H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/02/2009	CN100565312C Array substrate for organic thin film transistor liquid crystal display device and method of manufacturing the same
12/02/2009	CN100564995C LED road lamp
12/02/2009	CN100564579C Indium oxide/zinc oxide/magnesium oxide sputtering target and transparent conductive film
12/02/2009	CN100564560C Al-ni-b alloy wiring material and element structure using the same
12/02/2009	CN100564559C Cu-Ni-Si-Co-Cr based copper alloy for electronic material and method for production thereof
12/02/2009	CN100564470C Silicon composition which can be crosslinked into an adhesive gel
12/02/2009	CN100564423C Epoxy resin composition
12/01/2009	US7626822 Heat sink assembly for multiple electronic components
12/01/2009	US7626552 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
12/01/2009	US7626407 Miniature fluid-cooled heat sink with integral heater
12/01/2009	US7626278 Chip package
12/01/2009	US7626277 Integrated circuit package with open substrate
12/01/2009	US7626276 Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
12/01/2009	US7626275 Semiconductor device
12/01/2009	US7626274 Semiconductor device with an improved solder joint
12/01/2009	US7626273 Low profile stacking system and method
12/01/2009	US7626272 Via configurable architecture for customization of analog circuitry in a semiconductor device
12/01/2009	US7626271 Semiconductor device and method of producing the same
12/01/2009	US7626270 Coreless package substrate with conductive structures
12/01/2009	US7626269 Semiconductor constructions and assemblies, and electronic systems
12/01/2009	US7626267 Semiconductor integrated circuit device including wiring lines and interconnections
12/01/2009	US7626266 Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption
12/01/2009	US7626264 Substrate for device bonding and method for manufacturing same
12/01/2009	US7626263 Semiconductor device and package including the same
12/01/2009	US7626262 Electrically conductive connection, electronic component and method for their production
12/01/2009	US7626261 Wafer stacked package having vertical heat emission path and method of fabricating the same
12/01/2009	US7626260 Stack-type semiconductor device having cooling path on its bottom surface
12/01/2009	US7626259 Heat sink for a high capacity thin module system
12/01/2009	US7626258 Cap wafer, semiconductor chip having the same, and fabrication method thereof
12/01/2009	US7626257 Semiconductor devices and methods of manufacture thereof
12/01/2009	US7626256 Compact power semiconductor module having a connecting device
12/01/2009	US7626255 Device, system and electric element
12/01/2009	US7626254 Semiconductor package using chip-embedded interposer substrate
12/01/2009	US7626252 Multi-chip electronic package and cooling system
12/01/2009	US7626251 Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
12/01/2009	US7626250 High power LED package and fabrication method thereof
12/01/2009	US7626249 Flex clip connector for semiconductor device
12/01/2009	US7626248 Semiconductor package with a controlled impedance bus
12/01/2009	US7626247 Electronic package with integral electromagnetic radiation shield and methods related thereto
12/01/2009	US7626246 Solutions for integrated circuit integration of alternative active area materials
12/01/2009	US7626245 Extreme low-k dielectric film scheme for advanced interconnect
12/01/2009	US7626244 Stressed dielectric devices and methods of fabricating same
12/01/2009	US7626228 NAND-type non-volatile memory devices having a stacked structure
12/01/2009	US7626214 Small-sized semiconductor device featuring protection circuit for MOSFET
12/01/2009	US7626213 Light-emitting diode lamp
12/01/2009	US7626202 Contact structure and semiconductor device
12/01/2009	US7626200 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display
12/01/2009	US7626155 Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
12/01/2009	US7626125 Wiring, display device and method of manufacturing the same
12/01/2009	US7625799 Method of forming a shielded gate field effect transistor
12/01/2009	US7625779 Method of manufacturing a semiconductor device including a semiconductor chip having an inclined surface
12/01/2009	US7625641 titanium silicide and the compressive stress inducing atoms comprise germanium atoms; stress inducing material preferably induces compressive stress during the anneal to lower the activation energy to produce a more dense second crystalline phase; semiconductor construction
