| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/24/2009 | US20090315192 Method of manufacturing semiconductor device and semiconductor device |
| 12/24/2009 | US20090315191 Semiconductor integrated circuit |
| 12/24/2009 | US20090315190 Wiring board, semiconductor device using wiring board and their manufacturing methods |
| 12/24/2009 | US20090315189 Layered chip package and method of manufacturing same |
| 12/24/2009 | US20090315188 Silicon-on-insulator structures for through via in silicon carriers |
| 12/24/2009 | US20090315187 Semiconductor device |
| 12/24/2009 | US20090315186 Method for manufacturing semiconductor device and the semiconductor device |
| 12/24/2009 | US20090315185 Selective electroless metal deposition for dual salicide process |
| 12/24/2009 | US20090315184 Semiconductor Device |
| 12/24/2009 | US20090315182 Silicide interconnect structure |
| 12/24/2009 | US20090315181 Liquid phase molecular self-assembly for barrier deposition and structures formed thereby |
| 12/24/2009 | US20090315180 Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same |
| 12/24/2009 | US20090315179 Semiconductor device having solder bumps protruding beyond insulating films |
| 12/24/2009 | US20090315178 Conductive bump, method for producing the same, and electronic component mounted structure |
| 12/24/2009 | US20090315177 Semiconductor package with joint reliability |
| 12/24/2009 | US20090315176 Semiconductor package and method for manufacturing semiconductor package |
| 12/24/2009 | US20090315175 Electrode structure and semiconductor device |
| 12/24/2009 | US20090315174 Semiconductor Die Separation Method |
| 12/24/2009 | US20090315173 Heat-transfer structure |
| 12/24/2009 | US20090315172 Semiconductor chip assembly |
| 12/24/2009 | US20090315171 Pin substrate and package |
| 12/24/2009 | US20090315170 Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof |
| 12/24/2009 | US20090315169 Frame and method of manufacturing assembly |
| 12/24/2009 | US20090315168 Through board stacking of multiple lga-connected components |
| 12/24/2009 | US20090315167 Semiconductor device |
| 12/24/2009 | US20090315165 Method and system for the modular design and layout of integrated circuits |
| 12/24/2009 | US20090315164 Integrated circuit package system with wire-in-film encapsulation |
| 12/24/2009 | US20090315163 Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same |
| 12/24/2009 | US20090315162 Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same |
| 12/24/2009 | US20090315161 Die attach method and leadframe structure |
| 12/24/2009 | US20090315160 Prefabricated lead frame and bonding method using the same |
| 12/24/2009 | US20090315159 Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same |
| 12/24/2009 | US20090315158 Wiring board and electrical signal transmission system |
| 12/24/2009 | US20090315157 Protection for proximity electronics against electrostatic discharge |
| 12/24/2009 | US20090315156 Packaged integrated circuit having conformal electromagnetic shields and methods to form the same |
| 12/24/2009 | US20090315154 Semiconductor with through-substrate interconnect |
| 12/24/2009 | US20090315134 Solid-state imaging device and method for manufacturing the same |
| 12/24/2009 | US20090315130 Solid-state imaging apparatus and method for manufacturing the same |
| 12/24/2009 | US20090315129 Integrated circuit distributed over at least two non-parallel planes and its method of production |
| 12/24/2009 | US20090315113 Low side zener reference voltage extended drain SCR clamps |
| 12/24/2009 | US20090315109 Semiconductor device having otp cells and method for fabricating the same |
| 12/24/2009 | US20090315057 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
| 12/24/2009 | US20090315029 Semiconductor integrated circuit having terminal for measuring bump connection resistance and semiconductor device provided with the same |
| 12/24/2009 | US20090315028 Semiconductor substrate and production process thereof |
| 12/24/2009 | US20090314634 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods |
| 12/24/2009 | US20090314542 Tag enclosing structure |
| 12/24/2009 | US20090314537 Conductive connecting pin and package substrate |
| 12/24/2009 | US20090314536 Printed circuit board, electric instrument, and semiconductor package |
| 12/24/2009 | US20090314533 Adhesive for bonding circuit members, circuit board and process for its production |
| 12/24/2009 | US20090314062 Fluid Actuator, and Heat Generating Device and Analysis Device Using the Same |
