| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/27/2010 | CN201393355Y Controller of high power electric vehicle |
| 01/27/2010 | CN201393354Y Radiating fin |
| 01/27/2010 | CN201393318Y LED automatic control system with radiating function |
| 01/27/2010 | CN201392849Y Package structure for high-sensitivity electronic element |
| 01/27/2010 | CN201392847Y Improved patch type LED bracket |
| 01/27/2010 | CN201392839Y Damping diode |
| 01/27/2010 | CN201392838Y Voltage stabilizing diode |
| 01/27/2010 | CN201392836Y Flatly packaged half-control bridge arm device |
| 01/27/2010 | CN201392835Y Memory adopting stacking type wafer structure |
| 01/27/2010 | CN201392834Y Multilayer microwave integrated circuit |
| 01/27/2010 | CN201392833Y Heat tube radiation system of high-power rectifying device of four-inch thyristor |
| 01/27/2010 | CN201392832Y Improved SOT encapsulation structure |
| 01/27/2010 | CN201392831Y Copper strip for manufacturing lead wire frames |
| 01/27/2010 | CN201392830Y TT frame structure of integrated packaging |
| 01/27/2010 | CN201392829Y Electronic element with straightly and horizontally installed pins |
| 01/27/2010 | CN201392828Y Packaging structure for control chip |
| 01/27/2010 | CN201392827Y Solid discharge tube |
| 01/27/2010 | CN201392826Y Heat conducting device of heating component |
| 01/27/2010 | CN201392825Y Electronic element package body structure capable of avoiding lateral shearing force |
| 01/27/2010 | CN201392824Y Micro-packaged high power semiconductor device |
| 01/27/2010 | CN201392823Y Multi-chip double-base island SOT encapsulation structure |
| 01/27/2010 | CN201392822Y Double-chip composite-type metal shell of electronic component chip |
| 01/27/2010 | CN201392350Y Probe card for anti-interference asynchronous trimming wafer test |
| 01/27/2010 | CN201391850Y High-power LED bulb radiator |
| 01/27/2010 | CN201391849Y Quick heat radiation mechanism for LED lamp |
| 01/27/2010 | CN201391847Y Thermal module of luminophor |
| 01/27/2010 | CN201391788Y Low-power LED indoor illuminating lamp |
| 01/27/2010 | CN201391775Y LED lamp |
| 01/27/2010 | CN201391774Y Illumination lamp formed by polyhedral high-power LED |
| 01/27/2010 | CN101636838A A quad flat no lead (QFN) integrated circuit (IC) package having a modified paddle and method for designing the package |
| 01/27/2010 | CN101636837A Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device |
| 01/27/2010 | CN101636450A Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting |
| 01/27/2010 | CN101635292A Contact pad for measuring electrical thickness of gate dielectric layer and measurement structure thereof |
| 01/27/2010 | CN101635291A Mini-size package lead frame structure and processing method thereof |
| 01/27/2010 | CN101635290A Metal bump structure and application thereof to packaging structure |
| 01/27/2010 | CN101635289A Fine pitch bond pad structure |
| 01/27/2010 | CN101635288A System with power semiconductor module and connection device |
| 01/27/2010 | CN101635287A Power semiconductor module |
| 01/27/2010 | CN101635286A Semiconductor package body and method thereof |
| 01/27/2010 | CN101635285A Ceramic substrate structure with radiating function and manufacturing method thereof |
| 01/27/2010 | CN101635284A Wafer packaging structure |
| 01/27/2010 | CN101635283A CPU fan-less heat tube heat conduction device used in 2U top frame special computer |
| 01/27/2010 | CN101635282A SMD metal cover plate |
| 01/27/2010 | CN101635281A Semiconductor device packages with electromagnetic interference shielding |
| 01/27/2010 | CN101635280A Window-type ball grid array packaging structure and manufacturing method thereof |
| 01/27/2010 | CN100586262C Ic socket |
| 01/27/2010 | CN100586256C Ceramic substrate, electronic apparatus, and method for producing ceramic substrate |
| 01/27/2010 | CN100586249C Pressing base board bar |
| 01/27/2010 | CN100585880C Function element mounting module and manufacturing method thereof |
| 01/27/2010 | CN100585877C Semiconductor device |
| 01/27/2010 | CN100585870C 有机电致发光显示器件 Organic electroluminescent display device |
| 01/27/2010 | CN100585866C LED semiconductor anti-static method and flip-chip semiconductor assembly with anti-static ability |
