| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/17/2009 | US20090309201 Lead frame, semiconductor device, method for manufacturing lead frame and method for manufacturing semiconductor device |
| 12/17/2009 | US20090309200 Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device |
| 12/17/2009 | US20090309199 Chip package for semiconductor devices |
| 12/17/2009 | US20090309198 Integrated circuit package system |
| 12/17/2009 | US20090309197 Integrated circuit package system with internal stacking module |
| 12/17/2009 | US20090309184 Structure and method to form e-fuse with enhanced current crowding |
| 12/17/2009 | US20090309183 Method for manufacturing semiconductor device |
| 12/17/2009 | US20090309182 Electrostatic discharge protection structure |
| 12/17/2009 | US20090309175 Electromechanical system having a controlled atmosphere, and method of fabricating same |
| 12/17/2009 | US20090309122 Light emitting diode package |
| 12/17/2009 | US20090309116 Semiconductor device member, production method of semiconductor-device-member formation liquid and semiconductor device member, and semiconductor-device-member formation liquid, phosphor composition, semiconductor light-emitting device, lighting system and image display system using the same |
| 12/17/2009 | US20090309098 Interconnection of electronic devices with raised leads |
| 12/17/2009 | US20090309097 Testing device on water for monitoring vertical mosfet on-resistance |
| 12/17/2009 | US20090308756 Probe structure coaxial elongated electrical conductor projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
| 12/17/2009 | US20090308655 Combination extruded and cast metal outdoor electronics enclosure |
| 12/17/2009 | DE112008000446T5 Halbleitermodule und Wechselrichtervorrichtung Semiconductor modules and inverter device |
| 12/17/2009 | DE112008000371T5 Halbleiterelement-Kühlstruktur A semiconductor element cooling structure |
| 12/17/2009 | DE102009023397A1 Halbleiterbauelement Semiconductor device |
| 12/17/2009 | DE102009023396A1 Geformtes Halbleiterbauelement Shaped semiconductor device |
| 12/17/2009 | DE102009021083A1 Halbleiter-Bauelement und Verfahren Semiconductor device and method |
| 12/17/2009 | DE102008054306A1 Harzabgedichtete Halbleitervorrichtung und Herstellungsverfahren dafür Harzabgedichtete semiconductor device and manufacturing method thereof |
| 12/17/2009 | DE102008035055B3 Verfahren zur Ausrichtung einer elektronischen CMOS-Struktur bezogen auf eine vergrabene Struktur bei gebondeten und rückgedünnten Stapeln von Halbleiterscheiben A method of aligning an electronic CMOS structure based on a buried structure and bonded at rückgedünnten stacks of semiconductor wafers |
| 12/17/2009 | DE102008026636A1 Circuit support for use in integrated switching circuit to mechanically fix e.g. semiconductor component on printed circuit board, has substrate with opening adjacent to another opening and including surface not coated with metal or alloy |
| 12/17/2009 | DE102008026134A1 Mikrostrukturbauelement mit einer Metallisierungsstruktur mit selbstjustierten Luftspalten zwischen dichtliegenden Metallleitungen Microstructure device with a metallization with self-aligned air gaps between closely spaced metal lines |
| 12/17/2009 | DE102008025833A1 Verfahren und Vorrichtung zum stoffschlüssigen Fügen metallischer Anschlussstrukturen Method and apparatus for securely joining metallic connection structures |
| 12/17/2009 | DE102008025246A1 Method for contacting mechanical or thermal or electrical conducting connection at electrical contact surface of electronic component, involves producing contact layer between connection and contact surface |
| 12/17/2009 | DE102008002391A1 Gehäuse zur Verpackung eines Bauelements und Herstellungsverfahren für ein Gehäuse Casing for packaging a device, and manufacturing method of a housing |
| 12/17/2009 | DE102007019552B4 Verfahren zur Herstellung eines Substrats mit Durchführung sowie Substrat und Halbleitermodul mit Durchführung A method for producing a substrate with execution, and the substrate and the semiconductor module with conducting |
| 12/17/2009 | DE102004003853B4 Vorrichtung und Verfahren zur Kompensation von Piezo-Einflüssen auf eine integrierte Schaltungsanordnung Apparatus and method for compensating piezo influences on an integrated circuit arrangement |
| 12/17/2009 | DE10132455B4 Elektrische Anordnung mit einem Kühlkörper und Verfahren zu deren Herstellung An electrical assembly with a heat sink and method for the preparation thereof |
| 12/17/2009 | DE10013255B4 Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen Resin-encapsulated electronic device for use in internal combustion engines |
| 12/16/2009 | EP2133992A1 Semiconductor chip and high frequency circuit |
| 12/16/2009 | EP2133917A2 Semiconductor integrated circuit comprising mutli-threshold CMOS (MTCMOS) and non-MTCMOS circuit cells in the same circuit block |
| 12/16/2009 | EP2133916A2 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig |
| 12/16/2009 | EP2133915A1 Semiconductor assembly with specially formed bonds and method for manufacturing the same |
| 12/16/2009 | EP2133914A2 Heat dissipation module |
| 12/16/2009 | EP2133913A1 Heat transfer sheet and radiator structure |
