H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/08/2009	US7630178 Semiconductor integrated circuit
12/08/2009	US7629697 Marker structure and method for controlling alignment of layers of a multi-layered substrate
12/08/2009	US7629696 Plastic semiconductor package having improved control of dimensions
12/08/2009	US7629695 Stacked electronic component and manufacturing method thereof
12/08/2009	US7629694 Interconnections for crosswire arrays
12/08/2009	US7629693 Method for integrated circuit fabrication using pitch multiplication
12/08/2009	US7629691 Conductor geometry for electronic circuits fabricated on flexible substrates
12/08/2009	US7629690 Dual damascene process without an etch stop layer
12/08/2009	US7629689 Semiconductor integrated circuit having connection pads over active elements
12/08/2009	US7629688 Bonded structure and bonding method
12/08/2009	US7629687 Semiconductor device and method for manufacturing the same
12/08/2009	US7629686 Bumped die and wire bonded board-on-chip package
12/08/2009	US7629685 Semiconductor device package
12/08/2009	US7629684 Adjustable thickness thermal interposer and electronic package utilizing same
12/08/2009	US7629683 Thermal management of electronic devices
12/08/2009	US7629682 Wafer level package configured to compensate size difference in different types of packages
12/08/2009	US7629681 Ball grid array package with patterned stiffener surface and method of assembling the same
12/08/2009	US7629680 Direct power delivery into an electronic package
12/08/2009	US7629679 Semiconductor package, memory card including the same, and mold for fabricating the memory card
12/08/2009	US7629678 Method and system for sealing a substrate
12/08/2009	US7629677 Semiconductor package with inner leads exposed from an encapsulant
12/08/2009	US7629676 Semiconductor component having a semiconductor die and a leadframe
12/08/2009	US7629675 System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
12/08/2009	US7629674 Shielded package having shield fence
12/08/2009	US7629673 Contact etch stop film
12/08/2009	US7629665 Semiconductor component with a channel stop zone
12/08/2009	US7629654 Buried guard ring structures and fabrication methods
12/08/2009	US7629652 Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion
12/08/2009	US7629614 Electrostatic discharge protection circuit and diode thereof
12/08/2009	US7629609 Random number generating device
12/08/2009	US7629398 for encapsulating semiconductors; acrylonitrile-butadiene copolymers; polysiloxanes
12/08/2009	US7629268 Method for an improved air gap interconnect structure
12/08/2009	US7629254 Semiconductor device
12/08/2009	US7629239 Method of fabricating a semiconductor device with a dopant region in a lower wire
12/08/2009	US7629234 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
12/08/2009	US7629199 Method for fabricating semiconductor package with build-up layers formed on chip
12/08/2009	US7629188 Flip chip type LED lighting device manufacturing method
12/08/2009	US7629186 System and method for identification of a reference integrated circuit for a pick-and-place equipment
12/08/2009	US7629056 Circuit-connecting material and circuit terminal connected structure and connecting method
12/08/2009	US7629050 Circuit-connecting material and circuit terminal connected structure and connecting method
12/08/2009	US7628840 Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances
12/03/2009	WO2009146007A2 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
12/03/2009	WO2009146000A1 Vapor vortex heat sink
12/03/2009	WO2009145907A1 Semiconductor device comprising a chip internal electrical test structure allowing electrical measurements during the fabrication process
12/03/2009	WO2009145726A1 Micro electro mechanical device package and method of manufacturing a micro electro mechanical device package
12/03/2009	WO2009145196A1 Semiconductor chip, intermediate substrate and semiconductor device
12/03/2009	WO2009145111A1 Semiconductor device
12/03/2009	WO2009144960A1 Semiconductor module, semiconductor module manufacturing method and portable apparatus
12/03/2009	WO2009144920A1 Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated material
12/03/2009	WO2009144918A1 Thin film transistor, method for manufacturing the same, and electronic device using thin film transistor
12/03/2009	WO2009144643A1 Thermo-mechanical stress in semiconductor wafers