12/01/2009	US7625640 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
12/01/2009	US7625638 moisture-absorbent sheet; body comprising oxalic acid dihydrazide, a hygroscopic agent, and a resin selecting from fluororesins, polyacrylonitrile resins, polyamide resins; suppressing the formation of dark spots in the organic electroluminescent device
12/01/2009	US7625420 Small particle size, narrow size distribution, high crystallinity (large crystals) and spherical morphology; protective coatings; composites; alloys; green strength; thick film pastes; microelectronics; multilayer ceramic capacitors; multichip module;industrial scale
12/01/2009	US7624789 Liquid cooling system and an electronic apparatus having the same therein
12/01/2009	US7624492 Method for manufacturing electronic parts
11/2009
11/26/2009	WO2009143532A2 Lead frame thermoplastic solar cell receiver
11/26/2009	WO2009143126A2 Integrated circuit package having integrated faraday shield
11/26/2009	WO2009142931A1 Pad design for stt-mram
11/26/2009	WO2009142290A1 Heat radiation sheet and heat radiation device
11/26/2009	WO2009142165A1 Semiconductor device and method for fabricating the same
11/26/2009	WO2009142121A1 Semiconductor device and fabrication method thereof
11/26/2009	WO2009142065A1 Epoxy resin composition for encapsulating electronic part
11/26/2009	WO2009142036A1 Heat radiating cured coating film, coating composition, process for producing heat radiating cured coating film and electronic device having heat radiating cured coating film
11/26/2009	WO2009141952A1 Semiconductor device and method for manufacturing the same
11/26/2009	WO2009141551A2 Electroplating composition and process for coating a semiconductor substrate using said composition
11/26/2009	WO2009141488A1 Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for rf applications
11/26/2009	WO2009141402A1 Method for manufacturing and testing an integrated electronic circuit
11/26/2009	WO2009140798A1 Electronic component package body and its packaging method
11/26/2009	WO2009114670A3 Support mounted electrically interconnected die assembly
11/26/2009	WO2009114392A3 Semiconductor die package including embedded flip chip
11/26/2009	WO2009088869A4 Multiple access over proximity communication
11/26/2009	WO2009088565A3 Method of forming a thermo pyrolytic graphite-embedded heatsink
11/26/2009	WO2009062732A3 Multicomponent heat sink
11/26/2009	WO2009034008A3 Continuous method for electronic components, modules and led applications
11/26/2009	WO2009028578A8 Semiconductor device including semiconductor constituent and manufacturing method thereof
11/26/2009	US20090292189 Analyte Monitoring Device and Methods of Use
11/26/2009	US20090291573 Probe card assembly and kit, and methods of making same
11/26/2009	US20090291529 Method of manufacturing a semiconductor device
11/26/2009	US20090291514 Process management method and process management data for semiconductor device
11/26/2009	US20090291513 Overlay marks, methods of overlay mark design and methods of overlay measurements
11/26/2009	US20090290320 Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same
11/26/2009	US20090290271 Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same
11/26/2009	US20090290054 Solid-state imaging device
11/26/2009	US20090289701 Self-Identifying Stacked Die Semiconductor Components
11/26/2009	US20090289378 Semiconductor wafer
11/26/2009	US20090289377 Semiconductor wafer
11/26/2009	US20090289376 Light-proof chip packaging structure and method for its manufacture
11/26/2009	US20090289375 Dual Stress Liner Device and Method
11/26/2009	US20090289374 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/26/2009	US20090289373 Semiconductor device
11/26/2009	US20090289372 Power Supply Network
11/26/2009	US20090289370 Low contact resistance semiconductor devices and methods for fabricating the same
11/26/2009	US20090289369 Memory device peripheral interconnects and method of manufacturing
11/26/2009	US20090289368 Interconnect structure having enhanced electromigration reliabilty and a method of fabricating same
11/26/2009	US20090289367 Semiconductor device and method of manufacturing the same
11/26/2009	US20090289366 Semiconductor device and manufacturing method of semiconductor device
11/26/2009	US20090289365 Structure and process for conductive contact integration
11/26/2009	US20090289364 Semiconductor device and a method for manufacturing the same

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