| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/26/2010 | US7652365 Microelectronic component assemblies and microelectronic component lead frame structures |
| 01/26/2010 | US7652364 Crossing conductive traces in a PCB |
| 01/26/2010 | US7652363 Semiconductor device including an arrangement for detection of tampering |
| 01/26/2010 | US7652362 Semiconductor package stack with through-via connection |
| 01/26/2010 | US7652361 Land patterns for a semiconductor stacking structure and method therefor |
| 01/26/2010 | US7652360 Electronic device and method of manufacturing the same |
| 01/26/2010 | US7652359 Article having display device |
| 01/26/2010 | US7652358 Semiconductor device including main substrate and sub substrates |
| 01/26/2010 | US7652357 Quad flat no-lead (QFN) packages |
| 01/26/2010 | US7652356 Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device |
| 01/26/2010 | US7652355 Integrated circuit shield structure |
| 01/26/2010 | US7652351 Semiconductor device and method of manufacturing the same |
| 01/26/2010 | US7652347 Semiconductor package having embedded passive elements and method for manufacturing the same |
| 01/26/2010 | US7652342 Nanotube-based transfer devices and related circuits |
| 01/26/2010 | US7652339 Ambipolar transistor design |
| 01/26/2010 | US7652326 Power semiconductor devices and methods of manufacture |
| 01/26/2010 | US7652298 Flip chip type LED lighting device manufacturing method |
| 01/26/2010 | US7652284 Process monitor mark and the method for using the same |
| 01/26/2010 | US7652214 Electronic component package |
| 01/26/2010 | US7652213 Internal conductor connection structure and multilayer substrate |
| 01/26/2010 | US7651958 sealed in cured silicone body by placing semiconductor into mold and subjecting compression molding; polymerization catalysts |
| 01/26/2010 | US7651938 Void reduction in indium thermal interface material |
| 01/26/2010 | US7651902 Hybrid substrates and methods for forming such hybrid substrates |
| 01/26/2010 | US7651890 Method and apparatus for prevention of solder corrosion |
| 01/26/2010 | US7651888 Wafer lever fixture and method for packaging micro-electro-mechanical-system devices |
| 01/26/2010 | US7651878 Wafer-level chip-scale package of image sensor and method of manufacturing the same |
| 01/26/2010 | US7651724 Sealing substrate, wafter; cost efficiency |
| 01/26/2010 | US7651022 Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
| 01/26/2010 | US7650982 Production system |
| 01/26/2010 | US7650931 Vapor augmented heatsink with multi-wick structure |
| 01/26/2010 | US7650683 Method of preparing an antenna |
| 01/26/2010 | CA2464078C Semiconductor device and method of manufacturing the same |
| 01/26/2010 | CA2426548C Interference mitigation through conductive thermoplastic composite materials |
| 01/25/2010 | CA2673705A1 Interface-infused nanotube interconnect |
| 01/21/2010 | WO2010008974A1 Grounding system and apparatus |
| 01/21/2010 | WO2010008781A1 Method for packaging semiconductors at a wafer level |
| 01/21/2010 | WO2010008752A2 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
| 01/21/2010 | WO2010008689A2 Embedded die package and process flow using a pre-molded carrier |
| 01/21/2010 | WO2010008673A2 Methods and systems for packaging integrated circuits with thin metal contacts |
| 01/21/2010 | WO2010008627A1 Electrode arrays and methods of making and using same |
| 01/21/2010 | WO2010008270A1 Static shielding multilayer film and method thereof |
| 01/21/2010 | WO2010008066A1 Compound having a plurality of tetraphenylmethane backbones, film-forming composition, insulating film and electronic device |
| 01/21/2010 | WO2010008033A1 Wiring board, chip component mounting structure and chip component mounting method |
| 01/21/2010 | WO2010007991A1 Cu wiring film forming method |
| 01/21/2010 | WO2010007974A1 Process for production of aluminum-diamond composite |
| 01/21/2010 | WO2010007951A1 Semiconductor wiring |
| 01/21/2010 | WO2010007922A1 Aluminum-diamond composite and method for producing the same |
| 01/21/2010 | WO2010007916A1 Semiconductor device and display device |
| 01/21/2010 | WO2010007859A1 Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device |
| 01/21/2010 | WO2010007821A1 Electronic apparatus, image display, and method of cooling electronic apparatus |
| 01/21/2010 | WO2010007820A1 Inter-substrate spacer and method for producing the same and semiconductor device equipped with inter-substrate spacer |
