| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/21/2010 | US20100013078 Adhesive for connection of circuit member and semiconductor device using the same |
| 01/21/2010 | US20100013077 Semiconductor device |
| 01/21/2010 | US20100013076 Semiconductor device package and method of fabricating the same |
| 01/21/2010 | US20100013074 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
| 01/21/2010 | US20100013073 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers |
| 01/21/2010 | US20100013071 Organic light emitting device and manufacturing method thereof |
| 01/21/2010 | US20100013070 Power module package having excellent heat sink emission capability and method for manufacturing the same |
| 01/21/2010 | US20100013069 Semiconductor device, lead frame and method of manufacturing semiconductor device |
| 01/21/2010 | US20100013068 Chip package carrier and fabrication method thereof |
| 01/21/2010 | US20100013067 Stress Mitigation in Packaged Microchips |
| 01/21/2010 | US20100013066 Semiconductor package |
| 01/21/2010 | US20100013065 Stackable molded packages and methods of making the same |
| 01/21/2010 | US20100013064 Semiconductor device packages with electromagnetic interference shielding |
| 01/21/2010 | US20100013063 Thin-film device, method for manufacturing the same, and electronic apparatus |
| 01/21/2010 | US20100013062 Nonvolatile memory cell |
| 01/21/2010 | US20100013060 Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench |
| 01/21/2010 | US20100013059 Diffusion region routing for narrow scribe-line devices |
| 01/21/2010 | US20100013058 Semiconductor Wafer and Semiconductor Wafer Inspection Method |
| 01/21/2010 | US20100013049 Semiconductor memory device and method for manufacturing same |
| 01/21/2010 | US20100013048 Interconnect line selectively isolated from an underlying contact plug |
| 01/21/2010 | US20100013046 Semiconductor device and a method of manufacturing the same |
| 01/21/2010 | US20100013045 Method of Integrating an Element |
| 01/21/2010 | US20100013033 Enablement of IC devices during assembly |
| 01/21/2010 | US20100012980 Contact Structures in Substrate Having Bonded Interface, Semiconductor Device Including the Same, Methods of Fabricating the Same |
| 01/21/2010 | US20100012935 Cu alloy wiring film, tft element for flat-panel display using the cu alloy wiring film, and cu alloy sputtering target for depositing the cu alloy wiring film |
| 01/21/2010 | US20100012934 Semiconductor chip and semiconductor chip stacked package |
| 01/21/2010 | US20100012933 Test device and a semiconductor integrated circuit device |
| 01/21/2010 | DE10340069B4 Oberflächenbefestigbare Elektronikvorrichtung Surface mount electronic device |
| 01/21/2010 | DE102009033423A1 Halbleiterchip und Halbleiterchip-Stapelgehäuse Semiconductor chip and the semiconductor chip stack housing |
| 01/21/2010 | DE102009032998A1 Bauelement mit Kontaktelementen Component with contact elements |
| 01/21/2010 | DE102009032973A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 01/21/2010 | DE102009030965A1 Semiconductor structure, has gate electrode insulated with body regions, and power transistor connected with snubber capacitor and snubber resistance, where power transistor is extended within silicon region |
| 01/21/2010 | DE102009025570A1 Elektronische Anordnung und ihre Herstellung Electronic device and its manufacturing |
| 01/21/2010 | DE102009025412A1 Integrierte Schaltung und Verfahren zum Schützen eines Schaltungsteils einer integrierten Schaltung, der geschützt werden soll Integrated circuit and method of protecting a circuit portion of an integrated circuit to be protected |
| 01/21/2010 | DE102009011233A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 01/21/2010 | DE102008040488A1 Elektronische Baueinheit und Verfahren zu deren Herstellung The electronic package and process for their preparation |
| 01/21/2010 | DE102008040466A1 Leistungselektronikeinrichtung Power electronics device |
| 01/21/2010 | DE102008033410A1 Leistungselektronische Verbindungseinrichtung und Herstellungsverfahren hierzu Power electronic coupling device and manufacturing method therefor |
| 01/21/2010 | DE102008031836A1 Lotkontakt Solder contact |
| 01/21/2010 | DE102008021167B3 Verfahren zur Erzeugung einer hermetisch dichten, elektrischen Durchführung mittels exothermer Nanofolie und damit hergestellte Vorrichtung A method for producing a hermetically sealed electrical feedthrough by means of exothermic nanofoil and thus produced device |
