| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/13/2010 | CN101626013A Fuse structure for interdicting splatter |
| 01/13/2010 | CN101626012A Long-term annealed integrated circuit arrangements and method for producing the same |
| 01/13/2010 | CN101626011A Base plate having pad-free type conductive traces and using for encapsulation |
| 01/13/2010 | CN101626010A Chip on film packaging structure and chip on film packaging method |
| 01/13/2010 | CN101626009A Substrate panel |
| 01/13/2010 | CN101626008A Production method of encapsulated component of copper wire bonding IC chip |
| 01/13/2010 | CN101626007A Ultrathin pre-plating layer lead frame and preparation method thereof |
| 01/13/2010 | CN101626006A Flexible bonding copper wire and preparation method thereof |
| 01/13/2010 | CN101626005A Bonding filamentary silver and preparation method thereof |
| 01/13/2010 | CN101626004A Semiconductor package and semiconductor device |
| 01/13/2010 | CN101626003A Semiconductor package and method for packaging a semiconductor package |
| 01/13/2010 | CN101626002A Bond pad structure |
| 01/13/2010 | CN101626001A Semiconductor device and method of manufacturing the same |
| 01/13/2010 | CN101626000A Metal array basal plate, photoelectric element, light-emitting element and manufacturing method thereof |
| 01/13/2010 | CN100581334C Cooling apparatus and method of manufacturing the same |
| 01/13/2010 | CN100581333C Cooling substrate of micro heat pipe |
| 01/13/2010 | CN100581216C Micro camera module and method of manufacturing the same |
| 01/13/2010 | CN100580949C Organic electro-luminescence display device and method for fabricating the same |
| 01/13/2010 | CN100580948C Flat panel display device |
| 01/13/2010 | CN100580945C Method for manufacturing thin film transistor device |
| 01/13/2010 | CN100580941C Semiconductor imaging device |
| 01/13/2010 | CN100580939C Display device and its manufacture method |
| 01/13/2010 | CN100580938C Active part array base plate and LCD panel |
| 01/13/2010 | CN100580937C Thin film transistor array substrate and method of manufacturing the same |
| 01/13/2010 | CN100580936C Display device and method of manufacturing the same |
| 01/13/2010 | CN100580931C Ferroelectric memory and method for manufacturing same |
| 01/13/2010 | CN100580924C Current-limiting resistance |
| 01/13/2010 | CN100580923C Quanta trap infrared detector for multi-folded light dispersion coupling |
| 01/13/2010 | CN100580922C Semiconductor device |
| 01/13/2010 | CN100580921C Semi-conductor light source device |
| 01/13/2010 | CN100580920C Wafer structure having capacitance elements and method for forming capacitance elements on the wafer |
| 01/13/2010 | CN100580919C Semiconductor package substrate for improving deform |
| 01/13/2010 | CN100580918C Encapsulation structure capable of reducing encapsulation stress |
| 01/13/2010 | CN100580917C Semiconductor device and fabricating method thereof |
| 01/13/2010 | CN100580916C 半导体器件 Semiconductor devices |
| 01/13/2010 | CN100580915C Packaging conductive structure and its manufacturing method |
| 01/13/2010 | CN100580914C Packaging conductive structure and its forming method |
| 01/13/2010 | CN100580913C Rewinding type semiconductor packaging construction and substrate thereof |
| 01/13/2010 | CN100580912C Semiconductor device and method of manufacturing the same |
| 01/13/2010 | CN100580911C Circuit module and circuit device using the circuit module |
| 01/13/2010 | CN100580910C 半导体装置 Semiconductor device |
| 01/13/2010 | CN100580909C Gallium nitride substrate and methods for testing and manufacturing same |
| 01/13/2010 | CN100580897C Method for manufacturing flat top protrusion block structure |
| 01/13/2010 | CN100580895C Sealing method and corresponding device of air tight type chip |
| 01/13/2010 | CN100580809C SRAM device and operating method thereof |
| 01/13/2010 | CN100579891C Method for forming microelectronic spring structures on substrate |
| 01/12/2010 | USRE41075 Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system |
| 01/12/2010 | US7646614 Thin film deposition as an active conductor and method therefor |
| 01/12/2010 | US7646428 Package for solid image pickup element and solid image pickup device |
| 01/12/2010 | US7646208 On-chip detection of power supply vulnerabilities |
| 01/12/2010 | US7646105 Integrated circuit package system with package substrate having corner contacts |
| 01/12/2010 | US7646104 Structured semiconductor element for reducing charging effects |
| 01/12/2010 | US7646100 Semiconductor device with penetrating electrode |
| 01/12/2010 | US7646099 Self-aligned, integrated circuit contact |
| 01/12/2010 | US7646098 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same |
