| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/07/2010 | WO2010001931A1 Method for thin-film formation and apparatus for thin-film formation |
| 01/07/2010 | WO2010001885A1 Piezoelectric vibration device and method for manufacturing piezoelectric vibration device |
| 01/07/2010 | WO2010001815A1 Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor device |
| 01/07/2010 | WO2010001715A1 Wiring forming method |
| 01/07/2010 | WO2010001686A1 Semiconductor device using grapheme-graphite film and method of fabricating the same |
| 01/07/2010 | WO2010001597A1 Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 01/07/2010 | WO2010001524A1 Solid-state image pickup element, method for manufacturing the same, and solid-state image pickup device |
| 01/07/2010 | WO2010001505A1 Electronic component |
| 01/07/2010 | WO2010001504A1 Electronic component |
| 01/07/2010 | WO2010001503A1 Electronic component |
| 01/07/2010 | WO2010001495A1 Laminated chip |
| 01/07/2010 | WO2010001054A2 Method of preparing an electrical insulation film and application for the metallization of through-vias |
| 01/07/2010 | WO2010000749A1 Integrated circuit structure |
| 01/07/2010 | WO2010000605A1 Planar electrical power electronic modules for high-temperature applications, and corresponding production methods |
| 01/07/2010 | WO2009139962A3 Efficient interconnect structure for electrical fuse applications |
| 01/07/2010 | WO2009139958A3 Backside controlled mems capacitive sensor and interface and method |
| 01/07/2010 | WO2009124121A3 Solder ball interface |
| 01/07/2010 | WO2009115686A3 Connection component with hollow inserts and method for making same |
| 01/07/2010 | WO2009079512A3 Double bonded heat dissipation |
| 01/07/2010 | US20100004425 Source material for preparing low dielectric constant material |
| 01/07/2010 | US20100003814 Interconnections Having Double Capping Layer and Method for Forming the Same |
| 01/07/2010 | US20100003808 Method of preparing an electrically insulating film and application for the metallization of vias |
| 01/07/2010 | US20100003516 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 01/07/2010 | US20100001416 Wafer laser-marking method and die fabricated using the same |
| 01/07/2010 | US20100001415 Liquid epoxy resin composition |
| 01/07/2010 | US20100001414 Manufacturing a semiconductor device via etching a semiconductor chip to a first layer |
| 01/07/2010 | US20100001413 Semiconductor Device and Semiconductor Device Manufacturing Method |
| 01/07/2010 | US20100001412 Bond pad structure |
| 01/07/2010 | US20100001411 Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates |
| 01/07/2010 | US20100001410 Flip chip overmold package |
| 01/07/2010 | US20100001409 Semiconductor device and method of manufacturing thereof |
| 01/07/2010 | US20100001408 Semiconductor device and method of manufacturing semiconductor device |
| 01/07/2010 | US20100001407 Galvanic mask |
| 01/07/2010 | US20100001406 Artificially tilted via connection |
| 01/07/2010 | US20100001405 Integrated circuit structure |
| 01/07/2010 | US20100001404 Semiconductor integrated circuit device |
| 01/07/2010 | US20100001403 Method for designing semiconductor integrated circuit which includes metallic wiring connected to gate electrode and satisfies antenna criterion |
| 01/07/2010 | US20100001402 Multiple Patterning Method |
| 01/07/2010 | US20100001401 Semiconductor device including interconnect layer made of copper |
| 01/07/2010 | US20100001400 Solder contact |
| 01/07/2010 | US20100001399 Semiconductor Chip Passivation Structures and Methods of Making the Same |
| 01/07/2010 | US20100001398 Semiconductor chip module and manufacturing method thereof |
| 01/07/2010 | US20100001397 Semiconductor device |
| 01/07/2010 | US20100001396 Repairable semiconductor device and method |
| 01/07/2010 | US20100001395 Semiconductor chip assembly with post/base heat spreader and vertical signal routing |
| 01/07/2010 | US20100001394 Chip package with esd protection structure |
| 01/07/2010 | US20100001393 Semiconductor device |
| 01/07/2010 | US20100001392 Semiconductor package |
| 01/07/2010 | US20100001391 Integrated circuit package system with supported stacked die |
| 01/07/2010 | US20100001390 System in package module |
| 01/07/2010 | US20100001389 Package structure for radio frequency module and manufacturing method thereof |
| 01/07/2010 | US20100001388 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
| 01/07/2010 | US20100001387 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
| 01/07/2010 | US20100001386 Semiconductor device and manufacturing method therefor |
| 01/07/2010 | US20100001385 Integrated circuit package system with bumped lead and nonbumped lead |
| 01/07/2010 | US20100001384 Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation |
| 01/07/2010 | US20100001383 Integrated circuit package with molded insulation |
