Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/09/2009CN201359271Y Light emitting diode lamp core and light emitting diode lamp made from same
12/09/2009CN201359218Y LED fluorescent lamp
12/09/2009CN201359211Y LED light source module
12/09/2009CN101601134A Chip on leads
12/09/2009CN101601133A Partially patterned lead frames and methods of making and using the same in semiconductor packaging
12/09/2009CN101601132A Chip cooling channels formed in wafer bonding gap
12/09/2009CN101601131A Structure for mounting semiconductor package
12/09/2009CN101601130A Heat transport assembly
12/09/2009CN101601129A Mounting board and electronic device
12/09/2009CN101600328A Temperature control unit for electronic component and handler apparatus
12/09/2009CN101600327A Temperature control unit for electronic component and handler apparatus
12/09/2009CN101600326A Electronic apparatus cooling device
12/09/2009CN101600325A Combination heat sink of closed shell electronic equipment
12/09/2009CN101600322A Heat radiator
12/09/2009CN101600321A Radiator fan and electronic device adopting same
12/09/2009CN101600320A Heat radiator
12/09/2009CN101600319A Heat radiator
12/09/2009CN101599538A Organic EL luminous element, production method thereof and display device
12/09/2009CN101599534A Organic light emitting device, method of manufacturing the same, display unit, and electronic device
12/09/2009CN101599517A Light emitting diode (LED) packaging structure with electrostatic protection function and manufacturing method thereof
12/09/2009CN101599503A Display device, method of laying out wiring in display device, and electronic device
12/09/2009CN101599498A 半导体器件 Semiconductor devices
12/09/2009CN101599497A Thin-film-transistor array substrate and forming method thereof
12/09/2009CN101599496A Base plate and mother base plate of thin-film transistor
12/09/2009CN101599494A Nonvolatile memory devices having electromagnetically shielding source plates
12/09/2009CN101599491A ESD protection circuit and semiconductor device
12/09/2009CN101599486A Mcm packages
12/09/2009CN101599485A Horizontal type high-power thyristor valve string voltage-sharing transition device
12/09/2009CN101599484A Resin sealed semiconductor device and manufacturing method therefor
12/09/2009CN101599483A Stacked die package
12/09/2009CN101599482A Stack structure for chip packaging
12/09/2009CN101599480A Semiconductor chip encapsulating structure
12/09/2009CN101599479A Electrical fuse, semiconductor device and method of disconnecting electrical fuse
12/09/2009CN101599478A Contact hole arrangement structure
12/09/2009CN101599477A Semiconductor device and method of manufacturing the same
12/09/2009CN101599476A Thin double-sided packaging substrate and preparation method thereof
12/09/2009CN101599475A Buried circuit board and flip-chip encapsulating structure
12/09/2009CN101599474A Integrated circuit module and manufacture method thereof
12/09/2009CN101599473A Circuit structure and its forming method
12/09/2009CN101599472A Semiconductor encapsulation structure with front face electricity conductivity but not base plate and producing method thereof
12/09/2009CN101599471A Cooling structure of power device and manufacturing method thereof
12/09/2009CN101599470A Sensor assembly and method for manufacturing the same
12/09/2009CN101599469A Semiconductor chip encapsulation structure with back surface electricity conductivity and producing method thereof
12/09/2009CN101599468A Electronic component
12/09/2009CN101599467A Mounting device for electronic component
12/09/2009CN101599466A Graphic substrate for epitaxial growth and production method thereof
12/09/2009CN101599465A Semiconductor structure for protecting chip
12/09/2009CN101599454A Semiconductor element isolating structure and forming method thereof
12/09/2009CN101599446A Electronic device and method of manufacturing the same
12/09/2009CN101599440A Conductive coating structure and manufacture technique thereof
12/09/2009CN101599439A Semiconductor die and bond pad arrangement method thereof
12/09/2009CN101599438A Circuit structure and manufacture method thereof
12/09/2009CN101598321A Lighting module and inlet air cooling system
12/09/2009CN101598320A Thermotube heat dissipation device of LED lamp adopting enhanced evaporation section
12/09/2009CN101598319A LED street lamp heat transfer device and method for vacuumizing inner cavity of heat transfer device
12/09/2009CN101598318A Heat radiator
12/09/2009CN101598317A Manufacturing method of radiator
12/09/2009CN101598316A Hollow polyhedral metal auto-radiating circuit board
12/09/2009CN101598315A Illumination device and radiation structure thereof
12/09/2009CN101598314A Light emitting diode lamp
12/09/2009CN101598312A 发光二极管结构 Light-emitting diode structure
12/09/2009CN101598306A Method for assembling high power LED in lamps and lanterns
12/09/2009CN101598305A Packaging structure of LED heat dissipation base
12/09/2009CN101598283A Modular two-stage radiation LED street lamp
12/09/2009CN101598282A Led路灯 Led lights
12/09/2009CN101598268A Photocatalyst lamp
12/09/2009CN101598265A Low heat emission type multi-wavelength LED
12/09/2009CN101597477A Aquo dispersoid, circuit board and manufacture method thereof for chemical mechanical polishing
12/09/2009CN101597475A Encapsulation material composition and encapsulation material manufacture method
12/09/2009CN100569045C Light-receiving element
12/09/2009CN100568627C Module power supply pin structural parts
12/09/2009CN100568564C Light emitting device and method for producing light emitting device
12/09/2009CN100568558C Electroluminescent module
12/09/2009CN100568557C Semi-conductor high power luminous module having heat insulating effect
12/09/2009CN100568556C Method for forming reflection cover and its structure and bearing device using the same
12/09/2009CN100568528C Electronic device and process for forming same
12/09/2009CN100568527C Display device
12/09/2009CN100568523C Display unit
12/09/2009CN100568511C A multi-bit programmable non-volatile memory unit, array and manufacturing method thereof
12/09/2009CN100568504C 半导体集成电路 The semiconductor integrated circuit
12/09/2009CN100568503C High-brightness LED with protective function of electrostatic discharge damage
12/09/2009CN100568501C Electronic apparatus
12/09/2009CN100568500C Semiconductor structure manufacturing method and semiconductor structure manufactured thereby
12/09/2009CN100568499C Interconnection having dual-level or multi-level capping layer and method of forming the same
12/09/2009CN100568498C Semiconductor device and a manufacturing method of the same
12/09/2009CN100568497C Electronic device cooling device and electronic device cooling method
12/09/2009CN100568496C Modular capillary pumped loop cooling system
12/09/2009CN100568495C Integrated circuit nanotube-based substrate
12/09/2009CN100568494C Heat sink and electronic equipment
12/09/2009CN100568493C Water-cooling radiating module device of display card
12/09/2009CN100568492C Heat radiator of computer CPU
12/09/2009CN100568491C Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
12/09/2009CN100568490C Connector
12/09/2009CN100568489C 电路模块及其制造方法 Circuit module and manufacturing method thereof
12/09/2009CN100568450C Method and structure of lamellar microdomains for aligning block copolymer on substrate
12/09/2009CN100568422C Plated terminals
12/09/2009CN100567809C Surface type LED lamp with high heat radiation
12/09/2009CN100567436C Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
12/09/2009CN100567150C Zeolite sol and its preparation method, composition for forming multiporous film, multiporous film and its preparation method, interlayer insulation membrane and semiconductor device
12/08/2009US7631279 Semiconductor integrated device and apparatus for designing the same