Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2010
02/03/2010CN201398275Y Radiation improvement structure of communication case
02/03/2010CN201397815Y Semiconductor structure
02/03/2010CN201397814Y Radiating structure of chip type high-power element
02/03/2010CN201396726Y Light source heat dissipating device of automatic optical detecting device
02/03/2010CN201396725Y Fin type radiator
02/03/2010CN201396724Y Automobile LED headlight heat pipe cooling device
02/03/2010CN201396653Y Heat radiation improved structure for high-power LED street lamp
02/03/2010CN201396621Y High-power LED light source structure
02/03/2010CN201396620Y Novel LED lamp
02/03/2010CN201396619Y LED grille lamp
02/03/2010CN201396618Y LED luminescent apparatus
02/03/2010CN201396609Y Integrated heat dissipation LED lamp
02/03/2010CN201396607Y High-power integrated LED light source illumination lamp
02/03/2010CN201396602Y Heat-dissipating lamp body and LED lamp consisting of heat-dissipating lamp body
02/03/2010CN201396601Y Heat-dissipating lamp sectional material and high-power LED lamp consisting of heat-dissipating lamp sectional material
02/03/2010CN201396600Y Environmentally-friendly large-power LED light
02/03/2010CN201396594Y LED lamp holder integrating light distribution and heat dissipation
02/03/2010CN101641787A Semiconductor device and electric vehicle
02/03/2010CN101641786A Heat sink, and assembly or module unit comprising a heat sink
02/03/2010CN101641785A Microcircuit package having ductile layer
02/03/2010CN101641784A Surface mount device and manufacturing method thereof
02/03/2010CN101640193A Semiconductor module and portable device
02/03/2010CN101640192A Metal cap and an optical device with same
02/03/2010CN101640191A Dicing die-bonding film
02/03/2010CN101640190A Structure for reducing integrated circuit corner peeling
02/03/2010CN100587962C Methods and apparatus for packaging integrated circuit devices
02/03/2010CN100587952C Semiconductor device
02/03/2010CN100587951C Electronic device comprising integrated circuit and capacitance element
02/03/2010CN100587950C Molded lead frame connector with one or more passive components
02/03/2010CN100587949C Electric interlink and method for forming electric interlink
02/03/2010CN100587948C Semiconductor device
02/03/2010CN100587947C 半导体元件及其制造方法 Semiconductor device and manufacturing method
02/03/2010CN100587946C Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream
02/03/2010CN100587945C Aluminium-ceramic combined component
02/03/2010CN100587924C ESD protection device and method of making the same
02/03/2010CN100587124C Electroplating clamp and electrolytic plating device for electronic parts
02/03/2010CN100586980C Non-flow joint-filling composition
02/03/2010CN100586962C Thermally conductive sheet
02/02/2010US7656682 Electromagnetic noise reduction device
02/02/2010US7656677 Multilayer electronic component and structure for mounting multilayer electronic component
02/02/2010US7656672 Power module
02/02/2010US7656630 Active protection device for protecting circuit against mechanical and electromagnetic attack
02/02/2010US7656528 Periodic patterns and technique to control misalignment between two layers
02/02/2010US7656505 Apparatus to easily measure reticle blind positioning with an exposure apparatus
02/02/2010US7656048 Encapsulated chip scale package having flip-chip on lead frame structure
02/02/2010US7656047 Semiconductor device package and manufacturing method
02/02/2010US7656046 Semiconductor device
02/02/2010US7656044 Semiconductor device with improved resin configuration
02/02/2010US7656043 Semiconductor package and method for manufacturing the same
02/02/2010US7656042 Stratified underfill in an IC package
02/02/2010US7656041 Semiconductor device and its manufacturing method
02/02/2010US7656040 Stack structure of circuit board with semiconductor component embedded therein
02/02/2010US7656039 Multi chip module
02/02/2010US7656038 Substrate sheet, manufacturing method of circuit substrate, and ink jet head
02/02/2010US7656037 Integrated circuit with improved component interconnections
02/02/2010US7656036 Line component and semiconductor circuit using line component
02/02/2010US7656035 C4 joint reliability
02/02/2010US7656033 Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
02/02/2010US7656032 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
02/02/2010US7656031 Stackable semiconductor package having metal pin within through hole of package
02/02/2010US7656030 Semiconductor device
02/02/2010US7656029 Cut-out heat slug for integrated circuit device packaging
02/02/2010US7656028 System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device
02/02/2010US7656027 In-chip structures and methods for removing heat from integrated circuits
02/02/2010US7656026 Semiconductor device
02/02/2010US7656025 Direct semiconductor contact ebullient cooling package
02/02/2010US7656024 Chip module for complete power train
02/02/2010US7656022 Wiring board and manufacturing method for wiring board
02/02/2010US7656021 Integrated circuit package system with pedestal structure
02/02/2010US7656020 Packaging conductive structure for a semiconductor substrate having a metallic layer
02/02/2010US7656019 Semiconductor device and a manufacturing method of the same
02/02/2010US7656018 Package for an electronic component and method for its production
02/02/2010US7656017 Integrated circuit package system with thermo-mechanical interlocking substrates
02/02/2010US7656016 Power semiconductor device
02/02/2010US7656015 Packaging substrate having heat-dissipating structure
02/02/2010US7656014 Semiconductor device and method for manufacturing same
02/02/2010US7656013 Multilayer wiring substrate, method of manufacturing the same, and semiconductor device
02/02/2010US7656012 Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another
02/02/2010US7656010 Semiconductor device
02/02/2010US7656009 Robust ESD cell
02/02/2010US7656007 Package substrate with inserted discrete capacitors
02/02/2010US7655981 Superjunction semiconductor device
02/02/2010US7655977 Trench IGBT for highly capacitive loads
02/02/2010US7655957 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
02/02/2010US7655946 IC with comparator receiving expected and mask data from pads
02/02/2010US7655945 Real-time monitoring of particles in semiconductor vacuum environment
02/02/2010US7655944 Systems and methods for estimating thermal resistance of field effect transistor structures
02/02/2010US7655567 Methods for improving uniformity and resistivity of thin tungsten films
02/02/2010US7655560 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof
02/02/2010US7655552 Double density method for wirebond interconnect
02/02/2010US7655541 Wafer processing method and laser processing apparatus
02/02/2010US7655509 Silicide-silicon oxide-semiconductor antifuse device and method of making
02/02/2010US7655508 Overmolding encapsulation process and encapsulated article made therefrom
02/02/2010US7655506 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
02/02/2010US7655504 Semiconductor device and method of manufacturing the same
02/02/2010US7655500 Packaged microelectronic devices and methods for packaging microelectronic devices
02/02/2010US7655093 Wafer support system
02/02/2010US7654675 Light assembly for an image projector
02/02/2010US7654308 Heat exchanger
02/02/2010CA2505315C Multi-layer circuit assembly and process for preparing the same
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