| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/16/2009 | CN101604675A Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same |
| 12/16/2009 | CN101604674A Wafer level fan-out chip packaging structure |
| 12/16/2009 | CN101604673A Welding pad structure |
| 12/16/2009 | CN101604672A Constant current and voltage controller carrying out pin multiplexing and a three-pin package |
| 12/16/2009 | CN101604671A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 12/16/2009 | CN101604670A Grid welding spot structure for preventing metal layers from shedding in chip pressure welding and forming method thereof |
| 12/16/2009 | CN101604669A Semiconductor device and manufacturing method of the semiconductor device |
| 12/16/2009 | CN101604668A Pb-free solder-connected structure and electronic device |
| 12/16/2009 | CN101604667A Semiconductor arrangement having specially fashioned bond wires and method for fabricating such an arrangement |
| 12/16/2009 | CN101604666A Sapphire substrate and polishing method and application thereof |
| 12/16/2009 | CN101604665A Buried contact devices for nitride-based films and manufacture thereof |
| 12/16/2009 | CN101604663A Well regions of semiconductor devices |
| 12/16/2009 | CN101604643A Connection method and substrate |
| 12/16/2009 | CN101603676A High-power LED heat-dissipating system |
| 12/16/2009 | CN101603674A Strengthened heat dissipation type LED illuminating device |
| 12/16/2009 | CN101603673A LED illuminating device |
| 12/16/2009 | CN101603672A Heat dissipation type light emitting diode (LED) street lamp |
| 12/16/2009 | CN100570914C LED using alloy to fix chip |
| 12/16/2009 | CN100570910C Surface mounting type led |
| 12/16/2009 | CN100570896C Thin-film transistor, active array substrate and manufacturing method thereof |
| 12/16/2009 | CN100570895C Thin film transistor and method of manufacturing the same |
| 12/16/2009 | CN100570883C Light emitting device having multiple light emitting elements |
| 12/16/2009 | CN100570875C LED panel and its active element array substrate |
| 12/16/2009 | CN100570874C Power metal oxide silicon field effect transistor |
| 12/16/2009 | CN100570873C Capacitor and forming method thereof |
| 12/16/2009 | CN100570870C Cascade integrate circuit and semiconductor element |
| 12/16/2009 | CN100570868C 电路板及其制造方法 The circuit board and its manufacturing method |
| 12/16/2009 | CN100570867C Tape carrier package and display device including the tape carrier package |
| 12/16/2009 | CN100570866C 接线板 Wiring board |
| 12/16/2009 | CN100570865C Heat radiating device |
| 12/16/2009 | CN100570864C Pixel structure and its manufacture method |
| 12/16/2009 | CN100570853C Semiconductor component and manufacturing method thereof |
| 12/16/2009 | CN100570843C A semiconductor package manufacturing method and semiconductor apparatus |
| 12/16/2009 | CN100570814C Methods for forming patterns of block copolymers and related semiconductor structure |
| 12/16/2009 | CN100569857C Polyimidesiloxane solution composition |
| 12/16/2009 | CN100569850C Epoxy resin molding material for encapsulation and electronic device |
| 12/16/2009 | CN100569515C Device and its producing method, photoelectric device and electronic machine |
| 12/15/2009 | USRE41039 Stackable chip package with flex carrier |
| 12/15/2009 | US7633758 Module type multiphase inverter |
| 12/15/2009 | US7633752 Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
| 12/15/2009 | US7633618 Method and apparatus for measuring the relative position of a first and a second alignment mark |
| 12/15/2009 | US7633170 Semiconductor device package and manufacturing method thereof |
| 12/15/2009 | US7633169 Chip package structure |
| 12/15/2009 | US7633168 Method, system, and apparatus for a secure bus on a printed circuit board |
| 12/15/2009 | US7633167 Semiconductor device and method for manufacturing same |
| 12/15/2009 | US7633166 Terminal connection structure for semiconductor device |
| 12/15/2009 | US7633165 Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV |
| 12/15/2009 | US7633164 Liquid crystal display device and manufacturing method therefor |
| 12/15/2009 | US7633163 Very low dielectric constant plasma-enhanced CVD films |
| 12/15/2009 | US7633162 Electronic circuit with embedded memory |
| 12/15/2009 | US7633161 Dielectric interlayer, antidiffusion film, copper seed layer; vapor deposition; atomic layer deposition |
