H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/30/2009	CN100576553C Solid shooting apparatus and method for manufacturing the same
12/30/2009	CN100576552C Solid shooting apparatus, solid shooting element collection box
12/30/2009	CN100576550C Thin film transistor array substrate and method for fabricating the same
12/30/2009	CN100576533C 半导体器件 Semiconductor devices
12/30/2009	CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method
12/30/2009	CN100576531C 半导体封装及其制造方法 Semiconductor package and its manufacturing method
12/30/2009	CN100576530C Plating seed layer including an oxygen/nitrogen transition region and interconnection structure and forming method
12/30/2009	CN100576529C Semiconductor device, and testing method and device for the same
12/30/2009	CN100576528C Test substrate, test substrate mask and test substrate forming method
12/30/2009	CN100576527C Semiconductor device
12/30/2009	CN100576526C Circuit structure for realizing upper/lower layer metallic interconnect
12/30/2009	CN100576525C Circuit member, circuit member manufacturing method, semiconductor device and multilayer structure on circuit member surface
12/30/2009	CN100576524C Leadframe, semiconductor package and method for producing the same
12/30/2009	CN100576523C Alternative flip chip in leaded molded package design and method for manufacture
12/30/2009	CN100576522C Semiconductor package structure and method of manufacture
12/30/2009	CN100576521C Stack type projection structure and manufacturing method thereof
12/30/2009	CN100576520C Carbon nanotube thermal interface structures
12/30/2009	CN100576519C Cuprum/silicon encapsulating material with micro diffusion blocking layer and preparation method thereof
12/30/2009	CN100576518C Glue film and chip encapsulation manufacture process using the glue film
12/30/2009	CN100576517C Circuit device and producing method thereof
12/30/2009	CN100576516C Semiconductor device
12/30/2009	CN100576508C 半导体集成电路 The semiconductor integrated circuit
12/30/2009	CN100576500C Fuse-wires structure and forming method thereof
12/30/2009	CN100576494C Method of forming double-setting line arrange for semiconductor device using protective access cover layer
12/30/2009	CN100576483C Unmolded package for a semiconductor device
12/30/2009	CN100576482C Method for bonding electronic components
12/30/2009	CN100576476C Chip buried in semiconductor encapsulation base plate structure and its manufacturing method
12/30/2009	CN100576023C Line and liquid crystal display panel applying same
12/30/2009	CN100575888C Method for manufacturing physical quantity sensor
12/30/2009	CN100575781C LED lighting device capable of recovering heat
12/30/2009	CN100575385C Composition and method to achieve reduced thermal expansion in polyarylene networks
12/30/2009	CN100575383C Epoxy resin composition and semiconductor device
12/30/2009	CA2728796A1 Energy dissipating packages for high power operation of optical fiber components
12/30/2009	CA2726476A1 Active thermal control for stacked ic devices
12/29/2009	US7640138 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus
12/29/2009	US7639719 Thermal shunt for active devices on silicon-on-insulator wafers
12/29/2009	US7639504 Mounting device for mounting heat sink onto electronic component
12/29/2009	US7639501 Heat sink assembly having a clip
12/29/2009	US7639500 Mounting plate for electronic components
12/29/2009	US7639061 Semiconductor device and capacitance regulation circuit
12/29/2009	US7639032 Structure for monitoring stress-induced degradation of conductive interconnects
12/29/2009	US7638888 Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
12/29/2009	US7638887 Package structure and fabrication method thereof
12/29/2009	US7638886 Semiconductor device and semiconductor chip
12/29/2009	US7638885 Fabric type semiconductor device package and methods of installing and manufacturing same
12/29/2009	US7638883 Flip chip mounting method and bump forming method
12/29/2009	US7638882 Flip-chip package and method of forming thereof
12/29/2009	US7638881 Chip package
12/29/2009	US7638880 Chip package
12/29/2009	US7638879 Semiconductor package and fabrication method thereof
12/29/2009	US7638878 Devices and systems including the bit lines and bit line contacts
12/29/2009	US7638877 integrated circuit chip package substrate; copper plating layer adhered to the polyelectrolyte multilayers through electroless plating; solves issues with desmear that include process control and reproducibility, throughput time, and potential environmental concerns
12/29/2009	US7638876 Bumpless semiconductor device
12/29/2009	US7638875 Packaging structure
12/29/2009	US7638874 Microelectronic package including temperature sensor connected to the package substrate and method of forming same
12/29/2009	US7638873 Wired circuit board
12/29/2009	US7638872 Power semiconductor module
12/29/2009	US7638871 Semiconductor device
12/29/2009	US7638870 Packaging for high speed integrated circuits
12/29/2009	US7638869 Semiconductor device
12/29/2009	US7638868 Microelectronic package
12/29/2009	US7638867 Microelectronic package having solder-filled through-vias
12/29/2009	US7638866 Stacked packaging designs offering inherent anti-tamper protection
12/29/2009	US7638865 Sensor package
12/29/2009	US7638864 Chip package, method of making same and digital camera module using the package
12/29/2009	US7638863 Semiconductor package and method therefor
12/29/2009	US7638862 Die attach paddle for mounting integrated circuit die
12/29/2009	US7638861 Flip chip MLP with conductive ink
12/29/2009	US7638860 Semiconductor device and lead frame
12/29/2009	US7638859 Interconnects with harmonized stress and methods for fabricating the same
12/29/2009	US7638854 Semiconductor device, display module, and manufacturing method of semiconductor device
12/29/2009	US7638848 Semiconductor apparatus with improved ESD withstanding voltage
12/29/2009	US7638847 ESD protection structure
12/29/2009	US7638844 Manufacturing method of semiconductor-on-insulator region structures
12/29/2009	US7638842 Lattice-mismatched semiconductor structures on insulators
12/29/2009	US7638841 Power semiconductor devices and methods of manufacture
12/29/2009	US7638830 Vertical metal-insulator-metal (MIM) capacitors
12/29/2009	US7638823 Solid-state imaging device and method of manufacturing said solid-state imaging device
12/29/2009	US7638814 Solderless integrated package connector and heat sink for LED
12/29/2009	US7638813 Methods of fabrication for flip-chip image sensor packages
12/29/2009	US7638800 Wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same
12/29/2009	US7638798 Laminated wafer sensor system for UV dose measurement
12/29/2009	US7638421 Manufacturing method for semiconductor device and semiconductor device
12/29/2009	US7638420 Print mask and method of manufacturing electronic components using the same
12/29/2009	US7638419 Method of fabricating a via attached to a bond pad utilizing a tapered interconnect
12/29/2009	US7638411 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer
12/29/2009	US7638406 Method of fabricating a high Q factor integrated circuit inductor
12/29/2009	US7638366 Methods and apparatus for addition of electrical conductors to previously fabricated device
12/29/2009	US7638365 Stacked chip package and method for forming the same
12/29/2009	US7638364 Multilayer integrated circuit for RF communication and method for assembly thereof
12/29/2009	US7638363 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
12/29/2009	US7638355 Solid state image pickup device and method of producing solid state image pickup device
12/29/2009	US7638352 Method of manufacturing photoelectric conversion device
12/29/2009	US7637414 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
12/29/2009	US7637176 Base design for self-centering
12/24/2009	US20090317932 Solid-state imaging device and method for manufacturing the same
12/24/2009	US20090316370 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods
12/24/2009	US20090315583 Testable integrated circuit and ic test method
12/24/2009	US20090315194 Semiconductor chip having alignment mark and method of manufacturing the same
12/24/2009	US20090315193 Semiconductor chip including identifying marks

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