Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/02/2009CN101595560A Pre-molded clip structure
12/02/2009CN101595559A Novel air gap integration scheme
12/02/2009CN101595558A Method for manufacturing semiconductor device, optical pickup module and semiconductor device
12/02/2009CN101595557A Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
12/02/2009CN101595556A Method for manufacturing semiconductor device, semiconductor device and optical pickup module
12/02/2009CN101594769A Structure and method for mounting a heat-generating component
12/02/2009CN101594767A Heat-dissipating device
12/02/2009CN101594765A Heat radiating device and fixing structure thereof
12/02/2009CN101594764A Heat radiating device and manufacturing method thereof
12/02/2009CN101594739A Embedded circuit board radiating device and processing method of element
12/02/2009CN101594730A Circuit board with conductive structure
12/02/2009CN101593973A Static discharging protection circuit
12/02/2009CN101593803A Light-emitting diode radiating component, composite type light-emitting diode and light-emitting diode lamp
12/02/2009CN101593799A Manufacturing method and structure of surface adhesion type LED
12/02/2009CN101593777A Capacitor structure and metal layer layout thereof
12/02/2009CN101593776A A self-protection structure of a power device within an expanded voltage range and method
12/02/2009CN101593768A Display device
12/02/2009CN101593766A Organic light emitting display device
12/02/2009CN101593764A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/02/2009CN101593762A Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
12/02/2009CN101593761A Sensing device with sealing compound protective layer and manufacture method thereof
12/02/2009CN101593753A Nonvolatile memory and manufacturing method thereof
12/02/2009CN101593750A Core substrate and printed wiring board
12/02/2009CN101593749A Photoelectric converter
12/02/2009CN101593748A Cascade connected thyristor valve section in jacking connection
12/02/2009CN101593747A A semiconductor device assembly and a method of establishing electric connection in the semiconductor device assembly
12/02/2009CN101593746A Novel chip packaging structure
12/02/2009CN101593745A Seal ring structure for integrated circuits
12/02/2009CN101593744A Alignment mark and manufacture method thereof
12/02/2009CN101593743A Integrated circuit element
12/02/2009CN101593742A Semiconductor device and a method of manufacturing the same
12/02/2009CN101593741A On-chip system chip
12/02/2009CN101593740A Conductive clip for semiconductor device package
12/02/2009CN101593739A Electronic apparatus
12/02/2009CN101593738A Semiconductor device and method for manufacturing the same
12/02/2009CN101593737A Seal ring structure for integrated circuits
12/02/2009CN101593736A Semiconductor device and manufacturing method therefor
12/02/2009CN101593735A Semiconductor device, and manufacturing method therefor
12/02/2009CN101593734A Flip-chip package with fan-out wlcsp
12/02/2009CN101593733A Encapsulation structure
12/02/2009CN101593731A Liquid crystal display, active element array substrate and method for manufacturing active element array substrate
12/02/2009CN101593726A Method of manufacturing semiconductor memory apparatus and semiconductor memory apparatus manufactured thereby
12/02/2009CN101593709A Module including a sintered joint
12/02/2009CN101593482A Display driving apparatus, display module package, display panel module, and television set
12/02/2009CN101592453A Plate type heat exchanger and method of manufacturing the same
12/02/2009CN101592328A Light emitting diode lamp with radiating structure
12/02/2009CN101592327A Power type LED lamp, encapsulation process and reflow soldering process equipment thereof
12/02/2009CN101592326A Light emitting diode (LED) lamp
12/02/2009CN101592322A LED packaging method for high-power LED lighting fixtures
12/02/2009CN101592299A High energy-saving electronic illuminating lamp of electric vehicle
12/02/2009CN101592290A Light emitting diode (LED) lamp
12/02/2009CN101591472A Curable resin material composition, optical material, light-emitting device, method for producing light-emitting device, and electronic device
12/02/2009CN100566530C Micro-liquid drop refrigerating mechanism
12/02/2009CN100566529C A vacuumizing method for integrated phase change radiator of high power flat plate
12/02/2009CN100566511C Method for embedding a component in a base and forming a contact
12/02/2009CN100566507C Electronic device and method of manufacturing thereof
12/02/2009CN100566053C Semiconductor laser device having incomplete bonding region and electronic equipment
12/02/2009CN100566017C Dielectric assembly and process for manufacturing the assembly
12/02/2009CN100565910C Semiconductor device, electronic device, and method of manufacturing semiconductor device
12/02/2009CN100565909C Semiconductor device, electronic device, and method of manufacturing semiconductor device
12/02/2009CN100565905C Organic light emitting diode device and method for fabricating the same
12/02/2009CN100565904C Light-emitting device, electronic equipment, and method of manufacturing thereof
12/02/2009CN100565899C Vertical interconnect for organic electronic devices
12/02/2009CN100565891C Semiconductor device and manufacturing method of the same
12/02/2009CN100565879C A deep ditch groove high-power MOS device and the corresponding manufacturing method
12/02/2009CN100565874C Power part layout
12/02/2009CN100565873C LED luminescent device combined with rectifying circuit on secondary carrier and its production
12/02/2009CN100565871C Power semiconductor module with connecting elements which are arranged with material binding
12/02/2009CN100565870C Coupler module and its manufacture method
12/02/2009CN100565869C Integrated electromagnetic shield device
12/02/2009CN100565868C Semiconductor device
12/02/2009CN100565867C Lead frame comprising tin plating or an intermetallic layer formed therefrom and its manufacture method
12/02/2009CN100565866C Packaging for high speed integrated circuits
12/02/2009CN100565865C Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof
12/02/2009CN100565864C Encapsulation architecture and its making method
12/02/2009CN100565863C Base plate impedance match device
12/02/2009CN100565862C Embedded type chip substrate structure
12/02/2009CN100565861C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/02/2009CN100565860C Protruding block structure on base board
12/02/2009CN100565859C Semiconductor device having improved mechanical and thermal reliability
12/02/2009CN100565858C Power semiconductor module with auxiliary connector
12/02/2009CN100565857C Coated metal stud bump formed by a coated wire for flip chip
12/02/2009CN100565856C Micro-structured cooler and use thereof
12/02/2009CN100565855C Cooling device, electronic device and loudspeaker device and manufacture of cooling device
12/02/2009CN100565854C Composition for heat conductive siloxanes heat release and its using method
12/02/2009CN100565853C Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
12/02/2009CN100565852C Semiconductor component having a chip scale package (CSP) housing
12/02/2009CN100565851C Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
12/02/2009CN100565850C Semiconductor device
12/02/2009CN100565849C Structure for containing desiccant, its manufacture method and uses
12/02/2009CN100565848C Method for manufacturing electronic component, and electronic component
12/02/2009CN100565847C 半导体集成电路器件 The semiconductor integrated circuit device
12/02/2009CN100565846C Manufacturing method of LCD device and TFT completing substrate thereof
12/02/2009CN100565834C Method for implementing air bridge interconnection and chip with air bridge interconnection structure
12/02/2009CN100565830C Spatial packaging structure and method of manufacturing the same
12/02/2009CN100565827C Solder bumps formation using solder paste with shape retaining attribute after uv irradiation
12/02/2009CN100565783C Electric device containing at least four semiconductor nano wire
12/02/2009CN100565715C Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment
12/02/2009CN100565568C RFID tag and manufacturing method thereof
12/02/2009CN100565350C Substrate processing system and substrate processing method
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