H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/23/2009	CN100573837C Method for preparing printed circuit board and light emitting diode
12/23/2009	CN100573822C Substrate and method of fabricating the same, and semiconductor device and method of fabricating the same
12/23/2009	CN100573534C Method of analyzing electronic components, device for analyzing electronic components and electronic components using these
12/23/2009	CN100573292C Liquid crystal display board and method for manufacturing facing direction substrates thereof
12/23/2009	CN100572824C Internal blower with air end shell and cooling unit and electronic device containing the blower
12/23/2009	CN100572446C Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
12/22/2009	USRE41051 Package substrate
12/22/2009	US7636241 Heat dissipating device
12/22/2009	US7635920 Method and apparatus for indicating directionality in integrated circuit manufacturing
12/22/2009	US7635919 Low modulus stress buffer coating in microelectronic devices
12/22/2009	US7635918 High frequency device module and manufacturing method thereof
12/22/2009	US7635917 Three-dimensional package and method of making the same
12/22/2009	US7635916 Integrated circuit package with top-side conduction cooling
12/22/2009	US7635915 Apparatus and method for use in mounting electronic elements
12/22/2009	US7635914 Multi layer low cost cavity substrate fabrication for pop packages
12/22/2009	US7635913 Stacked integrated circuit package-in-package system
12/22/2009	US7635912 Semiconductor device
12/22/2009	US7635911 Chip carrier and system including a chip carrier and semiconductor chips
12/22/2009	US7635910 Semiconductor package and method
12/22/2009	US7635901 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
12/22/2009	US7635898 Methods for fabricating semiconductor devices
12/22/2009	US7635897 Dual gate structure, fabrication method for the same, semiconductor device having the same
12/22/2009	US7635889 Semiconductor device, electronic device, and method of manufacturing semiconductor device
12/22/2009	US7635865 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
12/22/2009	US7635741 Curable polyacetylenes used as dielectrics in making microelectronics such as integrated circuits
12/22/2009	US7635645 Method for forming interconnection line in semiconductor device and interconnection line structure
12/22/2009	US7635643 Method for forming C4 connections on integrated circuit chips and the resulting devices
12/22/2009	US7635642 Integrated circuit package and method for producing it
12/22/2009	US7635639 Method for the interconnection of active and passive components and resulting thin heterogeneous component
12/22/2009	US7635613 Semiconductor device having firmly secured heat spreader
12/22/2009	US7635611 Semiconductor substrate for build-up packages
12/22/2009	CA2561769C Low-profile thermosyphon-based cooling system for computers and other electronic devices
12/22/2009	CA2455053C Sheet material and its use in circuit boards
12/22/2009	CA2453003C Use of diverse materials in air-cavity packaging of electronic devices
12/22/2009	CA2398270C Package for microwave components
12/17/2009	WO2009152284A2 Improved method and apparatus for wafer bonding
12/17/2009	WO2009151676A2 Method and circuit for efuse protection
12/17/2009	WO2009151405A1 Method of making a substrate having multi -layered structures
12/17/2009	WO2009151108A1 Mounting substrate, substrate and methods for manufacturing mounting substrate and substrate
12/17/2009	WO2009151029A1 Sealing material and solar battery module wherein same is used
12/17/2009	WO2009151006A1 Method for producing ceramic molded body
12/17/2009	WO2009150995A1 Power semiconductor circuit device and method for manufacturing the same
12/17/2009	WO2009150985A1 Semiconductor device mounting substrate
12/17/2009	WO2009150972A1 Ink composition for forming an insulating film and an insulating film formed from said ink composition
12/17/2009	WO2009150886A1 Oxide thin film transistor and method for manufacturing the same
12/17/2009	WO2009150820A1 Semiconductor device and method for manufacturing the same
12/17/2009	WO2009150785A1 Refrigeration apparatus
12/17/2009	WO2009150775A1 Semiconductor integrated circuit
12/17/2009	WO2009150558A1 Intrusion protection using stress changes
