| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/06/2010 | CN201378593Y Thin-type integrated circuit lead-wire frame |
| 01/06/2010 | CN201378592Y High-efficiency cross-grid power semiconductor radiator |
| 01/06/2010 | CN201378591Y Surface-mounted metal wall ceramic substrate shell |
| 01/06/2010 | CN201378237Y Picture element array substrate |
| 01/06/2010 | CN201378008Y Riveted heat radiation fin |
| 01/06/2010 | CN201377773Y Substrate |
| 01/06/2010 | CN201377772Y Heat conducting and radiating device for high-power LED lamp |
| 01/06/2010 | CN201377736Y LED high-power tunnel lamp with wings |
| 01/06/2010 | CN201377717Y Improved LED down lamp |
| 01/06/2010 | CN201377694Y LED illumination equipment with radiating structure |
| 01/06/2010 | CN201376890Y Self-powered circuit for MEMS-based sensors |
| 01/06/2010 | CN101622706A Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package |
| 01/06/2010 | CN101621048A Composite semiconductor device, print head and image forming apparatus |
| 01/06/2010 | CN101621047A Framework for reducing far end crosstalk between signal circuits |
| 01/06/2010 | CN101621046A Semiconductor package using through-electrodes having voids |
| 01/06/2010 | CN101621045A Circuit substrate and its formation method and semiconductor encapsulation |
| 01/06/2010 | CN101621044A Chip lug structure and manufacturing method thereof |
| 01/06/2010 | CN101621043A Standing chip scale package |
| 01/06/2010 | CN101621042A Prolate glass sealed surface mounting diode and packaging tape thereof |
| 01/06/2010 | CN101621041A Packaging structure with reconfiguration chip and method thereof |
| 01/06/2010 | CN101621040A Semiconductor device |
| 01/06/2010 | CN100579348C Cooler for electronic equipment |
| 01/06/2010 | CN100578854C Waveguide in semiconductor integrated circuit and electromagnetic wave shielding |
| 01/06/2010 | CN100578816C Method for forming contact and packaged integrated circuit component |
| 01/06/2010 | CN100578808C Thin film semiconductor device, and its making process and liquid crystal display |
| 01/06/2010 | CN100578807C Display device and manufacturing method of the display device |
| 01/06/2010 | CN100578804C Phase-change memory device and method of manufacturing same |
| 01/06/2010 | CN100578802C Vertical type CMOS iamge sensor and method for manufacturing the same |
| 01/06/2010 | CN100578798C Sensing chip structure with overlapping pattern layer, sensing chip encapsulation and preparation method |
| 01/06/2010 | CN100578796C Active element array substrate |
| 01/06/2010 | CN100578795C Semiconductor device and a manufacturing method for the same |
| 01/06/2010 | CN100578791C Transistor structure and method for manufacturing same |
| 01/06/2010 | CN100578787C Semiconductor device and method for manufacturing same |
| 01/06/2010 | CN100578786C Organic electroluminescence display device and method of manfacturing the same |
| 01/06/2010 | CN100578784C Organic light emitting display |
| 01/06/2010 | CN100578782C Large power multi-chip encapsulation construction |
| 01/06/2010 | CN100578780C LED array packaging structure with silicon carrier plate and its production method |
| 01/06/2010 | CN100578779C Micro-cell and semiconductor packaging with micro-cell |
| 01/06/2010 | CN100578778C Electronic device |
| 01/06/2010 | CN100578777C Semiconductor protective component, semiconductor device and producing method thereof |
| 01/06/2010 | CN100578776C Integrated circuit chip and power line structure thereof |
| 01/06/2010 | CN100578775C Fabrication structure for protecting electronic chip joint and manufacturing method thereof |
| 01/06/2010 | CN100578774C Interconnect module with reduced power distribution impedance and manufacturing method thereof |
| 01/06/2010 | CN100578773C Memory module systems and methods |
| 01/06/2010 | CN100578772C Electronic component with lead using Pb-free solder |
| 01/06/2010 | CN100578771C Embedded type chip packaging structure |
| 01/06/2010 | CN100578770C Power module having independent cooling system |
| 01/06/2010 | CN100578769C Organic matrices containing nano materials to enhance bulk thermal conductivity |
| 01/06/2010 | CN100578768C Heat dissipation device and power module |
| 01/06/2010 | CN100578767C Heat sink, forming method thereof and heat sink system |
| 01/06/2010 | CN100578766C Chip packaging construct and manufacturing method thereof |
| 01/06/2010 | CN100578765C Integrated circuit package structure |