| 01/07/2010 | US20100001382 Manufacturing method for integrating a shunt resistor into a semiconductor package |
| 01/07/2010 | US20100001380 Semiconductor device and method of manufacturing the same |
| 01/07/2010 | US20100001378 Through-substrate vias and method of fabricating same |
| 01/07/2010 | US20100001377 Semiconductor device |
| 01/07/2010 | US20100001363 Semiconductor Device and Method of Providing Electrostatic Discharge Protection for Integrated Passive Devices |
| 01/07/2010 | US20100001361 Suspended getter material-based structure |
| 01/07/2010 | US20100001359 Transparent conductive layer and method of manufacturing the same |
| 01/07/2010 | US20100001357 Integrated circuit package, notably for image sensor, and method of positioning |
| 01/07/2010 | US20100001331 Semiconductor device and manufacturing method thereof |
| 01/07/2010 | US20100001329 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 01/07/2010 | US20100001321 Semiconductor Device Layout Having Restricted Layout Region Including Rectangular Shaped Gate Electrode Layout Features Defined Along At Least Four Gate Electrode Tracks with Corresponding Non-Symmetric Diffusion Regions |
| 01/07/2010 | US20100001307 Encapsulation for electronic and/or optoelectronic device |
| 01/07/2010 | US20100001291 Electronic device and manufacturing thereof |
| 01/07/2010 | US20100001269 Methods of Combinatorial Processing for Screening Multiple Samples on a Semiconductor Substrate |
| 01/07/2010 | US20100001268 Semiconductor Device and Method of Shunt Test Measurement for Passive Circuits |
| 01/07/2010 | US20100001174 Semiconductor device, its manufacturing method and optical pickup module |
| 01/07/2010 | US20100000768 Lead-embedded metallized ceramics substrate and package |
| 01/07/2010 | US20100000083 Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
| 01/07/2010 | US20100000076 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 01/07/2010 | DE112008000234T5 Vorgeformte Clip-Struktur Preformed clip structure |
| 01/07/2010 | DE102008050852A1 Halbleitervorrichtung mit abdichtendem Harzabschnitt Semiconductor device with sealing resin section |
| 01/07/2010 | DE102008040056A1 Electronic components cooling arrangement for electronic circuits i.e. integrated circuits, has cooling element with surface formed as surface of base, where surfaces of element and component contact in heat-transferring manner |
| 01/07/2010 | DE102008038302A1 System-in-Package Modul und dieses umfassendes mobiles Endgerät System-in-Package module and this comprehensive mobile device |
| 01/07/2010 | DE102006046820B4 Verfahren zum Packen im Chipmassstab für integrierte Schaltungen The method of packing in chip scale integrated circuit |
| 01/07/2010 | DE102006044369B4 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity |
| 01/07/2010 | DE102005056906B4 Integrierte Schaltungsanordnung mit in Reihe geschalteten Kondensatoren und Verwendung An integrated circuit device with capacitors connected in series and using |
| 01/07/2010 | DE10165028B4 Halbleitervorrichtung mit einem Halbleitersubstrat und einem Film mit niedriger Dielektrizitätskonstante A semiconductor device comprising a semiconductor substrate and a low dielectric constant film |
| 01/07/2010 | CA2728498A1 Method of preparing an electrical insulation film and application for the metallization of through-vias |
| 01/06/2010 | EP2141972A1 Component-incorporating module and its manufacturing method |
| 01/06/2010 | EP2141740A2 Semiconductor device |
| 01/06/2010 | EP2141201A1 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same |
| 01/06/2010 | EP2141187A1 Aromatic polyimide and process for production thereof |
| 01/06/2010 | EP2140963A1 Pb-free solder-connected electronic article |
| 01/06/2010 | EP2140493A1 Termination and contact structures for a high voltage gan-based heterojunction transistor |
| 01/06/2010 | EP2140490A1 Fabricating a contact rhodium structure by electroplating and electroplating composition |
| 01/06/2010 | EP2140489A1 Method for manufacturing an element having electrically conductive members for application in a microelectronic package |
| 01/06/2010 | EP2140484A2 Solder bump interconnect for improved mechanical and thermo mechanical performance |
| 01/06/2010 | EP2140481A1 Method and structure for reducing cracks in a dielectric layer in contact with metal |
| 01/06/2010 | EP2139553A2 Apparatus and method for setting the parameters of an alert window used for timing the delivery of etc signals to a heart under varying cardiac conditions |
| 01/06/2010 | EP2070114B1 Flip-chip interconnection through chip vias |
| 01/06/2010 | EP2061840B1 Curable orgnopolysiloxane composition and semiconductor device |
| 01/06/2010 | EP1549216B1 Sensor for determining the effect of anaesthetic treatment by cooling the skin with the sensor |
| 01/06/2010 | CN201378594Y Transparent conductive film glass |