Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2009
12/31/2009US20090321888 Alignment for backside illumination sensor
12/31/2009US20090321887 Method of fabricating an electromechanical structure including at least one mechanical reinforcing pillar
12/31/2009US20090321871 Chip Pad Resistant to Antenna Effect and Method
12/31/2009US20090321867 Method for production of packaged electronic components, and a packaged electronic component
12/31/2009US20090321848 Semiconductor device and method of manufacturing the same
12/31/2009US20090321777 Semiconductor package and semiconductor light-emitting device
12/31/2009US20090321735 Electrical Antifuse and Method of Programming
12/31/2009US20090321734 Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss
12/31/2009US20090321733 Metal heterocyclic compounds for deposition of thin films
12/31/2009US20090321719 Novel material and process for integrated ion chip
12/31/2009US20090321130 Enclosure With Integrated Heat Wick
12/31/2009US20090321061 Methods and apparatuses for transferring heat from stacked microfeature devices
12/31/2009DE202007018948U1 Elektroden mit Nanoröhrchen für organische optoelektronische Einrichtung Electrodes with carbon nanotubes for organic optoelectronic device
12/31/2009DE10297225B4 Plättchenbefestigungsklebstoffe insbesondere für Halbleiteranwendungen Die attach adhesives, especially for semiconductor applications
12/31/2009DE102009019029A1 Sensormodul Sensor module
12/31/2009DE102008030346A1 Arrangement for cooling radiation emitting semiconductor device, has surface of component connected with another surface of another component
12/31/2009DE102008028757A1 Halbleiterchipanordnung mit Sensorchip und Herstellungsverfahren Semiconductor chip assembly with sensor chip and manufacturing method
12/31/2009DE102008022365B3 Verfahren zum Abgleichen eines Prüflings Method for adjusting a device under test
12/31/2009DE102008017454A1 Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu Power semiconductor module with hermetically sealed circuit and manufacturing method therefor
12/31/2009DE102008002900A1 Antenna useful in an antenna arrangement for mobile radio sector, comprises flat composite structure with the layers connected with one another, where the layers are electrically conductive lattice structure and nanostructure
12/31/2009DE102005028996B4 Verfahren zum Anordnen eines elektronischen Bauteils in einer Ummantelung und Vorrichtung zum Fixieren eines elektronischen Bauteils in einer Ummantelung Method for arranging an electronic component in a sheath and a device for fixing an electronic component in a casing
12/31/2009DE102004060442B4 Verfahren zum Bilden einer Passivierungsschicht eines Halbleiterbauelements und Struktur einer Passivierungsschicht eines Halbleiterbauelements A method for forming a passivation film of a semiconductor device and a passivation layer structure of a semiconductor device
12/31/2009DE10138711B4 Kühlanordnung für in einem Gehäuse angeordnete Verlustwärme erzeugende elektrische Bauteile und elektrisches Gerät mit einer derartigen Kühlanordnung Cooling arrangement arranged in a housing for loss heat generating electrical components and electrical apparatus having such a cooling arrangement
12/30/2009WO2009158533A2 Wire on wire stitch bonding in a semiconductor device
12/30/2009WO2009158287A1 Active thermal control for stacked ic devices
12/30/2009WO2009158286A1 Concentric vias in electronic substrate
12/30/2009WO2009158259A1 Enclosure with integrated heat wick
12/30/2009WO2009158250A2 Apparatus and methods of forming package-on-package interconnects
12/30/2009WO2009158098A2 Package on package using a bump-less build up layer (bbul) package
12/30/2009WO2009157587A1 Acoustic wave device
12/30/2009WO2009157519A1 Heat exchange plate manufacturing method and heat exchange plate
12/30/2009WO2009157413A1 Semiconductor element and method for manufacturing same
12/30/2009WO2009157365A1 Semiconductor encapsulation material and method for encapsulating semiconductor using the same
12/30/2009WO2009157305A1 Method for manufacturing a piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio watch
12/30/2009WO2009157247A1 Wiring board and liquid crystal display device
12/30/2009WO2009157113A1 Semiconductor device and method for manufacturing the same
12/30/2009WO2009156970A1 Packaged semiconductor product and method for manufacture thereof
12/30/2009WO2009155707A1 Energy dissipating packages for high power operation of optical fiber components
12/30/2009WO2009132922A3 Substrate-mounted circuit module comprising components in a plurality of contact planes