| 01/12/2010 | US7646097 Bond pads and methods for fabricating the same |
| 01/12/2010 | US7646096 Semiconductor device and manufacturing method thereof |
| 01/12/2010 | US7646095 Semiconductor device |
| 01/12/2010 | US7646094 Semiconductor device |
| 01/12/2010 | US7646093 Thermal management of dies on a secondary side of a package |
| 01/12/2010 | US7646092 Semiconductor device and manufacturing method thereof |
| 01/12/2010 | US7646091 Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation |
| 01/12/2010 | US7646090 Semiconductor module for making electrical contact with a connection device via a rewiring device |
| 01/12/2010 | US7646089 Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device |
| 01/12/2010 | US7646087 Multiple-dies semiconductor device with redistributed layer pads |
| 01/12/2010 | US7646086 Semiconductor package |
| 01/12/2010 | US7646085 Semiconductor device with power source feeding terminals of increased length |
| 01/12/2010 | US7646084 Deposition system for increasing deposition rates of metal layers from metal-carbonyl precursors |
| 01/12/2010 | US7646083 I/O connection scheme for QFN leadframe and package structures |
| 01/12/2010 | US7646082 Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density |
| 01/12/2010 | US7646081 Low-K dielectric material |
| 01/12/2010 | US7646078 Die saw crack stopper |
| 01/12/2010 | US7646077 Methods and structure for forming copper barrier layers integral with semiconductor substrates structures |
| 01/12/2010 | US7646067 Complementary metal-oxide-semiconductor transistor including multiple gate conductive layers and method of manufacturing the same |
| 01/12/2010 | US7646063 Compact CMOS ESD layout techniques with either fully segmented salicide ballasting (FSSB) in the source and/or drain regions |
| 01/12/2010 | US7646062 Semiconductor device comprising buried wiring layer |
| 01/12/2010 | US7646047 Solid-state imaging device and method for manufacturing the same |
| 01/12/2010 | US7646037 Organic light emitting apparatus and method of producing the same |
| 01/12/2010 | US7646030 Flip chip type LED lighting device manufacturing method |
| 01/12/2010 | US7646020 Apparatus for observing an assembled state of components and method of observing an assembled state of components using such apparatus |
| 01/12/2010 | US7646016 Method for automated testing of the modulation transfer function in image sensors |
| 01/12/2010 | US7645698 Method for forming barrier layer |
| 01/12/2010 | US7645659 Power semiconductor device using silicon substrate as field stop layer and method of manufacturing the same |
| 01/12/2010 | US7645639 Packaging of integrated circuits to lead frames |
| 01/12/2010 | US7645637 Methods for assembling thin semiconductor die |
| 01/12/2010 | US7645636 Semiconductor device and method for producing it, and use of an electrospinning method |
| 01/12/2010 | US7645634 Method of fabricating module having stacked chip scale semiconductor packages |
| 01/12/2010 | US7645522 Copper wire having gold enriched in a surface of the wire, wherein the bonding or superfine wire comprises a single phase system; wires are bonded to a semiconductor silicon chip; wire is storage stable for more than 100 hours unprotected from atmospheric influence |
| 01/12/2010 | US7645517 Rare earth-oxides, rare earth nitrides, rare earth phosphides and ternary alloys with silicon |
| 01/12/2010 | US7645410 Thermoplastic adhesive preform for heat sink attachment |
| 01/12/2010 | US7644855 Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 01/12/2010 | CA2280065C Clamping arrangement for compression-mounted power electronic devices |
| 01/07/2010 | WO2010002969A2 Flip chip overmold package |
| 01/07/2010 | WO2010002739A2 Flip chip assembly process for ultra thin substrate and package on package assembly |
| 01/07/2010 | WO2010002709A1 Methods and apparatuses for enhancing heat dissipation from a light emitting device |
| 01/07/2010 | WO2010002510A2 Methods and systems for packaging integrated circuits with integrated passive components |
| 01/07/2010 | WO2010002447A1 Contact trenches for enhancing stress transfer in closely spaced transistors |
| 01/07/2010 | WO2010002001A1 Silicon nitride board, method for manufacturing the silicon nitride board, and silicon nitride circuit board and semiconductor module using the silicon nitride board |
| 01/07/2010 | WO2010001998A1 Wiring structure, thin film transistor substrate, method for manufacturing thin film transistor substrate, and display device |
| 01/07/2010 | WO2010001992A1 Modified resin composition, method for producing the same, and curable resin composition containing the same |