| 12/16/2009 | EP2133909A1 Semiconductor device, and its manufacturing method |
| 12/16/2009 | EP2132776A1 Integrated circuit housing particularly for an image sensor and positioning method |
| 12/16/2009 | EP2132773A1 A power semiconductor arrangement and a semiconductor valve provided therewith |
| 12/16/2009 | EP2132772A2 Heat sink, and assembly or module unit comprising a heat sink |
| 12/16/2009 | EP1417691B1 Planar inductive component and a planar transformer |
| 12/16/2009 | EP1320881B1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 12/16/2009 | CN201365391Y Radiating module |
| 12/16/2009 | CN201365390Y Radiating module |
| 12/16/2009 | CN201365389Y Vehicular electric control system and radiating device thereof |
| 12/16/2009 | CN201365388Y Electronic module cooler with base plate heat source |
| 12/16/2009 | CN201364910Y High-power LED ceramic cooling substrate |
| 12/16/2009 | CN201364900Y Electrostatic discharge protection device of multi-power domain integrated circuit |
| 12/16/2009 | CN201364899Y Integrated circuit lead frame of ring plated welding zone |
| 12/16/2009 | CN201364898Y Triode lead frame |
| 12/16/2009 | CN201364897Y Heat radiator of semiconductor electronic device |
| 12/16/2009 | CN201364896Y Assembling structure of power crystal, radiator and printing circuit board |
| 12/16/2009 | CN201364895Y Semiconductor packaging device with high heat dissipation |
| 12/16/2009 | CN201364894Y Heat-dissipating module backplane |
| 12/16/2009 | CN201364893Y Single inclined tube type thermotube radiator used by microprocessor |
| 12/16/2009 | CN201364892Y Tray turnover labeling error prevention device |
| 12/16/2009 | CN201363702Y Cooling system of LED display screen |
| 12/16/2009 | CN201363701Y Heat radiation structure used for LED lamp with large power |
| 12/16/2009 | CN201363700Y Radiating structure of LED |
| 12/16/2009 | CN201363699Y Radiator for high-power LED illuminating lamp |
| 12/16/2009 | CN201363698Y High power LED street lamp radiation device |
| 12/16/2009 | CN201363682Y Semiconductor LED general lamp |
| 12/16/2009 | CN201363628Y LED street lamp with large power |
| 12/16/2009 | CN201363625Y LED (light emitting diode) advertisement lamp box |
| 12/16/2009 | CN201363589Y Fancy LED (light emitting diode) columnar lamp |
| 12/16/2009 | CN201363586Y Columnar LED lamp |
| 12/16/2009 | CN201363576Y Light emitting diode lamp |
| 12/16/2009 | CN201361665Y Height limiting device |
| 12/16/2009 | CN101606242A Semiconductor device, its manufacturing method and optical pickup module |
| 12/16/2009 | CN101606237A Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof |
| 12/16/2009 | CN101606235A Modifier for low dielectric constant film, and method for production thereof |
| 12/16/2009 | CN101606234A Etching method and recording medium |
| 12/16/2009 | CN101606228A Film forming method, substrate processing apparatus, and semiconductor device |
| 12/16/2009 | CN101606168A Method for applying markings to substrate surfaces by means of a transfer method |
| 12/16/2009 | CN101605446A Radiating device |
| 12/16/2009 | CN101605445A Heat transfer unit without liquid injection pipe and manufacture method thereof |
| 12/16/2009 | CN101605444A Heat dissipating device |
| 12/16/2009 | CN101605443A Heat dissipation device and heat dissipater thereof |
| 12/16/2009 | CN101605442A 散热装置 Cooling devices |
| 12/16/2009 | CN101605441A Heat dissipation device and heat dissipater thereof |
| 12/16/2009 | CN101604702A Vertical interconnect for organic electronic devices |
| 12/16/2009 | CN101604701A Light emitting diode having a thermal conductive substrate and method of fabricating the same |
| 12/16/2009 | CN101604700A Image sensor semiconductor device and forming method thereof |
| 12/16/2009 | CN101604699A Solid-state image pickup device |
| 12/16/2009 | CN101604698A Image sensing chip packaging module for reducing integral thickness |
| 12/16/2009 | CN101604690A Semiconductor device having a power cutoff transistor |
| 12/16/2009 | CN101604689A 半导体集成电路 The semiconductor integrated circuit |
| 12/16/2009 | CN101604687A Semiconductor light emitting device |
| 12/16/2009 | CN101604686A Integrated circuit stacking construction with shimming assembly |
| 12/16/2009 | CN101604685A Memory module |
| 12/16/2009 | CN101604684A Staggered and stacked chip-packaging structure of lead frame with switching bonding pad on inner pins |
| 12/16/2009 | CN101604683A Air gap structure for interconnection and manufacture method thereof |
| 12/16/2009 | CN101604682A Electronic device and method of manufacturing the same |
| 12/16/2009 | CN101604681A Semiconductor device, stacked semiconductor device and interposer substrate |
| 12/16/2009 | CN101604680A Lead frame, lead frame type package and lead column. |
| 12/16/2009 | CN101604679A Lead frame, semiconductor device, method for manufacturing lead frame and method for manufacturing semiconductor device |
| 12/16/2009 | CN101604678A Semiconductor device, stacked semiconductor device and interposer substrate |
| 12/16/2009 | CN101604677A Return loss techniques in wirebond packages for high-speed data communications |
| 12/16/2009 | CN101604676A Chip-encapsulating carrier plate and manufacture method thereof |