12/03/2009	WO2009144618A1 Integrated circuit manufacturing method and integrated circuit
12/03/2009	WO2009144617A1 Ldmos transistor
12/03/2009	WO2009144616A1 Ldmos transistor
12/03/2009	WO2009144608A1 Detection circuitry for detecting bonding conditions on bond pads
12/03/2009	WO2009144224A1 Hermetically sealed housing for electronic components and manufacturing method
12/03/2009	WO2009143805A1 Method and device for cohesively joining metallic connection structures
12/03/2009	WO2009143789A1 Optoelectronic component and method for producing an optoelectronic component
12/03/2009	WO2009143682A1 A heat dissipating device for a circuit board with embedded components and a fabrication method thereof
12/03/2009	WO2009124280A3 Inductor with patterned ground plane
12/03/2009	WO2009114372A3 Thermal interconnect and integrated interface systems, methods of production and uses thereof
12/03/2009	WO2008133210A9 Semiconductor device
12/03/2009	US20090298671 Compositions for Preparing Low Dielectric Materials Containing Solvents
12/03/2009	US20090298230 Stacked Module Systems and Methods
12/03/2009	US20090298219 Method for Manufacturing Solid-State Image Pickup Device Module
12/03/2009	US20090297785 Electronic device and method of manufacturing the same
12/03/2009	US20090297303 Thin Plate Container and Processing Apparatus for Thin Plate Container
12/03/2009	US20090295459 Temperature control device
12/03/2009	US20090295421 Test pattern of semiconductor device, method of manufacturing the same, and method of testing device using test pattern
12/03/2009	US20090294995 Overlay mark
12/03/2009	US20090294994 Bond pad structure
12/03/2009	US20090294993 Packaging substrate structure
12/03/2009	US20090294992 Embedding device in substrate cavity
12/03/2009	US20090294991 Flip-chip interconnection with formed couplings
12/03/2009	US20090294990 Semiconductor memory device and manufacturing method thereof
12/03/2009	US20090294989 Formation of vertical devices by electroplating
12/03/2009	US20090294988 Semiconductor device and method for manufacturing the same
12/03/2009	US20090294987 Semiconductor device and manufacturing method thereof
12/03/2009	US20090294986 Methods of Forming Conductive Features and Structures Thereof
12/03/2009	US20090294985 Thin chip scale semiconductor package
12/03/2009	US20090294984 Three-dimensional integrated heterogeneous semiconductor structure
12/03/2009	US20090294983 Hybrid conductive vias including small dimension active surface ends and larger dimension back side ends, semiconductor devices including the same, and associated methods
12/03/2009	US20090294982 Interconnect structures with ternary patterned features generated from two lithographic processes
12/03/2009	US20090294981 Methods for Defining and Using Co-Optimized Nanopatterns for Integrated Circuit Design and Apparatus Implementing Same
12/03/2009	US20090294980 Semiconductor device having wiring layer
12/03/2009	US20090294979 Semiconductor substrate and method of manufacturing the same
12/03/2009	US20090294978 Semiconductor device, and manufacturing method therefor
12/03/2009	US20090294977 Semiconductor die and bond pad arrangement method thereof
12/03/2009	US20090294976 Method of Manufacuturing Semiconductor Memory Apparatus and Semiconductor Memory Apparatus Manufactured Thereby
12/03/2009	US20090294975 Package for a Die
12/03/2009	US20090294974 Bonding method for through-silicon-via based 3d wafer stacking
12/03/2009	US20090294973 Interconnect structure for integrated circuits having improved electromigration characteristics
12/03/2009	US20090294972 Substrate for semiconductor package, method for manufacturing the same, and semiconductor package having the same
12/03/2009	US20090294971 Electroless nickel leveling of lga pad sites for high performance organic lga
12/03/2009	US20090294970 High frequency interconnect pad structure
12/03/2009	US20090294969 Semiconductor contact formation system and method
12/03/2009	US20090294968 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
12/03/2009	US20090294966 Carbon nanotubes as interconnects in integrated circuits and method of fabrication
12/03/2009	US20090294965 Method of Manufacturing A Semiconductor Device
12/03/2009	US20090294964 Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus

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