H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/10/2009	WO2009147148A1 Stacked electronic device and process for fabricating such an electronic device
12/10/2009	WO2009147099A1 Cooling system for an led chip array
12/10/2009	WO2009146695A2 Heat transfer device comprising a semiconductor component and connecting device for the operation thereof
12/10/2009	WO2009146588A1 Bonding method for through-silicon-via based 3d wafer stacking
12/10/2009	WO2009146587A1 Bongding method for through-silicon-via based 3d wafer stacking
12/10/2009	WO2009122452A3 An integrated circuit
12/10/2009	WO2009100698A3 Method for low-temperature pressure sintering of a heat sink plate to the substrate of an electronic unit
12/10/2009	WO2008115468A4 Integrated circuits and interconnect structure for integrated circuits
12/10/2009	US20090305494 Bump structure for a semiconductor device and method of manufacture
12/10/2009	US20090302486 Semiconductor substrate and manufacturing method thereof
12/10/2009	US20090302485 Laminate substrate and semiconductor package utilizing the substrate
12/10/2009	US20090302484 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/10/2009	US20090302483 Stacked die package
12/10/2009	US20090302481 Semiconductor device and manufacturing method thereof
12/10/2009	US20090302480 Through Substrate Via Semiconductor Components
12/10/2009	US20090302479 Semiconductor structures having vias
12/10/2009	US20090302478 Semiconductor device and method of forming recessed conductive vias in saw streets
12/10/2009	US20090302477 Integrated circuit with embedded contacts
12/10/2009	US20090302476 Structures and Methods to Enhance CU Interconnect Electromigration (EM) Performance
12/10/2009	US20090302475 Semiconductor device and manufacturing method thereof
12/10/2009	US20090302474 Atomic laminates for diffucion barrier applications
12/10/2009	US20090302473 Semiconductor device and manufacturing method thereof
12/10/2009	US20090302472 Non-volatile memory devices including shared bit lines and methods of fabricating the same
12/10/2009	US20090302471 Semiconductor device and manufacturing method therefor
12/10/2009	US20090302469 Semiconductor device and method for manufacturing thereof
12/10/2009	US20090302468 Printed circuit board comprising semiconductor chip and method of manufacturing the same
12/10/2009	US20090302467 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
12/10/2009	US20090302466 Semiconductor device and method for manufacturing the same
12/10/2009	US20090302465 Die rearrangement package structure and method thereof
12/10/2009	US20090302464 Semiconductor device
12/10/2009	US20090302463 Semiconductor device having substrate with differentially plated copper and selective solder
12/10/2009	US20090302462 Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device
12/10/2009	US20090302461 Systems, devices, and methods for semiconductor device temperature management
12/10/2009	US20090302460 Self-assembled monolayer release films
12/10/2009	US20090302459 Heat Sink with Thermally Compliant Beams
12/10/2009	US20090302458 Heat Sink For Power Module
12/10/2009	US20090302457 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof
12/10/2009	US20090302456 Method for manufacturing semiconductor device
12/10/2009	US20090302455 Semiconductor device and method for manufacturing the same
12/10/2009	US20090302454 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
12/10/2009	US20090302453 Contact pads for silicon chip packages
12/10/2009	US20090302452 Mountable integrated circuit package-in-package system
12/10/2009	US20090302451 Semiconductor device having function circuits selectively connected to bonding wire
12/10/2009	US20090302450 Semiconductor device and method of manufacturing semiconductor device
12/10/2009	US20090302449 Packaged products, including stacked package modules, and methods of forming same
12/10/2009	US20090302448 Chip Stacked Structure and the Forming Method
12/10/2009	US20090302447 Semiconductor arrangement having specially fashioned bond wires and method for fabricating such an arrangement
12/10/2009	US20090302446 Semiconductor package fabricated by cutting and molding in small windows
12/10/2009	US20090302445 Method and Apparatus for Thermally Enhanced Semiconductor Package
12/10/2009	US20090302444 Resin sealed semiconductor device and manufacturing method therefor
12/10/2009	US20090302443 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
12/10/2009	US20090302442 Integrated circuit packaging system with isolated pads and method of manufacture thereof
