| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/14/2010 | US20100007026 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007025 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device |
| 01/14/2010 | US20100007024 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007023 Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy |
| 01/14/2010 | US20100007022 Semiconductor device and manufacturing method thereof |
| 01/14/2010 | US20100007021 Methods of Fabricating Semiconductor Devices Including Porous Insulating Layers |
| 01/14/2010 | US20100007020 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007019 Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection |
| 01/14/2010 | US20100007018 Process for coating a bumped semiconductor wafer |
| 01/14/2010 | US20100007017 Inter-connecting structure for semiconductor package and method for the same |
| 01/14/2010 | US20100007016 Device with contact elements |
| 01/14/2010 | US20100007015 Integrated circuit device with improved underfill coverage |
| 01/14/2010 | US20100007013 Semiconductor device |
| 01/14/2010 | US20100007012 Electronic system modules |
| 01/14/2010 | US20100007011 Semiconductor package and method for packaging a semiconductor package |
| 01/14/2010 | US20100007010 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package |
| 01/14/2010 | US20100007009 Semiconductor package and method for processing and bonding a wire |
| 01/14/2010 | US20100007008 Bga package |
| 01/14/2010 | US20100007007 Semiconductor package |
| 01/14/2010 | US20100007006 Integrated Semiconductor Outline Package |
| 01/14/2010 | US20100007005 Semiconductor device |
| 01/14/2010 | US20100007004 Wafer and semiconductor package |
| 01/14/2010 | US20100007003 Semiconductor device |
| 01/14/2010 | US20100007002 Multi-layer semiconductor package |
| 01/14/2010 | US20100007001 Semiconductor package structure and method for manufacturing the same |
| 01/14/2010 | US20100007000 Package stacking system with mold contamination prevention |
| 01/14/2010 | US20100006999 Substrate bonding method and electronic component thereof |
| 01/14/2010 | US20100006998 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package |
| 01/14/2010 | US20100006997 Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar |
| 01/14/2010 | US20100006996 Carrier for bonding a semiconductor ship onto and a method of contracting a semiconductor chip to a carrier |
| 01/14/2010 | US20100006995 Resin-encapsulated semiconductor device and its manufacturing method |
| 01/14/2010 | US20100006994 Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier |
| 01/14/2010 | US20100006993 Integrated circuit package system with chip on lead |
| 01/14/2010 | US20100006992 Fine-pitch routing in a lead frame based system-in-package (SIP) device |
| 01/14/2010 | US20100006991 Packaging integrated circuits for high stress environments |
| 01/14/2010 | US20100006990 Interconnect structure for high frequency signal transmissions |
| 01/14/2010 | US20100006989 Method of forming a shielded semiconductor device and structure therefor |
| 01/14/2010 | US20100006988 Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging |
| 01/14/2010 | US20100006987 Integrated circuit package with emi shield |
| 01/14/2010 | US20100006986 Semiconductor Device Layout Including Cell Layout Having Restricted Gate Electrode Level Layout with Rectangular Shaped Gate Electrode Layout Features Defined Along At Least Four Gate Electrode Tracks with Corresponding Non-Symmetric Diffusion Regions |
| 01/14/2010 | US20100006984 Semiconductor device |
| 01/14/2010 | US20100006982 Method of producing semiconductor wafer |
| 01/14/2010 | US20100006974 Storage nitride encapsulation for non-planar sonos nand flash charge retention |
| 01/14/2010 | US20100006969 Image sensor, substrate for the same, image sensing device including the image sensor, and associated methods |
| 01/14/2010 | US20100006963 Wafer level processing for backside illuminated sensors |
| 01/14/2010 | US20100006959 Package of mems device and method for fabricating the same |
| 01/14/2010 | US20100006943 Electrostatic discharge protection device |
| 01/14/2010 | US20100006942 Interconnection structure and electronic device employing the same |
| 01/14/2010 | US20100006912 Planar Metal-Insulator-Metal Circuit Element and Method for Planar Integration of Same |
| 01/14/2010 | US20100006899 Semiconductor Device Portion Having Gate Electrode Conductive Structures Formed from Rectangular Shaped Gate Electrode Layout Features and Having Equal Number of PMOS and NMOS Transistors |
| 01/14/2010 | US20100006890 ESD Protection Device with Increased Holding Voltage During Normal Operation |
| 01/14/2010 | US20100006869 Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package |
| 01/14/2010 | US20100006850 Beol compatible fet structure |
| 01/14/2010 | US20100006839 Method of manufacturing tft substrate and tft substrate |
| 01/14/2010 | US20100006838 Active matrix substrate, display device, and active matrix substrate inspecting method |
| 01/14/2010 | US20100006825 Superconducting junction element and superconducting junction circuit |
