| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 12/23/2009 | CN201369322Y Heat abstractor for LED module |
| 12/23/2009 | CN201368436Y Gravity circulated evaporative cooling device of high power LED lamp |
| 12/23/2009 | CN201368435Y Heat radiating structure of LED (light emitting diode) lighting lamp |
| 12/23/2009 | CN201368434Y Heat dissipation structure for high power semiconductor device |
| 12/23/2009 | CN201368433Y High-power LED street lamp radiator |
| 12/23/2009 | CN201368390Y LED head lamp |
| 12/23/2009 | CN201368372Y Medical film lamp box with LED light source |
| 12/23/2009 | CN201368358Y High-power LED lamp |
| 12/23/2009 | CN201368354Y High-power anti-corrosion LED lighting lamp used in marine environment |
| 12/23/2009 | CN201368351Y LED lamp tube structure |
| 12/23/2009 | CN201368348Y High power led lighting lamp and heat dissipation structure thereof |
| 12/23/2009 | CN101611493A Chip capacitor embedded pwb |
| 12/23/2009 | CN101611492A Electronic board and cold plate for said board |
| 12/23/2009 | CN101611491A Printed board unit and semiconductor package |
| 12/23/2009 | CN101611490A Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| 12/23/2009 | CN101611488A Method and apparatus for modifying integrated circuit by laser |
| 12/23/2009 | CN101611487A Thin-film solar module |
| 12/23/2009 | CN101610664A Liquid cooler and manufacture method thereof |
| 12/23/2009 | CN101610663A Integrated heat radiator for portable electronic product |
| 12/23/2009 | CN101610662A Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| 12/23/2009 | CN101610659A 散热器 Heat sink |
| 12/23/2009 | CN101610658A Heat dissipation device |
| 12/23/2009 | CN101610657A Heat radiating device |
| 12/23/2009 | CN101610656A Heat sink and assembly method thereof |
| 12/23/2009 | CN101610646A Electrical connection structure as well as technology and circuit board structure thereof |
| 12/23/2009 | CN101610636A Electromagnetic bandgap structure, and printed circuit board |
| 12/23/2009 | CN101609864A Light emitting diode packaging structure and light emitting diode packaging method |
| 12/23/2009 | CN101609836A Image sensor module and camera module |
| 12/23/2009 | CN101609834A Semiconductor device having OTP cells and method for fabricating the same |
| 12/23/2009 | CN101609833A Circuit apparatus and method of manufacturing the same |
| 12/23/2009 | CN101609830A Printed circuit board including electronic component embedded therein and method of manufacturing the same |
| 12/23/2009 | CN101609829A Interconnect structure for enhancing electromigration resistance |
| 12/23/2009 | CN101609828A Semiconductor device and method of manufacturing the same |
| 12/23/2009 | CN101609827A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 12/23/2009 | CN101609826A Power semiconductor module and method of manufacturing the same |
| 12/23/2009 | CN101609825A Prefabricated lead frame and linkage method using same |
| 12/23/2009 | CN101609824A Universal type basal plate packaged by semiconductor and semiconductor packaging structure |
| 12/23/2009 | CN101609823A Chip encapsulating lug structure of flexible convex pad |
| 12/23/2009 | CN101609822A Encapsulating structure and encapsulating method for reconfiguring chip |
| 12/23/2009 | CN101609821A High-power semiconductor multi-tube high-performance positioning fixture |
| 12/23/2009 | CN101609820A Electronic device and method of manufacturing the electronic device |
| 12/23/2009 | CN101609819A Lead frame chip packaging structure and manufacturing method thereof |
| 12/23/2009 | CN101609818A Semiconductor packaging device, semiconductor packaging structure and manufacturing method thereof |
| 12/23/2009 | CN101609817A Semiconductor packaging device, semiconductor packaging structure and manufacturing method thereof |
| 12/23/2009 | CN101609812A Method for forming electrostatic discharging element |
| 12/23/2009 | CN101609811A Method for manufacturing integrated circuit |
| 12/23/2009 | CN101609810A Improved adhesion to copper and copper electromigration resistance |
| 12/23/2009 | CN101609806A Thin solder grid array technology for printed circuit board surface mount components |
| 12/23/2009 | CN101609805A Method for forming chip encapsulating lug structure of flexible convex pad |