| 01/27/2010 | CN100585864C Array substrate, LCD panel, optoelectronic device and its driving/production method |
| 01/27/2010 | CN100585863C Active component array base board and its repair method |
| 01/27/2010 | CN100585860C Semiconductor device and fabrication method thereof |
| 01/27/2010 | CN100585856C Semiconductor capacitor and manufacturing method |
| 01/27/2010 | CN100585854C Display panel and test system |
| 01/27/2010 | CN100585850C Image sensing module having crystal three-dimensional stacking construction |
| 01/27/2010 | CN100585849C Integrated passive devices |
| 01/27/2010 | CN100585848C Module and electronic device |
| 01/27/2010 | CN100585847C Fuse system and reprogrammable method of electrical fuse |
| 01/27/2010 | CN100585846C Spanning connection chip system and its forming method |
| 01/27/2010 | CN100585845C Semiconductor device manufacture method |
| 01/27/2010 | CN100585844C Circuit board clinker construction with embedded semiconductor element |
| 01/27/2010 | CN100585843C Si-based packaging with integrated passive components |
| 01/27/2010 | CN100585842C Chip and its manufacture method |
| 01/27/2010 | CN100585841C Electronic equipment |
| 01/27/2010 | CN100585840C Multi-stage type ion fluidic device and method |
| 01/27/2010 | CN100585839C Chip encapsulation structure and technology |
| 01/27/2010 | CN100585838C Polycrystalline silicon layer, method for fabricating the same and flat panel display |
| 01/27/2010 | CN100585827C Testing circuit and testing method for semiconductor device and semiconductor chip |
| 01/27/2010 | CN100585820C Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure |
| 01/27/2010 | CN100585819C Wiring member, metal part and semiconductor device, and manufacturing method |
| 01/27/2010 | CN100585802C Method of forming pre-metal dielectric layer of semiconductor device and semiconductor substrate |
| 01/27/2010 | CN100585761C Surface mounting type part |
| 01/27/2010 | CN100584921C Organic species that facilitate charge transfer to or from nanostructures |
| 01/27/2010 | CN100584635C Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark |
| 01/26/2010 | US7653098 Semiconductor light emitting device and method for manufacturing the same |
| 01/26/2010 | US7652895 Electrically insulating body, and electronic device |
| 01/26/2010 | US7652886 Heat sink assembly having a fastener assembly for fastening the heat sink to an electronic component |
| 01/26/2010 | US7652882 Method and apparatus for dissipating heat from an electronic device |
| 01/26/2010 | US7652740 Array substrate for LCD device having dual metal-layer gate and data lines and manufacturing method thereof |
| 01/26/2010 | US7652493 Test arrangement having chips of a first substrate on a second substrate and chips of the second substrate on a third substrate |
| 01/26/2010 | US7652385 Semiconductor device and method of manufacturing the same |
| 01/26/2010 | US7652384 Fabricating tall micro structures |
| 01/26/2010 | US7652383 Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module |
| 01/26/2010 | US7652382 Micro chip-scale-package system |
| 01/26/2010 | US7652381 Interconnect system without through-holes |
| 01/26/2010 | US7652380 Semiconductor device and method of producing the same |
| 01/26/2010 | US7652379 Bond pad stacks for ESD under pad and active under pad bonding |
| 01/26/2010 | US7652378 Aluminum-based interconnection in bond pad layer |
| 01/26/2010 | US7652377 Semiconductor device and manufacturing method of the same |
| 01/26/2010 | US7652375 Semiconductor device and method of manufacturing the same |
| 01/26/2010 | US7652374 Substrate and process for semiconductor flip chip package |
| 01/26/2010 | US7652373 Power delivery using an integrated heat spreader |
| 01/26/2010 | US7652372 Microfluidic cooling of integrated circuits |
| 01/26/2010 | US7652370 Plastic microfabricated structure for biochip, microfabricated thermal device, microfabricated reactor, microfabricated reactor array, and micro array using the same |
| 01/26/2010 | US7652369 Integrated circuit package and apparatus and method of producing an integrated circuit package |
| 01/26/2010 | US7652367 Semiconductor package on package having plug-socket type wire connection between packages |
| 01/26/2010 | US7652366 Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package |