Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/03/2009US20090294963 Module including a sintered joint
12/03/2009US20090294962 Packaging substrate and method for fabricating the same
12/03/2009US20090294961 Semiconductor device
12/03/2009US20090294960 Semiconductor device
12/03/2009US20090294959 Semiconductor package device, semiconductor package structure, and fabrication methods thereof
12/03/2009US20090294958 Wafer level redistribution using circuit printing technology
12/03/2009US20090294957 Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
12/03/2009US20090294956 Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof
12/03/2009US20090294955 Cooling device with a preformed compliant interface
12/03/2009US20090294954 3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME
12/03/2009US20090294953 Integrated circuit package module and method of the same
12/03/2009US20090294952 Chip package carrier and fabrication method thereof
12/03/2009US20090294951 Semiconductor device and method for manufacturing the same
12/03/2009US20090294950 Semiconductor device
12/03/2009US20090294949 Molded semiconductor device
12/03/2009US20090294948 Contrast Interposer Stacking System And Method
12/03/2009US20090294947 Chip package structure and manufacturing method thereof
12/03/2009US20090294946 Package-Borne Selective Enablement Stacking
12/03/2009US20090294945 Semiconductor device and manufacturing method therefor
12/03/2009US20090294944 Semiconductor device assembly and method thereof
12/03/2009US20090294943 Stacked structure of integrated circuits having space elements
12/03/2009US20090294942 Package on package using a bump-less build up layer (bbul) package
12/03/2009US20090294941 Package-on-package system with heat spreader
12/03/2009US20090294940 Semiconductor light emitting device
12/03/2009US20090294939 Lead frame and semiconductor device utilizing the same
12/03/2009US20090294938 Flip-chip package with fan-out wlcsp
12/03/2009US20090294937 Two-way heat extraction from packaged semiconductor chips
12/03/2009US20090294936 Four mosfet full bridge module
12/03/2009US20090294935 Semiconductor package system with cut multiple lead pads
12/03/2009US20090294934 Conductive clip for semiconductor device package
12/03/2009US20090294933 Lead Frame and Chip Package Structure and Method for Fabricating the Same
12/03/2009US20090294932 Leadframe having delamination resistant die pad
12/03/2009US20090294931 Methods of Making an Electronic Component Package and Semiconductor Chip Packages
12/03/2009US20090294930 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
12/03/2009US20090294929 Seal ring structure for integrated circuits
12/03/2009US20090294928 Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield
12/03/2009US20090294927 Semiconductor-device isolation structure and manufacturing method thereby
12/03/2009US20090294923 Structure and Method for Reducing Threshold Voltage Variation
12/03/2009US20090294922 Organic silicon oxide fine particle and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device
12/03/2009US20090294921 Semiconductor device comprising metal lines with a selectively formed dielectric cap layer
12/03/2009US20090294920 Method for forming dual high-k metal gate using photoresist mask and structures thereof
12/03/2009US20090294919 Method of forming a finfet and structure
12/03/2009US20090294918 Semiconductor wafer
12/03/2009US20090294917 Method of producing semiconductor device
12/03/2009US20090294916 Bonding method for through-silicon-via based 3d wafer stacking
12/03/2009US20090294915 TSV-Enabled Twisted Pair
12/03/2009US20090294914 Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material
12/03/2009US20090294913 Method for manufacturing semiconductor chip and semiconductor device
12/03/2009US20090294912 Semiconductor device and method for manufacturing the same
12/03/2009US20090294911 Semiconductor Device and Method of Forming Double-Sided Through Vias in Saw Streets
12/03/2009US20090294910 Silicon wafer
12/03/2009US20090294903 Anti-fusse structure and method of fabricating the same
12/03/2009US20090294902 Semiconductor device and method of manufacturing the same
12/03/2009US20090294901 Structure and method of forming electrically blown metal fuses for integrated circuits
12/03/2009US20090294900 Fuse Device
12/03/2009US20090294899 Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias
12/03/2009US20090294898 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
12/03/2009US20090294887 Semiconductor device
12/03/2009US20090294878 Circuitry and gate stacks
12/03/2009US20090294858 Transistor with contact over gate active area
12/03/2009US20090294856 I/o and power esd protection circuits by enhancing substrate-bias in deep-submicron cmos process
12/03/2009US20090294849 Resurf semiconductor device charge balancing
12/03/2009US20090294793 Led package and method of manufacturing the same
12/03/2009US20090294779 Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
12/03/2009US20090294757 Semiconductor Nanowire Vertical Device Architecture
12/03/2009US20090294115 Thermal Interconnect System and Production Thereof
12/03/2009US20090293604 Multi-chip package
12/03/2009DE4343140B4 Halbleiteranordnung zur Beeinflussung der Durchbruchsspannung von Transistoren A semiconductor device for influencing the breakdown voltage of transistors
12/03/2009DE202008010130U1 Schichtstruktur zwischen einem elektronischen Bauelement und einer Wärmesenke Layered structure between an electronic component and a heat sink
12/03/2009DE19921109B4 Elektronikbauteil und Elektronikkomponente mit einem Keramikbauteilelement Electronic component and electronic component with a ceramic component element
12/03/2009DE112006003788T5 Leadframe mit einem nichtleitenden Verbindungssteg Lead frame with a non-conductive connecting web
12/03/2009DE102009017049A1 Halbleitervorrichtung Semiconductor device
12/03/2009DE102009016649A1 Halbleitervorrichtung und Verfahren mit einem ersten und zweiten Träger A semiconductor device and method having a first and second support
12/03/2009DE102008039147A1 Optoelektronisches Modul und optoelektronische Anordnung The optoelectronic module and optoelectronic device
12/03/2009DE102008026212A1 Semiconductor device comprises a chip area with a metallization system and a semiconductor area, which are formed over a substrate, circuit elements formed in the semiconductor area, a chip seal area, a conductive path, and a ceiling area
12/03/2009DE102008026135A1 Steuerung für tiefe Temperaturen in einem Halbleiterbauelement Control for low temperatures in a semiconductor device
12/03/2009DE102008025544A1 Electronic component cooling method for use in e.g. network blade server system, involves controlling fast initiation of condensation through surface structure of used unit by control unit
12/03/2009DE102008024481A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009DE102008024480A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009DE102008024479A1 Elektrische Bauelementanordnung Electrical component assembly
12/03/2009DE102004034277B4 Vorrichtung, insbesondere in einer integrierten Schaltungsanordnung, und Verfahren zur Erfassung eines mechanischen Stresszustands in einem Halbleitersubstrat Device, in particular in an integrated circuit assembly, and methods for detecting a mechanical stress condition in a semiconductor substrate
12/03/2009DE102004015611B9 Vorrichtung und Verfahren zur Offset-Kompensation Apparatus and method for offset compensation
12/02/2009EP2129205A1 Plasma display device
12/02/2009EP2128549A1 Heat pipe having flat end face and method thereof
12/02/2009EP2128201A1 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
12/02/2009EP2126971A1 Wafer level csp packaging concept
12/02/2009EP2126969A1 Method of interconnecting electronic wafers
12/02/2009EP2126968A1 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
12/02/2009EP1266403B1 Method for connecting at least one chip to a rewiring arrangement
12/02/2009CN201355893Y Electronic equipment and cooling baseplate thereof
12/02/2009CN201355613Y Integrated circuit chip with functions of voltage conversion and on-off switch assembly
12/02/2009CN201355612Y Multi-level light emitting diode array
12/02/2009CN201355611Y Die bonding base plate with surface polishing layer
12/02/2009CN201355610Y Control chip of LED display screen
12/02/2009CN201355609Y Control chip of LED display screen
12/02/2009CN201355608Y Control chip of LED display screen
12/02/2009CN201355607Y Water-cooling three-phase two-electric-level IGBT module unit
12/02/2009CN201355020Y LED road lamp holder structure
12/02/2009CN201354979Y LED street lamp
12/02/2009CN101595562A Stacked packages
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