| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/28/2010 | WO2010011503A2 Memory system and method using stacked memory device dice, and system using the memory system |
| 01/28/2010 | WO2010011177A1 A substrate arrangement and a method of manufacturing a substrate arrangement |
| 01/28/2010 | WO2010011017A1 Method of determining a pattern position and a cavity position, and method of forming a solder bump using the same |
| 01/28/2010 | WO2010011009A1 Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module |
| 01/28/2010 | WO2010010981A1 Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the same |
| 01/28/2010 | WO2010010911A1 Semiconductor device and method for manufacturing same |
| 01/28/2010 | WO2010010910A1 Coreless wiring substrate, semiconductor device, and methods for manufacturing same |
| 01/28/2010 | WO2010010847A1 Active matrix substrate, display panel, display device, and active matrix substrate manufacturing method |
| 01/28/2010 | WO2010010841A1 Resin composition |
| 01/28/2010 | WO2010010833A1 Au-Ga-In BRAZING FILLER METAL |
| 01/28/2010 | WO2010010826A1 Heat exchanger and method of manufacturing same |
| 01/28/2010 | WO2010010813A1 Wire forming method |
| 01/28/2010 | WO2010010769A1 Semiconductor device |
| 01/28/2010 | WO2010010721A1 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
| 01/28/2010 | WO2010010563A2 Lithium or barium based film getters |
| 01/28/2010 | WO2010010495A1 A cooling device for cooling a semiconductor die |
| 01/28/2010 | US20100022012 Nanosensors |
| 01/28/2010 | US20100019399 Polyorganosiloxane composition |
| 01/28/2010 | US20100019398 Structured semiconductor element for reducing charging effects |
| 01/28/2010 | US20100019397 Electrical connections for multichip modules |
| 01/28/2010 | US20100019396 Semiconductor device and method of fabricating semiconductor device |
| 01/28/2010 | US20100019395 Method and apparatus for improvements in chip manufacture and design |
| 01/28/2010 | US20100019394 Ic chip mounting package |
| 01/28/2010 | US20100019393 Packaging structure for integration of microelectronics and mems devices by 3d stacking and method for manufacturing the same |
| 01/28/2010 | US20100019392 Stacked die package having reduced height and method of making same |
| 01/28/2010 | US20100019390 Semiconductor device, semiconductor chip, manufacturing methods thereof, and stack package |
| 01/28/2010 | US20100019389 Electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components |
| 01/28/2010 | US20100019388 Method for an integrated circuit contact |
| 01/28/2010 | US20100019387 Semiconductor device and fabrication method of the same |
| 01/28/2010 | US20100019386 Electrical conductor line having a multilayer diffusion barrier for use in a semiconductor device and method for forming the same |
| 01/28/2010 | US20100019385 Implementing Reduced Hot-Spot Thermal Effects for SOI Circuits |
| 01/28/2010 | US20100019384 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
| 01/28/2010 | US20100019383 Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method |
| 01/28/2010 | US20100019382 Semiconductor device and method for manufacturing the same |
| 01/28/2010 | US20100019381 Semiconductor device and method of manufacturing a semiconductor device |
| 01/28/2010 | US20100019380 Integrated circuit with micro-pores ceramic heat sink |
| 01/28/2010 | US20100019379 External heat sink for bare-die flip chip packages |
| 01/28/2010 | US20100019378 Semiconductor module and a method for producing an electronic circuit |
| 01/28/2010 | US20100019377 Segmentation of a die stack for 3d packaging thermal management |
| 01/28/2010 | US20100019376 High frequency ceramic package and fabrication method for the same |
| 01/28/2010 | US20100019375 Housing for a semiconductor component |
| 01/28/2010 | US20100019374 Ball grid array package |
| 01/28/2010 | US20100019373 Universal substrate for semiconductor packages and the packages |
| 01/28/2010 | US20100019372 Semiconductor device package and method of fabricating the same |
| 01/28/2010 | US20100019371 Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof |
| 01/28/2010 | US20100019370 Semiconductor device and manufacturing method |
| 01/28/2010 | US20100019369 Integrated circuit package system with leadframe substrate |
| 01/28/2010 | US20100019368 Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages |
| 01/28/2010 | US20100019367 Method of forming a molded array package device having an exposed tab and structure |
| 01/28/2010 | US20100019366 Package for an Integrated Circuit |
| 01/28/2010 | US20100019365 Dicing/die bonding film |
| 01/28/2010 | US20100019364 Saw debris reduction in mems devices |
| 01/28/2010 | US20100019363 Semiconductor system-in-package and method for making the same |
| 01/28/2010 | US20100019362 Isolated stacked die semiconductor packages |
| 01/28/2010 | US20100019361 Multi Lead Frame Power Package |
| 01/28/2010 | US20100019360 Integrated circuit package with etched leadframe for package-on-package interconnects |
| 01/28/2010 | US20100019359 Semiconductor Device and Method of Forming Shielding Along a Profile Disposed in Peripheral Region Around the Device |
| 01/28/2010 | US20100019356 Semiconductor device and manufacturing method therefor |
| 01/28/2010 | US20100019354 Semiconductor chip shape alteration |