| 12/15/2009 | US7633160 Window-type semiconductor package to avoid peeling at moldflow entrance |
| 12/15/2009 | US7633159 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages |
| 12/15/2009 | US7633158 Electronic component comprising a cooling surface |
| 12/15/2009 | US7633157 Microelectronic devices having a curved surface and methods for manufacturing the same |
| 12/15/2009 | US7633156 Acoustic transducer module |
| 12/15/2009 | US7633155 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
| 12/15/2009 | US7633154 Encapsulation and methods thereof |
| 12/15/2009 | US7633153 Semiconductor module |
| 12/15/2009 | US7633152 Heat dissipation in integrated circuits |
| 12/15/2009 | US7633151 Integrated circuit package lid with a wetting film |
| 12/15/2009 | US7633150 Semiconductor device and method for manufacturing semiconductor device |
| 12/15/2009 | US7633149 Integrated circuit arrangement |
| 12/15/2009 | US7633148 Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes |
| 12/15/2009 | US7633147 Semiconductor unit having two device terminals for every one input/output signal |
| 12/15/2009 | US7633146 Semiconductor device and a method of manufacturing the same |
| 12/15/2009 | US7633145 Semiconductor device with antenna and separating layer |
| 12/15/2009 | US7633143 Semiconductor package having plural chips side by side arranged on a leadframe |
| 12/15/2009 | US7633142 Flexible core for enhancement of package interconnect reliability |
| 12/15/2009 | US7633141 Semiconductor device having through contact blocks with external contact areas |
| 12/15/2009 | US7633140 Inverted J-lead for power devices |
| 12/15/2009 | US7633139 Semiconductor diode device with lateral transistor |
| 12/15/2009 | US7633127 Silicide gate transistors and method of manufacture |
| 12/15/2009 | US7633125 Integration of silicon boron nitride in high voltage and small pitch semiconductors |
| 12/15/2009 | US7633096 Silicon-controlled rectifier for electrostatic discharge protection circuits and structure thereof |
| 12/15/2009 | US7633034 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| 12/15/2009 | US7632759 Semiconductor device with front side metallization and method for the production thereof |
| 12/15/2009 | US7632753 Wafer level package utilizing laser-activated dielectric material |
| 12/15/2009 | US7632751 Semiconductor device having via connecting between interconnects |
| 12/15/2009 | US7632725 Method of forming ESD protection device with thick poly film |
| 12/15/2009 | US7632719 Wafer-level chip scale package and method for fabricating and using the same |
| 12/15/2009 | US7632717 Plastic overmolded packages with mechancially decoupled lid attach attachment |
| 12/15/2009 | US7632716 Package for high frequency usages and its manufacturing method |
| 12/15/2009 | US7632711 Fabrication method for chip size package and non-chip size package semiconductor devices |
| 12/15/2009 | US7632710 Method for soldering electronic component and soldering structure of electronic component |
| 12/15/2009 | US7632331 first phase as a disperse metallic phase that is dispersed on a support of the second metal oxides phase; ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed which forms droplets of aerosol |
| 12/15/2009 | US7631422 Method of manufacturing wiring substrate having terminated buses |
| 12/15/2009 | CA2468441C Optical semiconductor device |
| 12/15/2009 | CA2355171C Method of applying a phase change thermal interface material |
| 12/10/2009 | WO2009149463A2 Systems, devices, and methods for semiconductor device temperature management |
| 12/10/2009 | WO2009148855A1 Interconnect structure for integrated circuits having improved electromigration characteristics |
| 12/10/2009 | WO2009148768A2 Foil based semiconductor package |
| 12/10/2009 | WO2009148722A2 Adhesive encapsulating composition and electronic devices made therewith |
| 12/10/2009 | WO2009148168A1 Substrate for power module, power module, and method for producing substrate for power module |
| 12/10/2009 | WO2009147956A1 Multilayer wiring board |
| 12/10/2009 | WO2009147936A1 Method for manufacturing multilayer printed wiring board |
| 12/10/2009 | WO2009147771A1 Graphite complex and manufacturing method thereof |
| 12/10/2009 | WO2009147768A1 Semiconductor device |
| 12/10/2009 | WO2009147547A1 Electronic device and method of manufacturing an electronic device |
| 12/10/2009 | WO2009147546A1 Method for manufacturing an electronic device |