12/10/2009	US20090302441 Col (chip-on-lead) multi-chip package
12/10/2009	US20090302440 Noise isolation between circuit blocks in an integrated circuit chip
12/10/2009	US20090302439 Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference
12/10/2009	US20090302438 Ic having voltage regulated integrated faraday shield
12/10/2009	US20090302437 Semiconductor Device and Method of Connecting a Shielding Layer to Ground Through Conductive Vias
12/10/2009	US20090302436 Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor
12/10/2009	US20090302435 Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference
12/10/2009	US20090302430 Semiconductor device and method of manufacturing the same
12/10/2009	US20090302429 Electrically Conducting Connection with Insulating Connection Medium
12/10/2009	US20090302428 Laser beam machining method and semiconductor chip
12/10/2009	US20090302427 Semiconductor Chip with Reinforcement Structure
12/10/2009	US20090302418 Fuse structure of a semiconductor device
12/10/2009	US20090302417 Structure and method to form dual silicide e-fuse
12/10/2009	US20090302416 Programmable Electrical Fuse
12/10/2009	US20090302317 Switching device and testing apparatus
12/10/2009	US20090302109 Protection Against Manipulation and Through-Drilling for an Apparatus to be Connected to an Electrical Circuit
12/10/2009	DE10239796B4 Hochfrequenz-Leitungswandler, -Komponente, -Modul und Kommunikationsvorrichtung High-frequency transducer cable, component, module and communication apparatus
12/10/2009	DE102008026211A1 Halbleiterbauelement mit Metallleitungen mit einer selektiv gebildeten dielektrischen Deckschicht A semiconductor device comprising metal lines having a selectively formed dielectric coating layer
12/10/2009	DE102008025202A1 Hermetisch geschlossenes Gehäuse für elektronische Bauelemente und Herstellungsverfahren Hermetically sealed enclosure for electronic components and manufacturing processes
12/10/2009	DE102008002268A1 Sensor i.e. micromechanical sensor, arrangement, has sensor module arranged on side of carrier element, where carrier element and sensor module are partially enclosed by housing and side of carrier element has metallic coating
12/10/2009	DE102006040187B4 Kühlsystem und Kühlverfahren zur Kühlung von Bauelementen einer Leistungselektronik Cooling system and cooling method for cooling components of a power electronics
12/09/2009	EP2131637A1 Method for producing multilayer ceramic substrate and composite sheet
12/09/2009	EP2131395A1 Semiconductor device and manufacturing method for the same
12/09/2009	EP2131394A1 Semiconductor device and method for manufacturing the same
12/09/2009	EP2131393A1 Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
12/09/2009	EP2131392A1 Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device
12/09/2009	EP2131391A2 Method of making self-aligned nanotube contact structures
12/09/2009	EP2131312A1 Electronic device, electronic equipment in which electronic device is packaged, article to which electronic device is mounted, and electronic device manufacturing method
12/09/2009	EP2131101A1 Lamp
12/09/2009	EP2130932A1 Production of composite materials with high thermal conductivity
12/09/2009	EP2130872A1 Thermosetting composition
12/09/2009	EP2130419A1 Method for fitting an electrical component to a contacting element and contacting element with an electrical component
12/09/2009	EP2130393A1 Identity carrier
12/09/2009	EP2130224A2 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
12/09/2009	EP2130223A1 Dual or multiple row package
12/09/2009	EP2130222A1 A carrier for bonding a semiconductor chip onto and a method of contacting a semiconductor chip to a carrier
12/09/2009	EP2130221A1 Wire bond integrated circuit package for high speed i/o
12/09/2009	EP2130220A1 Integrated circuit with flexible planer leads
12/09/2009	EP2059948B1 Regulated power supply for a circuit
12/09/2009	EP1749315B1 Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
12/09/2009	EP1272020B1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
12/09/2009	EP0986098B1 Soldering material for die bonding
12/09/2009	CN201360390Y Heat radiator
12/09/2009	CN201360012Y Light-emitting diode heat exchange structure
12/09/2009	CN201360006Y Commutation diode
12/09/2009	CN201360003Y Memory with radiating fin and assembling tool thereof
12/09/2009	CN201360002Y Device for solving coplanarity in lead frame of large scale integrated circuit
12/09/2009	CN201360001Y Surface mounting micro-diode of improved structure

1 ... 699 700 701 702 703 704 705 706 707 708 709 710 711 712 713 714 715 716 717 718 719 ... 2262