| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/20/2010 | CN100583566C Pressure contact spring for contact arrangement in power semiconductor module |
| 01/20/2010 | CN100583471C Light emitting device and method for manufacturing light emitting device |
| 01/20/2010 | CN100583470C LED radiating device combination |
| 01/20/2010 | CN100583459C Pixel structure and its thin film transistor |
| 01/20/2010 | CN100583453C Ldmos晶体管 Ldmos transistor |
| 01/20/2010 | CN100583445C Substrate material and heterostructure |
| 01/20/2010 | CN100583444C Active element array substrate |
| 01/20/2010 | CN100583441C Bitline transistor architecture for flash memory |
| 01/20/2010 | CN100583440C Dual-gate dynamic random access memory device and method of fabricating the same |
| 01/20/2010 | CN100583437C 电子器件及其使用 Electronic devices and their use |
| 01/20/2010 | CN100583436C Semiconductor device and its making method |
| 01/20/2010 | CN100583433C Uninsulated double tower type diode module |
| 01/20/2010 | CN100583431C Manufacture method of stacking chip encapsulation structure |
| 01/20/2010 | CN100583430C Connecting member used for semiconductor device and semiconductor device provided with the same |
| 01/20/2010 | CN100583429C PMOS pipe built-in bidirectional thyristor electrostatic protection device |
| 01/20/2010 | CN100583428C Selective reference plane bridge(s) on folded package |
| 01/20/2010 | CN100583427C Metal interconnect structure for a microelectronic element |
| 01/20/2010 | CN100583426C Semiconductor device and method for manufacturing same |
| 01/20/2010 | CN100583425C Method for manufacturing through-hole and electronic device |
| 01/20/2010 | CN100583424C Encapsulation base plate |
| 01/20/2010 | CN100583423C Multilayered wiring substrate and method of manufacturing the same |
| 01/20/2010 | CN100583422C Electronic part with electromagnetic interference shielding action and its encapsulation method |
| 01/20/2010 | CN100583421C Semiconductor package structure for vertical mount and method |
| 01/20/2010 | CN100583420C Electronic assembly with high capacity thermal interface and methods of manufacture |
| 01/20/2010 | CN100583419C Systems for improved passive liquid cooling |
| 01/20/2010 | CN100583418C Adhesives and electric devices |
| 01/20/2010 | CN100583416C Semi-transflective type display element and method of producing the same |
| 01/20/2010 | CN100583404C Flip-chip package with air cavity |
| 01/20/2010 | CN100583365C Plasma display panel structure for decreasing capacitance between electrodes |
| 01/20/2010 | CN100582699C Semiconductor integrated circuit |
| 01/20/2010 | CN100582637C Micro heat pipe with wedge capillaries |
| 01/20/2010 | CN100582568C Power LED intense light device |
| 01/19/2010 | US7650130 Spread spectrum isolator |
| 01/19/2010 | US7649272 Arrangement of an electrical component placed on a substrate, and method for producing the same |
| 01/19/2010 | US7649270 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode |
| 01/19/2010 | US7649269 Pad over active circuit system and method with frame support structure |
| 01/19/2010 | US7649268 Semiconductor wafer |
| 01/19/2010 | US7649266 Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology |
| 01/19/2010 | US7649265 Micro-via structure design for high performance integrated circuits |
| 01/19/2010 | US7649264 Hard mask for low-k interlayer dielectric patterning |
| 01/19/2010 | US7649263 Semiconductor device |
| 01/19/2010 | US7649262 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing |
| 01/19/2010 | US7649261 Highly integrated and reliable DRAM and its manufacture |
| 01/19/2010 | US7649260 Semiconductor device |
| 01/19/2010 | US7649259 Semiconductor device including a plurality of wiring lines |
| 01/19/2010 | US7649258 Semiconductor device |
| 01/19/2010 | US7649257 Discrete placement of radiation sources on integrated circuit devices |
| 01/19/2010 | US7649255 Determining chip separation by comparing coupling capacitances |
| 01/19/2010 | US7649254 Conductive stiffener for a flexible substrate |
| 01/19/2010 | US7649253 Semiconductor device |
| 01/19/2010 | US7649252 Ceramic multilayer substrate |
