on a semiconductor integrated circuit
11/26/2009	DE102005027234B4 Verfahren zum Bilden einer Verbindungsstruktur für eine Halbleitervorrichtung A method of forming an interconnect structure for a semiconductor device
11/26/2009	DE10124141B4 Verbindungseinrichtung für eine elektronische Schaltungsanordnung und Schaltungsanordnung Connecting means for an electronic circuit arrangement and the circuit arrangement
11/26/2009	DE10056832B4 Halbleiterbauteil-Moduleinheit Semiconductor device module unit
11/26/2009	CA2723830A1 Pad design for stt-mram
11/26/2009	CA2721841A1 Electroplating composition and process for coating a semiconductor substrate using said composition
11/25/2009	EP2124257A1 Power semiconductor device
11/25/2009	EP2124254A1 Metal paste for sealing, method for hermetical sealing of piezoelectric element, and piezoelectric device
11/25/2009	EP2124253A1 High frequency package
11/25/2009	EP2123688A1 Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition
11/25/2009	EP2123616A1 Graphite material and method for manufacturing the same
11/25/2009	EP2122682A1 Semiconductor module
11/25/2009	EP2122681A1 Sealed ball grid array package
11/25/2009	EP2122680A1 Transistor clamping apparatus
11/25/2009	EP2122674A1 Underfill anchor structure for an integrated circuit
11/25/2009	EP2122631A1 High speed otp sensing scheme
11/25/2009	EP2121511A2 Micropackaging method and devices
11/25/2009	CN201352893Y Heat radiation assembly and electronic device applied the same
11/25/2009	CN201352891Y Radiating fin device of auxiliary buckling part with the functions of clip
11/25/2009	CN201352557Y Image sensing module
11/25/2009	CN201352556Y Chip structure
11/25/2009	CN201352555Y Infrared remote control receiving amplifier encapsulation structure
11/25/2009	CN201352554Y Water-cooled type microgroove group composite phase change integrated cooling radiation of controlled silicon device
11/25/2009	CN201352553Y Air-cooled type microgroove group composite phase change integrated cooling radiator of controlled silicon device
11/25/2009	CN201351897Y Heat dissipating structure of high power LED projecting lamp
11/25/2009	CN201351896Y Convective heat dissipating structure of LED courtyard light
11/25/2009	CN201351895Y Convective heat dissipating structure of LED tunnel light
11/25/2009	CN201351894Y LED street lamp heat dissipating structure
11/25/2009	CN201351892Y Lotus seat heat-dissipating device
11/25/2009	CN201351891Y LED illumination lamp with lamp shade having built-in heat radiator
11/25/2009	CN201351881Y High-power LED lamp
11/25/2009	CN201351876Y LED spot light
11/25/2009	CN201351872Y Ridge-tile-shaped LED street lamp light source reflecting radiator
11/25/2009	CN201351834Y LED down lamp
11/25/2009	CN201351820Y LED tri-head light
11/25/2009	CN101589468A A system-in-package with through substrate via holes
11/25/2009	CN101589467A Semiconductor device comprising electromigration prevention film and manufacturing method thereof
11/25/2009	CN101589466A Electronic component
11/25/2009	CN101589465A Board on chip package and process for making same
11/25/2009	CN101589464A Wafer level CSP packaging concept
11/25/2009	CN101589403A Chip module for an RFID system
11/25/2009	CN101589287A Heat transfer apparatus
11/25/2009	CN101588708A Microchannel heat sink and measuring device
11/25/2009	CN101588707A Heat abstractor and electric device using same
11/25/2009	CN101588706A Radiating module and welding method thereof
11/25/2009	CN101588697A Fixing device assembly
11/25/2009	CN101588142A Power converter
11/25/2009	CN101587939A Organic thin film transistor and method for manufacturing same, pixel structure and method for manufacturing same and display panel
11/25/2009	CN101587925A Packaging structure of luminous element and manufacturing method thereof
11/25/2009	CN101587907A Low junction capacitance overvoltage protection thyristor apparatus chip and production method thereof
11/25/2009	CN101587903A Electronic element packaging body and manufacturing method thereof
11/25/2009	CN101587902A Silicon-on-nanometer-insulator material and preparing method thereof
11/25/2009	CN101587900A Flexible display device and manufacturing method thereof

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