| 01/14/2010 | US20100006336 Lid or case for sealed package and method for manufacturing the same |
| 01/14/2010 | US20100006328 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/14/2010 | US20100006271 Cooling fan |
| 01/14/2010 | DE112008000760T5 Halbleitervorrichtung und elektrisch betriebenes Fahrzeug Semiconductor device and electrically powered vehicle |
| 01/14/2010 | DE10356153B4 Modul für kontaktlose Chipkarten oder Identifizierungssysteme Module for contactless chip cards or identification systems |
| 01/14/2010 | DE10232788B4 Elektronisches Bauteil mit einem Halbleiterchip auf einem Systemträger, Systemträger und Verfahren zur Herstellung eines elektronischen Bauteils Electronic component having a semiconductor chip on a carrier, lead frame and method for manufacturing an electronic component |
| 01/14/2010 | DE102009030957A1 Verfahren zum Herstellen einer Halbleiteranordnung mittels Ätzung eines Halbleiterchips und Halbleiteranordnung A method of manufacturing a semiconductor arrangement by means of etching of a semiconductor chip and semiconductor device |
| 01/14/2010 | DE102009029873A1 Reparierbares Halbleiterbauelement und Verfahren A repairable semiconductor device and method |
| 01/14/2010 | DE102009027487A1 Bestimmung der Temperatur eines Halbleiterbauelements Determining the temperature of a semiconductor device |
| 01/14/2010 | DE102009025575A1 Halbleiterchip mit Identifizierungsmarkierungen Semiconductor chip with identification markers |
| 01/14/2010 | DE102009025413A1 Vorrichtung, die eine Imidschicht mit Nichtkontaktöffnung umfasst, und Verfahren An apparatus comprising an imide layer with a non-contact opening and methods |
| 01/14/2010 | DE102008040290A1 Hybrid circuit structure for use in automotive-area, has low-current substrate for carrying low current components, and power substrate comprising front side with contact surface section, where low-current substrate is fastened to section |
| 01/14/2010 | DE102008040281A1 Vorrichtung und Verfahren zur Kühlung von Bauteilen Apparatus and method for cooling components |
| 01/14/2010 | DE102008031297A1 Semiconductor module i.e. power semiconductor module, has filling compound provided in part of housing, and containing non-hardening, thermoplastic polymer with reversible phase change characteristics |
| 01/14/2010 | DE102004010956B4 Halbleiterbauteil mit einem dünnen Halbleiterchip und einem steifen Verdrahtungssubstrat sowie Verfahren zur Herstellung und Weiterverarbeitung von dünnen Halbleiterchips A semiconductor device comprising a thin semiconductor chip and a rigid wiring substrate and methods of making and further processing of thin semiconductor chips |
| 01/14/2010 | DE10043014B4 Kühlelement zum Kühlen eines elektrischen Bauteiles A cooling element for cooling an electrical component |
| 01/14/2010 | CA2730077A1 Packaging device and base member for packaging |
| 01/13/2010 | EP2144329A1 Radio frequency integrated circuit packages |
| 01/13/2010 | EP2143140A2 Method for the production of a rigid power module |
| 01/13/2010 | EP2143139A1 Cooling box for components or circuits |
| 01/13/2010 | EP2143138A1 Cooling body |
| 01/13/2010 | EP2142682A2 Cobalt nitride layers for copper interconnects and methods for forming them |
| 01/13/2010 | EP2142490A1 Method for producing a metalized component, corresponding component, and a substrate for supporting the component during metalization |
| 01/13/2010 | EP2142294A2 A method for the sorption of gaseous contaminants by means of nanostructured sorbers in the form of a fiber |
| 01/13/2010 | EP1866960B1 Radiation curable cycloaliphatic barrier sealants |
| 01/13/2010 | EP1811824B1 Multilayer printed wiring board and process for producing the same |
| 01/13/2010 | CN201383911Y Thermal module and electric apparatus using the same |
| 01/13/2010 | CN201383909Y Micro-channel cold plate device for liquid cooling radiator |
| 01/13/2010 | CN201383498Y Semiconductor diode chip |
| 01/13/2010 | CN201383497Y Lead frame structure and surface mounted semiconductor packaging structure formed by the same |
| 01/13/2010 | CN201382395Y Radiating module for LED lamp |
| 01/13/2010 | CN201382393Y LED used for road illumination |
| 01/13/2010 | CN201382392Y Mining flame-proofing LED lamp |
| 01/13/2010 | CN201382345Y Heat pipe type LED indoor lighting fitting housing |
| 01/13/2010 | CN201382328Y Heat tube type LED tunnel lamp housing |
| 01/13/2010 | CN201382327Y Heat tube type LED outdoor-lighting fitting without main beam housing |
| 01/13/2010 | CN201382326Y Heat tube type LED outdoor-lighting fitting provided with main beam housing |
| 01/13/2010 | CN201382311Y High-power LED spot lamp with wing-shaped radiating fins |
| 01/13/2010 | CN201382292Y LED lamp |
| 01/13/2010 | CN201382279Y Ceramic semiconductor thermoelectric cooling LED |
| 01/13/2010 | CN101627473A Methods of formimg a single layer substrate for high capacity memory cards |
| 01/13/2010 | CN101627472A Heat sink, electronic device, and method of manufacturing electronic device |
| 01/13/2010 | CN101627471A Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
| 01/13/2010 | CN101626659A Preferential via system for differential signal circuit of circuit board |