| 01/19/2010 | US7649251 Thin-film device |
| 01/19/2010 | US7649250 Semiconductor package |
| 01/19/2010 | US7649249 Semiconductor device, stacked structure, and manufacturing method |
| 01/19/2010 | US7649248 Stack package implementing conductive support |
| 01/19/2010 | US7649247 Radiation hardened lateral MOSFET structure |
| 01/19/2010 | US7649246 Tab package connecting host device element |
| 01/19/2010 | US7649241 Semiconductor device and method of manufacturing the same |
| 01/19/2010 | US7649231 Asymmetrical reset transistor with double-diffused source for CMOS image sensor |
| 01/19/2010 | US7649229 ESD protection device |
| 01/19/2010 | US7649226 Source and drain structures and manufacturing methods |
| 01/19/2010 | US7649224 DMOS with high source-drain breakdown voltage, small on- resistance, and high current driving capacity |
| 01/19/2010 | US7649214 ESD protection system for multiple-domain integrated circuits |
| 01/19/2010 | US7649210 Thin film light emitting diode |
| 01/19/2010 | US7649200 System and method of detecting IC die cracks |
| 01/19/2010 | US7649145 Compliant spring contact structures |
| 01/19/2010 | US7648916 Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal |
| 01/19/2010 | US7648911 Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias |
| 01/19/2010 | US7648907 Semiconductor device, wiring substrate forming method, and substrate processing apparatus |
| 01/19/2010 | US7648902 Manufacturing method of redistribution circuit structure |
| 01/19/2010 | US7648859 Microcomponent comprising a hermetically-sealed microcavity and method for production of such a microcomponent |
| 01/19/2010 | US7648858 Methods and apparatus for EMI shielding in multi-chip modules |
| 01/19/2010 | US7648857 Process for precision placement of integrated circuit overcoat material |
| 01/19/2010 | US7648369 Interposer with electrical contact button and method |
| 01/19/2010 | US7648347 Device for the local cooling or heating of an object |
| 01/19/2010 | US7647691 Method of producing antenna elements for a wireless communication device |
| 01/14/2010 | WO2010005592A2 Microelectronic interconnect element with decreased conductor spacing |
| 01/14/2010 | WO2010005501A2 Monolithic structurally complex heat sink designs |
| 01/14/2010 | WO2010005061A1 Functional device and manufacturing method therefor |
| 01/14/2010 | WO2010004998A1 Film forming method and processing system |
| 01/14/2010 | WO2010004996A1 Heat-conductive noise suppression sheet |
| 01/14/2010 | WO2010004903A1 Leadframe and method for manufacturing the same |
| 01/14/2010 | WO2010004860A1 Packaging device and base member for package |
| 01/14/2010 | WO2010004766A1 Mems device |
| 01/14/2010 | WO2010004662A1 Heat dissipation sheet and process for producing heat dissipation sheet |
| 01/14/2010 | WO2010004609A1 Power semiconductor device |
| 01/14/2010 | WO2010004469A1 Remote cooling by combining heat pipe and resonator for synthetic jet cooling |
| 01/14/2010 | WO2009079772A8 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 01/14/2010 | US20100009639 Radio frequency unit analog level detector and feedback control system |
| 01/14/2010 | US20100009511 Programmable capacitor associated with an input/output pad |
| 01/14/2010 | US20100008056 Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 01/14/2010 | US20100007035 Semiconductor device and method of manufacturing the same |
| 01/14/2010 | US20100007034 Lens support and wirebond protector |
| 01/14/2010 | US20100007033 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates |
| 01/14/2010 | US20100007032 Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion |
| 01/14/2010 | US20100007031 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device |
| 01/14/2010 | US20100007030 Semiconductor device, method for manufacturing semiconductor device, method for manufacturing semiconductor package |
| 01/14/2010 | US20100007029 Semiconductor device and method of forming stepped-down rdl and recessed thv in peripheral region of the device |
| 01/14/2010 | US20100007028 Device including an imide layer with non-contact openings and method |
| 01/14/2010 | US20100007027 Integrated connection arrangements |