Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/16/2014US8836103 Semiconductor unit
09/16/2014US8836102 Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device
09/16/2014US8836101 Multi-chip semiconductor packages and assembly thereof
09/16/2014US8836100 Slotted configuration for optimized placement of micro-components using adhesive bonding
09/16/2014US8836099 Leadless package housing having a symmetrical construction with deformation compensation
09/16/2014US8836098 Surface mount semiconductor device with solder ball reinforcement frame
09/16/2014US8836097 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding
09/16/2014US8836096 Image sensor unit and image sensor apparatus
09/16/2014US8836095 Electronic component package and base of the same
09/16/2014US8836094 Package device including an opening in a flexible substrate and methods of forming the same
09/16/2014US8836093 Lead frame and flip chip package device thereof
09/16/2014US8836092 Semiconductor device with thermal dissipation lead frame
09/16/2014US8836091 Lead frame for semiconductor package with enhanced stress relief
09/16/2014US8836089 Positive photosensitive resin composition, method of creating resist pattern, and electronic component
09/16/2014US8836088 Semiconductor structure having etch stop layer
09/16/2014US8836087 Gap-fill keyhole repair using printable dielectric material
09/16/2014US8836085 Cost-effective TSV formation
09/16/2014US8836084 Structure for reducing integrated circuit corner peeling
09/16/2014US8836080 Power semiconductor module
09/16/2014US8836078 Vertically oriented inductor within interconnect structures and capacitor structure thereof
09/16/2014US8836077 Semiconductor device and method for manufacturing the same
09/16/2014US8836073 Semiconductor device and structure
09/16/2014US8836063 Integrated passive component
09/16/2014US8836062 Integrated passive component
09/16/2014US8836054 Semiconductor chip capable of improving mounting reliability and semiconductor package having the same
09/16/2014US8836041 Dual EPI CMOS integration for planar substrates
09/16/2014US8836034 Semiconductor device
09/16/2014US8835986 Method for fabrication of III-nitride device and the III-nitride device thereof
09/16/2014US8835970 Light-emitting apparatus
09/16/2014US8835951 Light emitting device
09/16/2014US8835923 Protection method for an electronic device and corresponding device
09/16/2014US8835922 Monitoring pad and semiconductor device including the same
09/16/2014US8835907 Memory device and semiconductor device
09/16/2014US8835893 Resistive memory cell fabrication methods and devices
09/16/2014US8835891 Integrated circuitry, methods of forming memory cells, and methods of patterning platinum-containing material
09/16/2014US8835773 Wiring board and method of manufacturing the same
09/16/2014US8835772 Production method of connection structure
09/16/2014US8835770 Electronic component and method for manufacturing the same
09/16/2014US8835319 Protection layers for conductive pads and methods of formation thereof
09/16/2014US8835318 HNO3 single wafer clean process to strip nickel and for MOL post etch
09/16/2014US8835313 Interconnect barrier structure and method
09/16/2014US8835309 Forming nickel—platinum alloy self-aligned silicide contacts
09/16/2014US8835308 Methods for depositing materials in high aspect ratio features
09/16/2014US8835305 Method of fabricating a profile control in interconnect structures
09/16/2014US8835302 Method of fabricating a package substrate
09/16/2014US8835301 Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
09/16/2014US8835300 Method for inhibiting growth of intermetallic compounds
09/16/2014US8835299 Pre-sintered semiconductor die structure
09/16/2014US8835293 Methods for forming conductive elements and vias on substrates
09/16/2014US8835289 Wafer backside defectivity clean-up utilizing selective removal of substrate material
09/16/2014US8835276 Method for manufacturing semiconductor substrate
09/16/2014US8835230 Fully molded fan-out
09/16/2014US8835228 Substrate-less stackable package with wire-bond interconnect
09/16/2014US8835227 Semiconductor device fabrication method and semiconductor device
09/16/2014US8835226 Connection using conductive vias
09/16/2014US8835224 Distributing power with through-silicon-vias
09/16/2014US8835223 Chip assembly having via interconnects joined by plating
09/16/2014US8835222 Method for producing a two-chip assembly and corresponding two-chip assembly
09/16/2014US8835221 Integrated chip package structure using ceramic substrate and method of manufacturing the same
09/16/2014US8835219 Device contact, electric device package and method of manufacturing an electric device package
09/16/2014US8835218 Stackable layer containing ball grid array package
09/16/2014US8835217 Device packaging with substrates having embedded lines and metal defined pads
09/16/2014US8835207 Method of manufacturing a semiconductor integrated circuit device having a MEMS element
09/16/2014US8835194 Leakage measurement of through silicon vias
09/16/2014US8835190 Semiconductor apparatus
09/16/2014US8834184 Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
09/16/2014US8833435 Microscale cooling apparatus and method
09/16/2014US8833418 Method and system for bonding electrical devices using an electrically conductive adhesive
09/16/2014US8832935 Method of manufacturing a printed wiring board
09/16/2014US8832931 Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
09/16/2014CA2643110C Device for short-circuiting of power semiconductor modules
09/12/2014WO2014138493A2 Substrate-less interproser technology for a stacked silicon interconnect technology (ssit) product
09/12/2014WO2014137749A1 Smart phone on a chip and method making same
09/12/2014WO2014137644A1 Power mos transistor with improved metal contact
09/12/2014WO2014137622A1 Bond pad arrangement for power semiconductor devices
09/12/2014WO2014137589A1 A metal-oxide-metal (mom) capacitor with enhanced capacitance
09/12/2014WO2014137484A1 Waveguide and semiconductor packaging
09/12/2014WO2014137288A1 Palladium coated copper wire for bonding applications
09/12/2014WO2014137287A1 Palladium coated copper wire for bonding applications
09/12/2014WO2014137286A1 Palladium coated copper wire for bonding applications
09/12/2014WO2014136836A1 Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device
09/12/2014WO2014136824A1 Lead frame and semiconductor device
09/12/2014WO2014136805A1 Curable silicone composition, cured product thereof, and optical semiconductor device
09/12/2014WO2014136773A1 Epoxy resin composition, cured product, heat radiating material, and electronic member
09/12/2014WO2014136735A1 Semiconductor device
09/12/2014WO2014136683A1 Method for manufacturing power-module substrate
09/12/2014WO2014136484A1 Apparatus, composition for adhesive, and adhesive sheet
09/12/2014WO2014136007A1 Multi-component electronic module with integral coolant-cooling
09/12/2014WO2014134911A1 Rib-line type radiator and manufacturing method therefor
09/12/2014WO2014134888A1 Substrate alignment mark and manufacturing method therefor, and substrate
09/11/2014US20140256126 Electrical Connectors and Methods for Forming the Same
09/11/2014US20140256091 Methods for bonding a die and a substrate
09/11/2014US20140256087 Hybrid Bonding and Apparatus for Performing the Same
09/11/2014US20140256063 Contactless communications using ferromagnetic material
09/11/2014US20140255717 Sintered silver joints via controlled topography of electronic packaging subcomponents
09/11/2014US20140254093 Synthetic jet actuator equipped with entrainment features
09/11/2014US20140254092 Semiconductor package and electronic system including the same
09/11/2014US20140253137 Test pattern design for semiconductor devices and method of utilizing thereof
09/11/2014US20140252660 Multilayer pattern transfer for chemical guides
09/11/2014US20140252659 Semiconductor structure and manufacturing method thereof
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