| 12/24/2009 | DE112008000533T5 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device |
| 12/24/2009 | DE102009016056A1 Halbleitervorrichtung Semiconductor device |
| 12/24/2009 | DE102009013331A1 Halbleiter-ESD-Bauelement und Verfahren zu dessen Herstellung ESD semiconductor device and process for its preparation |
| 12/24/2009 | DE102009012594A1 Durch-Substrat-Via-Halbleiterkomponenten By substrate via semiconductor components |
| 12/24/2009 | DE102008027115A1 Kontaktstruktur, elektronisches Bauelement mit einer Kontaktstruktur und Verfahren zu deren Herstellung Contact structure, electronic device having a contact structure and method for their preparation |
| 12/24/2009 | DE102008002546A1 Anordnung zur Stressentkopplung bei einem Substrat mit einem Chip Arrangement for stress isolation when a substrate with a chip |
| 12/24/2009 | DE102007022425B4 Beleuchtungsmodule Lighting Modules |
| 12/24/2009 | DE102006025453B4 Halbleiterschaltungsanordnung Semiconductor circuitry |
| 12/23/2009 | WO2009154969A2 Four mosfet full bridge module |
| 12/23/2009 | WO2009154761A1 Stacking of wafer-level chip scale packages having edge contacts |
| 12/23/2009 | WO2009154663A2 Vapor chamber-thermoelectric module assemblies |
| 12/23/2009 | WO2009154556A1 Liquid cooler and method of its manufacture |
| 12/23/2009 | WO2009154464A1 An integrated circuit comprising light absorbing adhesive |
| 12/23/2009 | WO2009154295A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate |
| 12/23/2009 | WO2009154261A1 Curable organopolysiloxane composition and semiconductor device |
| 12/23/2009 | WO2009154260A1 Curable organopolysiloxane composition and semiconductor device |
| 12/23/2009 | WO2009154186A1 Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material |
| 12/23/2009 | WO2009153912A1 Semiconductor device and method for manufacturing semiconductor device |
| 12/23/2009 | WO2009153857A1 Semiconductor device and method for manufacturing the same |
| 12/23/2009 | WO2009153834A1 Semiconductor device and method for manufacturing the same |
| 12/23/2009 | WO2009153735A1 Cooling system, in particular for electronic structural units |
| 12/23/2009 | WO2009153728A1 Through wafer via filling method |
| 12/23/2009 | WO2009153129A2 Method for the manufacture of an electronic assembly |
| 12/23/2009 | WO2009153094A1 Arrangement for decoupling stress in a substrate with a chip |
| 12/23/2009 | WO2009134012A3 Metal frame for electronic components |
| 12/23/2009 | WO2009126339A3 Metal-based microchannel heat exchangers made by molding replication and assembly |
| 12/23/2009 | WO2009120633A3 Semiconductor package with embedded magnetic component and method of manufacture |
| 12/23/2009 | WO2009118468A3 Electrical connection method for a component provided with inserts comprising compensating blocks |
| 12/23/2009 | EP2136402A1 Switching device and method for programming a hall sensor with pre-switched controller |
| 12/23/2009 | EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices |
| 12/23/2009 | EP2136400A1 Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module |
| 12/23/2009 | EP2136399A1 Interposer |
| 12/23/2009 | EP2136394A1 Semiconductor device |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | EP2135285A1 High voltage gan-based heterojunction transistor structure and method of forming same |
| 12/23/2009 | EP2135281A1 Thermal dissipation in chip substrates |
| 12/23/2009 | EP2135280A2 Chips having rear contacts connected by through vias to front contacts |
| 12/23/2009 | EP2135279A1 Polar hybrid grid array package |
| 12/23/2009 | EP2135137A1 Exposure method and electronic device manufacturing method |
| 12/23/2009 | EP1183740B1 Concentrically leaded power semiconductor device package |
| 12/23/2009 | CN201369890Y Electronic device and cooling system thereof |
| 12/23/2009 | CN201369335Y Photovoltaic cell module |
| 12/23/2009 | CN201369330Y LED high thermal conductivity power type electrode support |
| 12/23/2009 | CN201369329Y Heat-resistant moisture-proof high-power lead frame |
| 12/23/2009 | CN201369328Y Improvement of light-emitting diode lead frame |
| 12/23/2009 | CN201369327Y Lead frame structure |
| 12/23/2009 | CN201369326Y Improvement of semi-conductor chip bonding structure |
| 12/23/2009 | CN201369325Y Flip chip component for the bonding process of gold-to-gold interconnection |
| 12/23/2009 | CN201369324Y Flip chip component for the bonding process of gold-to-gold interconnection |
| 12/23/2009 | CN201369323Y Flip chip component for bonding process of gold-to-gold interconnection |