| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/09/2010 | US7658999 Heat spreader for emissive display device |
| 02/09/2010 | US7658865 Crosslinked matrix containing carbon nanotubes aligned (perpendicular) between opposing surfaces; thermal interface materials for thermal management and cooling of semiconductors |
| 02/04/2010 | WO2010014985A1 High q transformer disposed at least partly in a non-semiconductor substrate |
| 02/04/2010 | WO2010014408A2 Method and apparatus for forming i/o clusters in integrated circuits |
| 02/04/2010 | WO2010014103A1 Semiconductor package with integrated interference shielding and method of manufacture therof |
| 02/04/2010 | WO2010013841A1 Optical connector and manufacturing method thereof |
| 02/04/2010 | WO2010013638A1 Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device |
| 02/04/2010 | WO2010013497A1 Sputtering target for forming wiring film of flat panel display |
| 02/04/2010 | WO2010013470A1 Semiconductor module and portable apparatus provided with semiconductor module |
| 02/04/2010 | WO2010013407A1 Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 02/04/2010 | WO2010013406A1 Resin composition for semiconductor encapsulation and semiconductor device using the same |
| 02/04/2010 | WO2010013383A1 Heat spreader and method for manufacturing the heat spreader |
| 02/04/2010 | WO2010013286A1 Semiconductor device and manufacturing method |
| 02/04/2010 | WO2010013194A2 Orientation of an electronic cmos structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers |
| 02/04/2010 | WO2010012798A1 Heat exchange structure and cooling device including such a structure |
| 02/04/2010 | WO2010012271A2 Apparatus, in particular for conducting current, and a method for producing an apparatus, in particular for conducting current |
| 02/04/2010 | WO2010012084A1 Thermal control system for a light-emitting diode fixture |
| 02/04/2010 | US20100029044 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device |
| 02/04/2010 | US20100027947 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| 02/04/2010 | US20100027946 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| 02/04/2010 | US20100027577 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| 02/04/2010 | US20100027223 Semiconductor integrated circuit having heat release pattern |
| 02/04/2010 | US20100027174 Circuit for protecting an integrated circuit against electrostatic discharges in cmos technology |
| 02/04/2010 | US20100025864 Shielded wirebond |
| 02/04/2010 | US20100025863 Integrated Circuit Interconnect Method and Apparatus |
| 02/04/2010 | US20100025862 Integrated Circuit Interconnect Method and Apparatus |
| 02/04/2010 | US20100025860 Semiconductor device and manufacturing method of semiconductor device |
| 02/04/2010 | US20100025859 Method for designing semiconductor device, program therefor, and semiconductor device |
| 02/04/2010 | US20100025858 Winged vias to increase overlay margin |
| 02/04/2010 | US20100025857 Ic chip and design structure with through wafer vias dishing correction |
| 02/04/2010 | US20100025856 Fabrication method of a semiconductor device and a semiconductor device |
| 02/04/2010 | US20100025855 Enhancing structural integrity and defining critical dimensions of metallization systems of semiconductor devices by using ald techniques |
| 02/04/2010 | US20100025854 Polishing systems and methods for removing conductive material from microelectronic substrates |
| 02/04/2010 | US20100025853 Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit |
| 02/04/2010 | US20100025852 Semiconductor device and method for manufacturing the same |
| 02/04/2010 | US20100025851 Semiconductor device and method for manufacturing the same |
| 02/04/2010 | US20100025850 Ohmic electrode structure and semiconductor element |
| 02/04/2010 | US20100025849 Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process |
| 02/04/2010 | US20100025848 Method of fabricating a semiconductor device and semiconductor device |
| 02/04/2010 | US20100025847 Semiconductor device mounted structure and semiconductor device mounted method |
| 02/04/2010 | US20100025846 Metal cap with ringed projection to be welded to stem and ringed groove provided immediately inside of ringed projection and optical device having the same |
| 02/04/2010 | US20100025845 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof |
| 02/04/2010 | US20100025844 Semiconductor device and manufacturing method thereof |
| 02/04/2010 | US20100025843 Optical semiconductor apparatus |
| 02/04/2010 | US20100025842 Semiconductor module and semiconductor device |
| 02/04/2010 | US20100025841 Semiconductor device and method of designing the same |
| 02/04/2010 | US20100025840 Embedded inductor and method of producing thereof |
| 02/04/2010 | US20100025839 Leadframe, semiconductor device, and method of manufacturing the same |
| 02/04/2010 | US20100025838 Electronic device protected against electro static discharge |
| 02/04/2010 | US20100025837 Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor device |
| 02/04/2010 | US20100025836 Multi-layer package-on-package system |
| 02/04/2010 | US20100025835 Integrated circuit package stacking system |
| 02/04/2010 | US20100025834 Fan-in interposer on lead frame for an integrated circuit package on package system |
| 02/04/2010 | US20100025833 Rdl patterning with package on package system |
