Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/11/2014US20140252440 Semiconductor devices including conductive plug
09/11/2014US20140252435 Semiconductor device
09/11/2014US20140252424 Methods of forming semiconductor device with self-aligned contact elements and the resulting devices
09/11/2014US20140252410 Module and Assembly with Dual DC-Links for Three-Level NPC Applications
09/11/2014US20140252401 Lead frame and light emitting device
09/11/2014US20140252399 Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same
09/11/2014US20140252342 Encapsulation barrier stack
09/11/2014US20140252306 Monolithic three dimensional integration of semiconductor integrated circuits
09/11/2014DE112013000405T5 Film-Interposer für integrierte Schaltkreise Film interposer for integrated circuits
09/11/2014DE112012005472T5 Elektrische Leistungs-Halbleitervorrichtung und Verfahren zu deren Herstellung Electrical power semiconductor device and process for their preparation
09/11/2014DE112012003214T5 Halbleiter-Leistungsmodul, Herstellungsverfahren für Halbleiter-Leistungsmodul und Schaltkreissubstrat The semiconductor power module manufacturing method for semiconductor power module and circuit substrate
09/11/2014DE112011106068T5 MEMS auf Rückseite von Bulk-Silizium MEMS on back of bulk silicon
09/11/2014DE112011105990T5 Integriertes 3D-Schaltungspaket mit Fensterinterposer Integrated circuit package with 3D window interposer
09/11/2014DE112011105848T5 Kontrollierte Anlötchip-Integrationen an Baugruppen und Verfahren zur Montage derselben Controlled Anlötchip integrations to modules and method of assembling same
09/11/2014DE102014201446A1 Integrierte Schaltungen und Verfahren zum Herstellen integrierter Schaltungen mit Deckschichten zwischen Metallkontakten und Zwischenverbindungen Integrated circuits and methods for manufacturing integrated circuits with outer layers between metal contacts and interconnections
09/11/2014DE102014103050A1 Halbleiter-Bauelement und Verfahren zu dessen Herstellung A semiconductor device and method for its production
09/11/2014DE102014102944A1 Eine Package-Anordnung und ein Verfahren zur Herstellung einer Package-Anordnung A package assembly and a method of manufacturing a package assembly
09/11/2014DE102014102917A1 Abzugsstrecken Withdrawal routes
09/11/2014DE102014102910A1 Chipträgerstruktur, Chipgehäuse und Verfahren zu deren Herstellung Chip carrier structure, chip package and process for their preparation
09/11/2014DE102014102899A1 Leistungshalbleiter-Zusammenbau und -Modul Power semiconductor module assembly and
09/11/2014DE102013205526B3 Thermoelektrisches System, Verfahren zum Herstellen eines thermoelektrischen Systems und Verwendung eines thermoelektrischen Systems A thermoelectric system, method of making a thermoelectric system and the use of a thermoelectric system
09/11/2014DE102013204018A1 Steuergerät für ein Kraftfahrzeug Control unit for a motor vehicle
09/11/2014DE102013203932A1 Elektronische, optoelektronische oder elektrische Anordnung Electronic, optoelectronic or electrical arrangement
09/11/2014DE102013203759A1 Optoelektronisches Bauelement und elektronisches Gerät mit optoelektronischem Bauelement Optoelectronic device and electronic device with optoelectronic device
09/11/2014DE102013106840A1 Zwischenverbindungsstruktur, die Schäden an der Isolierschicht vermeidet, und Verfahren für ihre Herstellung Interconnect structure that avoids damage to the insulating layer, and methods for their preparation
09/11/2014DE102013104368A1 Verfahren für die Ausbildung einer Verbindungsstruktur A method for forming an interconnection structure
09/11/2014DE102013102213A1 Miniaturisiertes Bauelement und Verfahren zur Herstellung Miniaturized device and method for producing
09/11/2014DE102012110322B4 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate
09/11/2014DE102010054781B4 Modul zur Reduzierung von thermomechanischem Stress und Verfahren zu dessen Herstellung Module to reduce thermo-mechanical stress and process for its preparation
09/11/2014DE102010036978B4 Bauelement mit einer ringförmigen Metallstruktur und Verfahren Component with an annular metal structure and procedures
09/11/2014DE102006006421B4 Leistungshalbleitermodul The power semiconductor module
09/10/2014EP2775527A2 Field effect transistor and semiconductor device using the same
09/10/2014EP2775524A1 Semiconductor device
09/10/2014EP2775523A1 Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
09/10/2014EP2775522A1 An insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure
09/10/2014EP2775521A2 Power Quad Flat No-Lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
09/10/2014EP2775520A2 Open source Power Quad Flat No-Lead (PQFN) leadframe
09/10/2014EP2775519A2 Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