12/30/2009WO2009126501A3 Reliability improvement in a compound semiconductor mmic
12/30/2009WO2009120766A3 Nanocomposite dielectric coatings
12/30/2009WO2009120612A3 Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
12/30/2009WO2009108335A3 Hermetically-sealed packages for electronic components having reduced unused areas
12/30/2009WO2009088522A3 Cobalt nitride layers for copper interconnects and methods for forming them
12/30/2009WO2008091922A3 Semiconductor package having evaporated symbolization
12/30/2009EP2139042A1 High voltage device with constant current source and manufacturing method thereof
12/30/2009EP2139038A2 Horizontal interconnection architecture based on carbon nanotubes
12/30/2009EP2139037A1 Interconnect structure for electromigration enhancement
12/30/2009EP2139034A1 Structure to facilitate plating into high aspect ratio vias and method of its fabrication
12/30/2009EP2138539A1 Fluorine-containing elastomer composition and sealing material composed of the same
12/30/2009EP2138525A1 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof
12/30/2009EP2137764A1 Semiconductor body and method for voltage regulation
12/30/2009EP2137763A2 Package, method of manufacturing a package and frame
12/30/2009EP1547136B1 Method for making a wire nanostructure in a semiconductor film
12/30/2009CN201374893Y Heat radiation component and electronic device utilizing same
12/30/2009CN201374892Y Combined type heat radiation device
12/30/2009CN201374890Y Flat-plate heat pipe and heat abstractor formed by integrated design thereof with porous medium
12/30/2009CN201374644Y Flat package power factor corrector
12/30/2009CN201374349Y Sealing cover plate of organic light emitting display
12/30/2009CN201374334Y Flat package double controllable silicon bridge-arm tube
12/30/2009CN201374333Y Integrated circuit structure adopting novel layout
12/30/2009CN201374332Y Multifunction flat package four lead frame
12/30/2009CN201374331Y Automotive rectifier bridge with press-fit diode
12/30/2009CN201374330Y Heat sink structure
12/30/2009CN201374329Y Press-package automotive rectifier diode closed by plastic shell
12/30/2009CN201374328Y Package structure of image sensing chip
12/30/2009CN201374327Y Ceramic small-shape shell
12/30/2009CN201374027Y Fastening and bearing device and auxiliary fixing module
12/30/2009CN201373369Y Combined LED cylindrical lamp
12/30/2009CN201373368Y LED down lamp
12/30/2009CN201373367Y High-power LED light source module adopting semiconductor for cooling
12/30/2009CN201373363Y Radiating assembly, backboard and lamp
12/30/2009CN201373362Y Radiating structure of LED lamp and LED lamp
12/30/2009CN201373344Y Light emitting diode frame structure and light emitting diode packaging module
12/30/2009CN201373340Y LED lamp tube
12/30/2009CN201373315Y Easy-to-radiate LED ceiling lamp
12/30/2009CN201373311Y LED road lamp
12/30/2009CN201373306Y Novel LED street lamp
12/30/2009CN201373282Y Heat dissipation structure of LED panel lamp
12/30/2009CN201373273Y Reflective LED lamp
12/30/2009CN101617403A A high power integrated RF amplifier
12/30/2009CN101617402A Sensing circuit for devices with protective coating
12/30/2009CN101617401A Heat sink
12/30/2009CN101617400A Semiconductor device and method for manufacturing the same
12/30/2009CN101615608A Semiconductor device and method of manufacturing same
12/30/2009CN101615607A Chip package structure
12/30/2009CN101615606A Chip bonding pad of integrated circuit, manufacture method thereof and integrated circuit comprising bonding pad
12/30/2009CN101615605A 半导体集成电路 The semiconductor integrated circuit
12/30/2009CN101615604A Semiconductor device and semiconductor integrated circuit
12/30/2009CN101615603A Mounting structure and mounting method
12/30/2009CN101615602A Semiconductor device, test mould and test method
12/30/2009CN101615601A Vertically upward contact semiconductor and method thereof
12/30/2009CN101615600A High-thermal conductivity electronic packaging material and preparation method thereof
12/30/2009CN101615599A Process method of ceramic shell for six-inch ultrahigh power silicon-controlled element
12/30/2009CN101615598A Protection sealing ring used for preventing stress caused by cutting die
12/30/2009CN101614339A Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus
12/30/2009CN100576979C Printed circuit board and manufacturing method thereof
12/30/2009CN100576560C Display apparatus
12/30/2009CN100576555C Image device
12/30/2009CN100576554C Image sensor package and fabrication method thereof
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