| 01/21/2010 | WO2010007804A1 Heat conductive oil composition, heat dissipating agent, and electronic device |
| 01/21/2010 | WO2010007714A1 Solid-state imaging device and manufacturing method thereof |
| 01/21/2010 | WO2010006924A1 Motor control device of a vehicle |
| 01/21/2010 | WO2010006916A1 Method for producing a semiconductor component, and semiconductor component |
| 01/21/2010 | WO2010006912A1 Power electronics device |
| 01/21/2010 | WO2010006875A1 Improved heat sink, frequency converter comprising said heat sink and method for producing said heat sink |
| 01/21/2010 | WO2010006864A1 Electronic assembly and method for the production thereof |
| 01/21/2010 | WO2010006475A1 A ceramic packaging substrate for the high power led |
| 01/21/2010 | WO2009146007A3 Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same |
| 01/21/2010 | WO2008091919A3 Thermally enhanced single in-line package (sip) |
| 01/21/2010 | US20100017005 Metrology through use of feed forward feed sideways and measurement cell re-use |
| 01/21/2010 | US20100015796 Semiconductor device, manufacturing method and apparatus for the same |
| 01/21/2010 | US20100015760 Semiconductor device and manufacturing method thereof |
| 01/21/2010 | US20100014261 Printed circuit board and method of manufacturing printed circuit board |
| 01/21/2010 | US20100014254 Printed circuit board unit and semiconductor package |
| 01/21/2010 | US20100013514 Test device and semiconductor integrated circuit device |
| 01/21/2010 | US20100013513 Test device and semiconductor integrated circuit device |
| 01/21/2010 | US20100013388 Electroluminescent Plate, Product Containing the Same, and Preparing Method Thereof |
| 01/21/2010 | US20100013109 Fine pitch bond pad structure |
| 01/21/2010 | US20100013108 Stacked packages and microelectronic assemblies incorporating the same |
| 01/21/2010 | US20100013107 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same |
| 01/21/2010 | US20100013106 Stacked semiconductor chips |
| 01/21/2010 | US20100013105 Method of manufacturing photomask and method of repairing optical proximity correction |
| 01/21/2010 | US20100013104 Integrated circuit hard mask processing system |
| 01/21/2010 | US20100013103 Semiconductor embedded module and method for producing the same |
| 01/21/2010 | US20100013102 Semiconductor Device and Method of Providing a Thermal Dissipation Path Through RDL and Conductive Via |
| 01/21/2010 | US20100013101 Method for Manufacturing a Multichip Module Assembly |
| 01/21/2010 | US20100013100 Method and System for Forming Conductive Bumping with Copper Interconnection |
| 01/21/2010 | US20100013099 Mechanically stable diffusion barrier stack and method for fabricating the same |
| 01/21/2010 | US20100013098 Method of forming an interconnect structure on an integrated circuit die |
| 01/21/2010 | US20100013097 Semiconductor device having contact plug formed in double structure by using epitaxial stack and metal layer and method for fabricating the same |
| 01/21/2010 | US20100013096 Cu-Mn Alloy Sputtering Target and Semiconductor Wiring |
| 01/21/2010 | US20100013095 Semiconductor device, production method for the same, and substrate |
| 01/21/2010 | US20100013094 Semiconductor package and methods of manufacturing the same |
| 01/21/2010 | US20100013093 Chip Mounting |
| 01/21/2010 | US20100013092 Semiconductor device and manufacturing method therefor |
| 01/21/2010 | US20100013091 Semiconductor device including a copolymer layer |
| 01/21/2010 | US20100013090 Silicide formation on a wafer |
| 01/21/2010 | US20100013089 Semiconductor component and manufacturing method of semiconductor component |
| 01/21/2010 | US20100013088 Method for packaging semiconductors at a wafer level |
| 01/21/2010 | US20100013087 Embedded die package and process flow using a pre-molded carrier |
| 01/21/2010 | US20100013086 Power semiconductor device |
| 01/21/2010 | US20100013085 Power semiconductor device |
| 01/21/2010 | US20100013084 Surface mount package with high thermal conductivity |
| 01/21/2010 | US20100013083 Semiconductor package and method of manufacturing the same |
| 01/21/2010 | US20100013082 Chip package and method for fabricating the same |
| 01/21/2010 | US20100013081 Packaging structural member |
| 01/21/2010 | US20100013080 Semiconductor device package with insulator ring |
| 01/21/2010 | US20100013079 Package substrate, semiconductor package having a package substrate |