| 12/23/2009 | CN101609802A Preparation method of low thermal resistance thermal interface |
| 12/23/2009 | CN101608788A Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp |
| 12/23/2009 | CN101608786A LED lamp with combination heat dissipation body |
| 12/23/2009 | CN101608784A LED lamp |
| 12/23/2009 | CN101608779A Heat radiating structure of light-emitting element |
| 12/23/2009 | CN101608757A LED streetlight |
| 12/23/2009 | CN101608747A Light-emitting diode lamp module |
| 12/23/2009 | CN101608052A Conductive die-bonding agent for led (light emitting diode) |
| 12/23/2009 | CN100574597C Heat radiator |
| 12/23/2009 | CN100574596C Radiating device |
| 12/23/2009 | CN100574594C Rediating device |
| 12/23/2009 | CN100574592C Radiator fixing device |
| 12/23/2009 | CN100574583C Fastener module and heat radiating device having the same |
| 12/23/2009 | CN100574582C Heat dispersion device combination and its used buckle |
| 12/23/2009 | CN100574570C Method for providing non-standard wideth range for improved circuit card wiring |
| 12/23/2009 | CN100574542C Heat sink to be mounted on printed circuit board |
| 12/23/2009 | CN100573946C Luminous diode device |
| 12/23/2009 | CN100573936C Luminous diode and heat radiating device combination |
| 12/23/2009 | CN100573905C Light-emitting device and electronic apparatus |
| 12/23/2009 | CN100573904C 有机发光显示装置及其测试方法 The organic light emitting display device and test methods |
| 12/23/2009 | CN100573903C Display device and method for manufacturing the same |
| 12/23/2009 | CN100573899C Self-aligned, embedded phase change ram and manufacturing method |
| 12/23/2009 | CN100573895C Magnetic memory and method of manufacturing the same |
| 12/23/2009 | CN100573889C Pixel structure of active part array substrates |
| 12/23/2009 | CN100573888C Nonvolatile semiconductor storage apparatus and method for manufacturing the same |
| 12/23/2009 | CN100573887C Array substrate, and manufacturing method thereof, liquid crystal display device having the same |
| 12/23/2009 | CN100573885C Semiconductor device and active matrix display device |
| 12/23/2009 | CN100573884C Display device |
| 12/23/2009 | CN100573883C Thin-film transistor and method of manufacture thereof |
| 12/23/2009 | CN100573882C Thin film transistor array panel |
| 12/23/2009 | CN100573880C Semiconductor device and a manufacturing method thereof |
| 12/23/2009 | CN100573871C Semiconductor device and a method of manufacturing the same |
| 12/23/2009 | CN100573869C Flat panel display and method for driving the same |
| 12/23/2009 | CN100573868C Organic light-emitting display device and method for fabricating the same |
| 12/23/2009 | CN100573867C Chip package structure, chip carrier tape and its planarization method |
| 12/23/2009 | CN100573866C Common base plate and semiconductor device using this common base plate |
| 12/23/2009 | CN100573865C 半导体封装及其制造方法 Semiconductor package and its manufacturing method |
| 12/23/2009 | CN100573864C Electronic diode for ferroalloy lead wire commutation and method of producing the same |
| 12/23/2009 | CN100573863C Covering crystal package structure and its making method |
| 12/23/2009 | CN100573862C Semiconductor device with novel package structure |
| 12/23/2009 | CN100573861C Support construction of LED |
| 12/23/2009 | CN100573860C Packaging structure and method for sphere pin array substrate with contact pad located in chip center |
| 12/23/2009 | CN100573859C Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
| 12/23/2009 | CN100573858C Chip package member |
| 12/23/2009 | CN100573857C Combined structure of image sensing wafer and glass substrates and manufacturing method therefor |
| 12/23/2009 | CN100573856C Rewinding type semiconductor packaging construction for improving cooling effect |
| 12/23/2009 | CN100573855C Encapsulation structure of the crystal particle and its making method |
| 12/23/2009 | CN100573854C Semiconductor device, circuit substrate and electronic apparatus |
| 12/23/2009 | CN100573853C Active element array structure and manufacturing method thereof |
| 12/23/2009 | CN100573848C Semiconductor device and manufacture method thereof and electric appliance |
| 12/23/2009 | CN100573840C Mounted body and method of producing the same |