| 01/28/2010 | US20100019353 Semiconductor device and method for manufacturing the same |
| 01/28/2010 | US20100019345 Integrated Circuit with an Active Area Line Having at Least One Form-Supporting Element and Corresponding Method of Making an Integrated Circuit |
| 01/28/2010 | US20100019341 Buried asymmetric junction esd protection device |
| 01/28/2010 | US20100019303 Method for forming conductive pattern, semiconductor device using the same and method for fabricating semiconductor device using the same |
| 01/28/2010 | US20100019241 Semiconductor device, fabrication method thereof, and photomask |
| 01/28/2010 | US20100018670 Heat Sink Assembly |
| 01/28/2010 | US20100018049 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 01/28/2010 | US20100018041 Holding jig for electronic parts |
| 01/28/2010 | DE19861434B4 Gegenstand aus einem Keramikmaterial mit geringer thermischer Ausdehnung und seine Verwendung Article of a ceramic material with low thermal expansion and its use |
| 01/28/2010 | DE112008000483T5 Luftdichte Abdichtkappe, elektronische-komponenten-Lagerungspackung und Verfahren zum Herstellen einer elektronische-komponenten-Lagerungspackung Airtight sealing cap, electronic-component storage and packing method for producing a electronic-components-storage pack |
| 01/28/2010 | DE112008000452T5 Halbleitermodul und Wechselrichtervorrichtung Semiconductor module and inverter device |
| 01/28/2010 | DE10358556B4 Ausbildung selbstjustierender Kontakte unter Verwendung von Doppelten-SiN-Abstandschichten Training self-aligning contacts using double-SiN spacer layers |
| 01/28/2010 | DE102009033442A1 Halbleiterbauelement mit einer Copolymerschicht A semiconductor device comprising a copolymer |
| 01/28/2010 | DE102009025070A1 Verfahren zum Kapseln eines Chips A method for encapsulating a chip |
| 01/28/2010 | DE102009018396A1 Halbleiterbauelement und Herstellung des Halbleiterbauelements A semiconductor device and manufacturing of the semiconductor component |
| 01/28/2010 | DE102008048420A1 Chip-Anordnung und Verfahren zum Herstellen einer Chip-Anordnung Chip arrangement and method of manufacturing a chip arrangement |
| 01/28/2010 | DE102008040727A1 Verfahren und Vorrichtung zur Ermittlung der Rotortemperatur einer permanenterregten Synchronmaschine Method and apparatus for determining the rotor temperature of a permanent magnet synchronous machine |
| 01/28/2010 | DE102008040676A1 Abdichtrahmen sowie Verfahren zum Abdecken eines Bauteils Sealing frame and method for covering a component |
| 01/28/2010 | DE102008040672A1 Sensor module for automobile manufacture, has housing including housing part with contact elements having contact surfaces for electrical contacting of component, where contact surfaces are aligned parallel to main extension plane |
| 01/28/2010 | DE102008040565A1 Gehäuse für ein Halbleiterbauelement Housing for a semiconductor component |
| 01/28/2010 | DE102008040480A1 Halbleitermodul Semiconductor module |
| 01/28/2010 | DE102008030842A1 Integrated module for use in micro-electro-mechanical system, comprises plastic body made of thermoplastic with even lower surface, and recess is provided in lower surface of plastic body |
| 01/28/2010 | DE102007049160B4 Verfahren zum Vereinzeln von zu einer Gruppe zusammengefassten, einen Kunststoffvergusskörper aufweisenden Chipgehäusen A method for separating a group summarized, a Kunststoffvergusskörper having chip packages |
| 01/28/2010 | DE102007043710B4 Tiefe Durchkontaktierungskonstruktion für eine Halbleitereinrichtung und ein Verfahren zu Ihrer Herstellung Depth Durchkontaktierungskonstruktion for a semiconductor device and a method for their preparation |
| 01/28/2010 | DE102005034182B4 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 01/28/2010 | DE10019839B4 Mehrschichtkondensator, Vewendung des Mehrschichtkondensators, Schaltungsanordnung und Verdrahtunssubstrat damit A multilayer capacitor, Vewendung of the multilayer capacitor, the circuit arrangement and so Verdrahtunssubstrat |
| 01/27/2010 | EP2148557A2 Assembly with a semiconductor module and with a connection device |
| 01/27/2010 | EP2148556A2 Noble metal connection and application method thereof |
| 01/27/2010 | EP2148438A1 Stacked bandpass filter |
| 01/27/2010 | EP2148368A1 High performance semiconductor module |
| 01/27/2010 | EP2148367A1 Semiconductor power module |
| 01/27/2010 | EP2148366A1 Device having plurality of integrated circuits in a matrix |
| 01/27/2010 | EP2148364A2 Contacting method for substrate-based switches and accompanying switch assembly |
| 01/27/2010 | EP2148363A2 Nobel metal based connection means with a solid fraction and a fluid fraction and application method for same |
| 01/27/2010 | EP2147942A1 Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition |
| 01/27/2010 | EP2147739A2 Nobel metal based connection means in the form of a foil with a solid faction and a liquid fraction and application and production method for same |
| 01/27/2010 | EP2147464A1 Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density |
| 01/27/2010 | EP2147463A2 Connecting microsized devices using ablative films |
| 01/27/2010 | EP1573799B1 Three-dimensional device fabrication method |
| 01/27/2010 | CN201393359Y Heat radiation device and base thereof |
| 01/27/2010 | CN201393357Y Large granular single crystal diamond radiator |