09/10/2014EP2775518A2 Power Quad Flat No-Lead (PQFN) package in a single shunt inverter circuit
09/10/2014EP2775517A1 Microchannel cooling device, microchannel cooling system, and electronic instrument
09/10/2014EP2775516A2 Balanced stress assembly for semiconductor devices with one or more devices bonded on both sides to lead frames, the other sides of the lead frames being bonded to AlN, Al2O3 or Si3N4 substrates
09/10/2014EP2775515A1 Semiconductor device and manufacturing method thereof
09/10/2014EP2775514A2 Resin-sealed electronic device
09/10/2014EP2775513A1 Photoreception device, and method for producing photoreception device
09/10/2014EP2775512A2 Semiconductor devices
09/10/2014EP2774465A1 Shielding structure for electronic device
09/10/2014EP2774166A1 Improved composite getters
09/09/2014US8832631 Integrated circuit apparatus, systems, and methods
09/09/2014US8832463 Method of verifying an identification circuit
09/09/2014US8831536 Wireless device with multi-port distributed antenna
09/09/2014US8830773 Semiconductor device having compensation capacitance
09/09/2014US8830695 Encapsulated electronic device
09/09/2014US8830691 Printed circuit board and method of manufacturing printed circuit board
09/09/2014US8830689 Interposer-embedded printed circuit board
09/09/2014US8830679 Receptacle heat sink connection
09/09/2014US8830678 Heat sink system having thermally conductive rods
09/09/2014US8830674 Cooling system and electronic device including the cooling system
09/09/2014US8830010 High frequency circuit module with a filter in a core layer of a circuit substrate
09/09/2014US8829986 Structure and method for integrated synaptic element
09/09/2014US8829968 Semiconductor integrated circuit device
09/09/2014US8829918 Die connection monitoring system and method
09/09/2014US8829694 Thermosetting resin compositions with low coefficient of thermal expansion
09/09/2014US8829693 Supply voltage or ground connections for integrated circuit device
09/09/2014US8829692 Multilayer packaged semiconductor device and method of packaging
09/09/2014US8829691 Light-emitting device package and method of manufacturing the same
09/09/2014US8829690 System of chip package build-up
09/09/2014US8829689 Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
09/09/2014US8829688 Semiconductor device with means for preventing solder bridges, and method for manufacturing semiconductor device
09/09/2014US8829687 Semiconductor package and fabrication method thereof
09/09/2014US8829686 Package-on-package assembly including adhesive containment element
09/09/2014US8829685 Circuit device having funnel shaped lead and method for manufacturing the same
09/09/2014US8829684 Integrated circuit package
09/09/2014US8829683 Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
09/09/2014US8829682 Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same
09/09/2014US8829681 Semiconductor device having groove-shaped via-hole
09/09/2014US8829679 Semiconductor device and method for manufacturing the same
09/09/2014US8829678 Semiconductor package and method for manufacturing the same
09/09/2014US8829677 Semiconductor die having fine pitch electrical interconnects
09/09/2014US8829676 Interconnect structure for wafer level package
09/09/2014US8829675 Repairing anomalous stiff pillar bumps
09/09/2014US8829674 Stacked multi-chip package and method of making same
09/09/2014US8829673 Bonded structures for package and substrate
09/09/2014US8829672 Semiconductor package, package structure and fabrication method thereof
09/09/2014US8829671 Compliant core peripheral lead semiconductor socket
09/09/2014US8829670 Through silicon via structure for internal chip cooling
09/09/2014US8829669 Semiconductor device
09/09/2014US8829668 Electronic device
09/09/2014US8829667 Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same
09/09/2014US8829666 Semiconductor packages and methods of packaging semiconductor devices
09/09/2014US8829665 Semiconductor chip and stack package having the same
09/09/2014US8829664 Three dimensional integrated circuits
09/09/2014US8829663 Stackable semiconductor package with encapsulant and electrically conductive feed-through
09/09/2014US8829661 Warp compensated package and method
09/09/2014US8829660 Resin-encapsulated semiconductor device
09/09/2014US8829656 Semiconductor package including interposer with through-semiconductor vias
09/09/2014US8829655 Semiconductor package including a substrate and an interposer
09/09/2014US8829654 Semiconductor package with interposer
09/09/2014US8829653 Exclusion zone for stress-sensitive circuit design
09/09/2014US8829649 Semiconductor device having a resistive element including a TaSiN layer
09/09/2014US8829646 Integrated circuit 3D memory array and manufacturing method
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