12/17/2009	WO2009149771A1 Housing for packaging a structural component and method for the production of a housing
12/17/2009	WO2009120977A3 Enhanced thermal dissipation ball grid array package
12/17/2009	WO2009111164A3 Structure and method for coupling signals to and/or from stacked semiconductor dies
12/17/2009	WO2009105411A3 Thermally conductive periodically structured gap fillers and method for utilizing same
12/17/2009	US20090312981 Alignment mark and alignment method using the alignment mark
12/17/2009	US20090312656 Electrostatic Discharge Protection For Wrist-Worn Device
12/17/2009	US20090312619 Analyte Monitoring Device And Methods Of Use
12/17/2009	US20090311820 Solid-state imaging device and method for manufacturing the same
12/17/2009	US20090310638 Semiconductor laser device
12/17/2009	US20090310113 Sub-segmented alignment mark arrangement
12/17/2009	US20090309243 Multi-core integrated circuits having asymmetric performance between cores
12/17/2009	US20090309242 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device
12/17/2009	US20090309241 Ultra thin die electronic package
12/17/2009	US20090309240 Return loss techniques in wirebond packages for high-speed data communications
12/17/2009	US20090309239 Semiconductor device and manufacturing method of the semiconductor device
12/17/2009	US20090309238 Molded flip chip package with enhanced mold-die adhesion
12/17/2009	US20090309237 Semiconductor package system with substrate having different bondable heights at lead finger tips
12/17/2009	US20090309236 Package on Package Structure with thin film Interposing Layer
12/17/2009	US20090309235 Method and Apparatus for Wafer Level Integration Using Tapered Vias
12/17/2009	US20090309234 Semiconductor device and method of making semiconductor device
12/17/2009	US20090309233 Semiconductor device
12/17/2009	US20090309232 Method of making connections in a back-lit circuit
12/17/2009	US20090309231 Semiconductor device and method of manufacturing the same
12/17/2009	US20090309230 Air gap formation and integration using a patterning cap
12/17/2009	US20090309229 Silicon single electron device
12/17/2009	US20090309228 Method for forming self-aligned metal silicide contacts
12/17/2009	US20090309227 Fabrication of interconnects in low-k interlayer dielectrics
12/17/2009	US20090309226 Interconnect Structure for Electromigration Enhancement
12/17/2009	US20090309225 Top layers of metal for high performance IC's
12/17/2009	US20090309224 Circuitry component and method for forming the same
12/17/2009	US20090309223 Interconnect layers without electromigration
12/17/2009	US20090309222 Method and semiconductor device having copper interconnect for bonding
12/17/2009	US20090309221 Semiconductor device and manufacturing method therefor
12/17/2009	US20090309220 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
12/17/2009	US20090309219 Injection molded solder ball method
12/17/2009	US20090309218 Semiconductor device and method of manufacturing the same
12/17/2009	US20090309217 Flip-chip interconnection with a small passivation layer opening
12/17/2009	US20090309216 Wafer level package and manufacturing method thereof
12/17/2009	US20090309215 Semiconductor module and method for fabricating semiconductor module
12/17/2009	US20090309214 Circuit Module Turbulence Enhancement
12/17/2009	US20090309213 Semiconductor device and manufacturing method of the same
12/17/2009	US20090309212 Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
12/17/2009	US20090309211 Compliant Wirebond Pedestal
12/17/2009	US20090309210 Semiconductor device and manufacturing method thereof
12/17/2009	US20090309209 Die Rearrangement Package Structure and the Forming Method Thereof
12/17/2009	US20090309208 Semiconductor device and method of manufacturing the same
12/17/2009	US20090309207 Integrated circuit package system with die and package combination
12/17/2009	US20090309205 Semiconductor chip package and multichip package
12/17/2009	US20090309204 Ball grid array package stacking system
12/17/2009	US20090309203 Getter on die in an upper sense plate designed system
12/17/2009	US20090309202 Package substrate having embedded semiconductor chip and fabrication method thereof

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