| 02/04/2010 | US20100025832 Reduced stiction and mechanical memory in mems devices |
| 02/04/2010 | US20100025831 Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device |
| 02/04/2010 | US20100025830 A method for forming an etched recess package on package system |
| 02/04/2010 | US20100025829 Semiconductor device |
| 02/04/2010 | US20100025828 Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame |
| 02/04/2010 | US20100025824 Structure for Reducing Integrated Circuit Corner Peeling |
| 02/04/2010 | US20100025818 Integrated circuit package |
| 02/04/2010 | US20100025812 Pinched poly fuse |
| 02/04/2010 | US20100025811 Integrated circuit with built-in heating circuitry to reverse operational degeneration |
| 02/04/2010 | US20100025797 Device Comprising an Ohmic Via Contact, and Method of Fabricating Thereof |
| 02/04/2010 | US20100025785 Flip-chip interconnection through chip vias |
| 02/04/2010 | US20100025783 Sensor apparatus for detecting variations in a dynamic quantity while suppressing detection deviations that are caused by bending deformation of a sensor chip |
| 02/04/2010 | US20100025773 Process for producing a contact pad on a region of an integrated circuit, in particular on the electrodes of a transistor |
| 02/04/2010 | US20100025768 Semiconductor device and manufacturing method thereof |
| 02/04/2010 | US20100025727 Enhanced spontaneous separation method for production of free-standing nitride thin films, substrates, and heterostructures |
| 02/04/2010 | US20100025723 Package for protecting a device from ambient substances |
| 02/04/2010 | US20100025710 Semiconductor device and fabrication method thereof |
| 02/04/2010 | US20100025685 Method and apparatus for forming contact hole |
| 02/04/2010 | US20100025682 Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same |
| 02/04/2010 | US20100025681 Ic chip package and image display device incorporating same |
| 02/04/2010 | US20100025101 Method and apparatus for electrical component physical protection |
| 02/04/2010 | US20100025019 Heat exchanger for cooling semiconductor chip and method of manufacturing the same |
| 02/04/2010 | US20100024963 Multilevel interconnection board and method of fabricating the same |
| 02/04/2010 | DE112008000985T5 Hochfrequenz-Leiterplatte, Hochfrequenz-Schaltmodul und Radargerät High frequency PCB, high-frequency switching module and radar |
| 02/04/2010 | DE112008000759T5 Verfahren und Gerät betreffend integrierte Schaltungen mit mehrstufig gegossener Schaltungspackung Method and apparatus relating to integrated circuits with multi-stage molded circuit pack |
| 02/04/2010 | DE112007003268T5 Verfahren zum Halbleiterpacken und/oder Halbleiterpackung A method for semiconductor packaging and / or semiconductor package |
| 02/04/2010 | DE102009034083A1 Halbleiterbauelement Semiconductor device |
| 02/04/2010 | DE102009033424A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 02/04/2010 | DE102009030958A1 Halbleiteranordnung mit einem Verbindungselement A semiconductor device comprising a connecting element |
| 02/04/2010 | DE102008040782A1 Bauteilverbund sowie Verfahren zum Herstellen eines Bauteilverbundes Component composite and method for producing a composite component |
| 02/04/2010 | DE102008040775A1 Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln Encapsulation, MEMS and method for selectively encapsulate |
| 02/04/2010 | DE102008035815A1 Verbessern der strukturellen Integrität und Definieren kritischer Abmessungen von Metallisierungssystemen von Halbleiterbauelementen unter Anwendung von ALD-Techniken Improving the structural integrity and defining critical dimensions of metallization of semiconductor components using ALD techniques |
| 02/04/2010 | DE102008034560A1 Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips Radiation-emitting semiconductor chip and method of manufacturing a radiation-emitting semiconductor chips |
| 02/04/2010 | DE102008034148A1 Power semiconductor modular system, has power semiconductor module pressed on contact area of heat sink by tensioning cross bar, where semiconductor module is connected to heat sink and tensioning cross bar |
| 02/04/2010 | DE102008034068A1 Leistungshalbleitermodul The power semiconductor module |
| 02/04/2010 | DE102008033395B3 Verfahren zur Herstellung eines Halbleiterbauelementes und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device |
| 02/04/2010 | DE102008017454B4 Leistungshalbleitermodul mit hermetisch dichter Schaltungsanordnung und Herstellungsverfahren hierzu Power semiconductor module with hermetically sealed circuit and manufacturing method therefor |
| 02/04/2010 | DE102005053876B4 Drucksensor-Bauteil Pressure sensor component |
| 02/03/2010 | EP2149903A1 Semiconductor module for electric power |
| 02/03/2010 | EP2149901A1 Method for manufacturing an electronic device protected against electro static discharge |
| 02/03/2010 | EP2149538A2 Interface-infused nanotube interconnect |
| 02/03/2010 | EP2149152A1 Radio frequency absorber |
| 02/03/2010 | EP2149151A1 Cooling arrangement having a semiconductor component |
| 02/03/2010 | EP1530801B1 Semiconductor component having a csp housing |
| 02/03/2010 | EP1397830B1 Method of manufacturing copper vias in low-k technology |
| 02/03/2010 | EP1287557B1 Semiconductor device with fuses and method of manufacturing same |