| 01/21/2010 | DE102008002954A1 Löt-Stützstelle für Solarmodule und Dünnschichtsolarmodule Solder support point for solar modules and thin-film solar modules |
| 01/21/2010 | DE102006034599B4 Verfahren zum Verschalten aus einem Wafer gefertigter Halbleiterchips Method for interconnecting manufactured from a wafer semiconductor chips |
| 01/21/2010 | DE102005053877B4 Drucksensor-Bauelement Pressure sensor component |
| 01/21/2010 | CA2730378A1 Method for packaging semiconductors at a wafer level |
| 01/20/2010 | EP2146378A2 Semiconductor device |
| 01/20/2010 | EP2146375A1 Semi-conductor module |
| 01/20/2010 | EP2146374A1 Printed circuit board assembly |
| 01/20/2010 | EP2146373A2 Assembly with a semiconductor module and production method for same |
| 01/20/2010 | EP2146372A2 Power electronic connection device and production method for same |
| 01/20/2010 | EP2145351A1 Integration substrate with a ultra-high-density capacitor and a through-substrate via |
| 01/20/2010 | EP1606983B1 Structural unit and method for the production of a structural unit |
| 01/20/2010 | CN201388358Y Fixing device of heat radiator |
| 01/20/2010 | CN201388356Y Electric-vehicle controller |
| 01/20/2010 | CN201387884Y Double crystal plate covered crystalloid |
| 01/20/2010 | CN201387883Y 芯片电路结构 Chip circuit structure |
| 01/20/2010 | CN201387882Y Epitaxial wafer |
| 01/20/2010 | CN201387881Y Power device radiating structure |
| 01/20/2010 | CN201387471Y Device for lighting checking |
| 01/20/2010 | CN201386991Y High-power LED lamp unit radiating module |
| 01/20/2010 | CN201386990Y High-power LED phase-change cooling device |
| 01/20/2010 | CN201386989Y LED lighting lamp with secondary heat dissipation |
| 01/20/2010 | CN201386950Y LED street lamp bulb holder structure having heat conduction and radiation |
| 01/20/2010 | CN201386926Y LED lamp |
| 01/20/2010 | CN101632175A Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor com |
| 01/20/2010 | CN101632174A Encapsulated metal resistor |
| 01/20/2010 | CN101632173A Electronic passive device |
| 01/20/2010 | CN101632172A Structure for cooling semiconductor element |
| 01/20/2010 | CN101632171A Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module |
| 01/20/2010 | CN101632170A Interposer and manufacturing method of the interposer |
| 01/20/2010 | CN101632169A Interposer and manufacturing method of the interposer |
| 01/20/2010 | CN101632168A Interposer and interposer manufacturing method |
| 01/20/2010 | CN101630674A Circuit protection device including resistor and fuse element |
| 01/20/2010 | CN101630673A Esd protection structures on soi substrates |
| 01/20/2010 | CN101630672A Semiconductor chip and semiconductor chip stacked package |
| 01/20/2010 | CN101630671A Integrated lead suspension |
| 01/20/2010 | CN101630670A Ag-based alloy lead wire for semiconductor encapsulation |
| 01/20/2010 | CN101630669A Semiconductor encapsulation of Ag or Ag alloy lead wire |
| 01/20/2010 | CN101630668A Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element |
| 01/20/2010 | CN101630667A Method and system for forming conductive bump with copper interconnections |
| 01/20/2010 | CN101630666A Island rewiring chip encapsulation structure |
| 01/20/2010 | CN101630665A Wiring substrate and method of manufacturing the same |
| 01/20/2010 | CN101630664A Silver based bonding wire and preparation method thereof |
| 01/20/2010 | CN101630663A Device with power semiconductor module and manufacture method thereof |
| 01/20/2010 | CN100584179C Thermal cooling of industrial electronic module by conductive structure |
| 01/20/2010 | CN100584178C Heat radiation device |
| 01/20/2010 | CN100584177C Fan rack and heat radiating device using the same |
| 01/20/2010 | CN100584176C Heat radiation device and lighting device |
| 01/20/2010 | CN100584175C Heat radiator |
| 01/20/2010 | CN100584174C Heat radiating device |
| 01/20/2010 | CN100584173C Heat radiating device |
| 01/20/2010 | CN100584172C Heat radiating device |
| 01/20/2010 | CN100584171C Heat radiator |
| 01/20/2010 | CN100584170C Radiating device |
| 01/20/2010 | CN100584169C Liquid-cooled heat radiator |
| 01/20/2010 | CN100584167C Radiating module and heat tube thereof |
| 01/20/2010 | CN100584162C Buckling device of radiator |
| 01/20/2010 | CN100584161C Heat radiator clamping device |
| 01/20/2010 | CN100584153C Electronic device and method of manufacturing the same |
| 01/20/2010 | CN100584152C Manufacturing method of electronic device |
| 01/20/2010 | CN100583611C Method of switching a power supply of voltage domains of a semiconductor circuit, and corresponding semiconductor circuit |