| 01/06/2010 | CN100578764C Optical semiconductor device, optical connector and electronic equipment |
| 01/06/2010 | CN100578763C Semiconductor package and producing method thereof |
| 01/06/2010 | CN100578762C Circuit device and mixing integrated circuit device |
| 01/06/2010 | CN100578761C Manufacturing method for thin-film transistor array substrate |
| 01/06/2010 | CN100578754C Semiconductor device having damascene MIM type capacitor and method for manufacturing same |
| 01/06/2010 | CN100578752C Method for forming interconnect structures |
| 01/06/2010 | CN100578746C Under bump metallization layer enable to use high tin content solder bumps |
| 01/06/2010 | CN100578745C Making method for semiconductor device and semiconductor device |
| 01/06/2010 | CN100578743C Method for forming cu film |
| 01/06/2010 | CN100578735C Semiconductor layer structure and method of fabricating same |
| 01/06/2010 | CN100578536C 半导体存储卡 The semiconductor memory card |
| 01/06/2010 | CN100578201C Wire layout checking method |
| 01/06/2010 | CN100578080C High power light-emitting diode illuminating source heat radiating device |
| 01/06/2010 | CN100577768C Electronic packaging material |
| 01/05/2010 | US7643956 Continuous self-calibration of internal analog signals |
| 01/05/2010 | US7642769 Insert and tray for electronic device handling apparatus, and electronic device handling apparatus |
| 01/05/2010 | US7642662 Semiconductor device and method of manufacturing the same |
| 01/05/2010 | US7642661 Flip-chip type semiconductor is encapsulated by a cured product of a liquid epoxy resin composition comprising a liquid epoxy resin, an amine type curing agent, sulfur-containing phenol compound, an inorganic filler; easy to handle and allows simplification of semiconductor device production process |
| 01/05/2010 | US7642660 Method and apparatus for reducing electrical interconnection fatigue |
| 01/05/2010 | US7642658 Pad structure to prompt excellent bondability for low-k intermetal dielectric layers |
| 01/05/2010 | US7642657 Stacked MEMS device |
| 01/05/2010 | US7642656 Semiconductor package and method for manufacturing thereof |
| 01/05/2010 | US7642655 Includes an insulating film containing fluorine formed on a substrate, a titanium aluminum alloy film formed on the insulating film, and a metallic film comprising aluminum or an aluminum alloy formed on the titanium aluminum alloy film; nonpeeling |
| 01/05/2010 | US7642654 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor to be used for reliability evaluation |
| 01/05/2010 | US7642653 Semiconductor device, wiring of semiconductor device, and method of forming wiring |
| 01/05/2010 | US7642652 Semiconductor integrated circuit device and a method of manufacturing the same |
| 01/05/2010 | US7642651 Multi-layer interconnect with isolation layer |
| 01/05/2010 | US7642650 Semiconductor device having a pillar structure |
| 01/05/2010 | US7642649 Support structure for low-k dielectrics |
| 01/05/2010 | US7642648 Semiconductor device having a reductant layer and manufacturing method thereof |
| 01/05/2010 | US7642647 Semiconductor device |
| 01/05/2010 | US7642646 Semiconductor device and method of manufacturing the same |
| 01/05/2010 | US7642645 Systems and methods for aligning wafers or substrates |
| 01/05/2010 | US7642644 Packaging for high power integrated circuits |
| 01/05/2010 | US7642643 Apparatus for molding a semiconductor die package with enhanced thermal conductivity |
| 01/05/2010 | US7642642 Microcap wafer bonding apparatus |
| 01/05/2010 | US7642641 Integrated circuit component with passivation layer |
| 01/05/2010 | US7642640 Semiconductor device and manufacturing process thereof |
| 01/05/2010 | US7642639 COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same |
| 01/05/2010 | US7642638 Inverted lead frame in substrate |
| 01/05/2010 | US7642637 Carrier for stacked type semiconductor device and method of fabricating the same |
| 01/05/2010 | US7642636 Stack package of ball grid array type |
| 01/05/2010 | US7642635 Stacked semiconductor package |
| 01/05/2010 | US7642634 Chip package and stacked structure of chip packages |
| 01/05/2010 | US7642633 Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner |
| 01/05/2010 | US7642632 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same |
| 01/05/2010 | US7642631 Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer |
| 01/05/2010 | US7642630 Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom |