Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2010
02/11/2010DE102008041035A1 Elektronischer Sensor oder Sensorgerät, insbesondere Beschleunigungssensor, mit einem in ein Sensorgehäuse eingebauten Chipmodul Electronic sensor or sensor device, in particular acceleration sensor, a sensor with a built-in chip module housing
02/11/2010DE102008037090A1 Power module arrangement, has power semiconductor module and cooling body joined to each other above contact surfaces by conductive paste, where surface roughnesses of surfaces are larger than average size of particles of paste
02/11/2010DE102008036439A1 Wärmeableitmodul mit einem Halbleiterelement und Herstellungsverfahren für ein solches Wärmeableitmodul Wärmeableitmodul with a semiconductor element and manufacturing method for such a Wärmeableitmodul
02/11/2010DE102008036422A1 Semiconductor chip for e.g. credit card, has edge structures serving as charge protectors in edge region of chip, utilizable as electrical conductors and connected with test logic, where breakage of conductors is verifiable by test logic
02/11/2010DE102008036421A1 Electronic arrangement for portable equipment, such as mobile telephone, has printed circuit board with contact hole and component with electrical connection, which is arranged at side of printed circuit board
02/11/2010DE102008034468A1 Leistungshalbleitermodul The power semiconductor module
02/11/2010DE102008034467A1 Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung Arrangement with a power semiconductor module and with a connecting device
02/11/2010DE102005014674B4 Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip in a plastic housing in separate areas and methods for preparing
02/11/2010DE10132668B4 Halbleitervorrichtung mit definierter Eingangs- /Ausgangsblockgröße und Verfahren zu deren Entwicklung A semiconductor device having a defined input / output block size, and methods for their development
02/11/2010DE10121657B4 Mikroelektronische Struktur mit Wasserstoffbarrierenschicht Microelectronic structure with hydrogen barrier layer
02/10/2010EP2152050A1 Printed wiring board
02/10/2010EP2151864A2 IC having in-trace antenna elements
02/10/2010EP2151863A1 A jet impingement cooling system
02/10/2010EP2151862A1 Semiconductor device and its manufacturing method, and display and its manufacturing method
02/10/2010EP2151653A2 Heat exchanger having winding micro-channels
02/10/2010EP2151460A1 Resin composition for encapsulating optical semiconductor element
02/10/2010EP2151148A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application
02/10/2010EP2150976A1 Integrated circuit, electronic device and esd protection therefor
02/10/2010EP2150974A1 Integrated circuit package with soldered lid for improved thermal performance
02/10/2010EP1900025B1 Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
02/10/2010CN201403269Y Heat dissipation module fixing device
02/10/2010CN201403266Y Clamp structure improvement of radiating fin
02/10/2010CN201402807Y Integrated circuit encapsulated in double-surface and overlapping
02/10/2010CN201402806Y Lead frame
02/10/2010CN201402805Y Packaging element of copper wire bonding IC chip
02/10/2010CN201402804Y Novel resin core column chip packaging structure
02/10/2010CN201402803Y Novel isolated island-type re-routing chip packaging structure
02/10/2010CN201402802Y Substrate for setting light emitting diode
02/10/2010CN201402360Y Metal patterned structure of thin-film transistor liquid crystal panel for restricting static electricity damage
02/10/2010CN201401767Y Slot type heat dissipation module and lamp used for LED lamps
02/10/2010CN201401766Y Heat dissipation module and lamp used for LED lamps
02/10/2010CN201401765Y Radiating module used for light-emitting diode lamp
02/10/2010CN201401764Y High-power LED lamp structure with fan
02/10/2010CN201401741Y LED streetlamp cap assembly structure
02/10/2010CN201401700Y LED light source module with internal power supply and closed outdoor lighting lamp
02/10/2010CN201401699Y Closed outdoor lighting lamp with LED light source module
02/10/2010CN201401675Y Universal type LED light source module for closed outdoor lighting lamp and lamp thereof
02/10/2010CN201401649Y High-power heat pipe radiator LED illuminating lamp
02/10/2010CN101647115A Semiconductor device, its manufacturing method and optical pickup module
02/10/2010CN101645444A Multichip module containing an integrated passive device
02/10/2010CN101645436A Semiconductor device packages with electromagnetic interference shielding
02/10/2010CN101645435A Probing pad structure and manufacturing method thereof
02/10/2010CN101645434A Electric fuse device and manufacturing method thereof
02/10/2010CN101645433A Circuit board structure with excess glue prevention layer, packaging method and manufacturing method thereof
02/10/2010CN101645432A semiconductor apparatus
02/10/2010CN101645431A Improved semiconductor water cooling system of computer central processing unit
02/10/2010CN101645430A Chip cooling device
02/10/2010CN101645429A Improved microchannel high-efficiency water cooling exchanger
02/10/2010CN101645428A 安装结构体以及电子设备 And an electronic device mounting structure
02/10/2010CN101645427A Dicing die-bonding film
02/10/2010CN101645426A Dicing die-bonding film
02/10/2010CN101645425A Dicing die-bonding film
02/10/2010CN101645424A Substrate for epitaxial growth
02/10/2010CN100589680C Conductive paste and multilayer ceramic substrate
02/10/2010CN100589244C 半导体器件 Semiconductor devices
02/10/2010CN100589243C 半导体器件 Semiconductor devices
02/09/2010US7660122 Electrical apparatus, cooling system therefor, and electric vehicle
02/09/2010US7660114 Heat dissipating member, heat dissipating mechanism, and information processing apparatus
02/09/2010US7659936 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
02/09/2010US7659733 Electrical open/short contact alignment structure for active region vs. gate region
02/09/2010US7659634 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
02/09/2010US7659633 Solder joint flip chip interconnection having relief structure
02/09/2010US7659632 Solder bump structure and method of manufacturing same
02/09/2010US7659631 Interconnection between different circuit types
02/09/2010US7659629 Semiconductor integrated circuit
02/09/2010US7659628 Contact structure comprising semiconductor and metal islands
02/09/2010US7659626 Semiconductor device including a barrier metal film
02/09/2010US7659625 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
02/09/2010US7659624 Semiconductor device having a nanoscale conductive structure
02/09/2010US7659623 Semiconductor device having improved wiring
02/09/2010US7659622 Trace design to minimize electromigration damage to solder bumps
02/09/2010US7659621 Solder structures for out of plane connections
02/09/2010US7659620 Integrated circuit package employing a flexible substrate
02/09/2010US7659618 Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
02/09/2010US7659617 Substrate for a flexible microelectronic assembly and a method of fabricating thereof
02/09/2010US7659616 On-chip cooling systems for integrated circuits
02/09/2010US7659615 High power package with dual-sided heat sinking
02/09/2010US7659614 High temperature, stable SiC device interconnects and packages having low thermal resistance
02/09/2010US7659613 Semiconductor device
02/09/2010US7659612 Semiconductor components having encapsulated through wire interconnects (TWI)
02/09/2010US7659611 Vertical power semiconductor component, semiconductor device and methods for the production thereof
02/09/2010US7659610 Flash memory card
02/09/2010US7659608 Stacked die semiconductor device having circuit tape
02/09/2010US7659607 Accessible electronic storage apparatus for use with support frame
02/09/2010US7659605 COF board
02/09/2010US7659604 Module component and method for manufacturing the same
02/09/2010US7659597 Integrated circuit wire patterns including integral plug portions
02/09/2010US7659596 Lateral high-voltage devices with optimum variation lateral flux by using field plate
02/09/2010US7659592 Optical element, optical module and method for manufacturing the same
02/09/2010US7659585 ESD protection structure for I/O pad subject to both positive and negative voltages
02/09/2010US7659584 Substrate isolated integrated high voltage diode integrated within a unit cell
02/09/2010US7659577 Power semiconductor device with current sense capability
02/09/2010US7659497 On demand circuit function execution employing optical sensing
02/09/2010US7659215 Method of depositing nanolaminate film for non-volatile floating gate memory devices by atomic layer deposition
02/09/2010US7659195 Method for forming metal line of semiconductor device
02/09/2010US7659183 Solid-state imaging device and method for manufacturing the same
02/09/2010US7659151 Flip chip with interposer, and methods of making same
02/09/2010US7659147 Method for cutting solid-state image pickup device
02/09/2010US7659142 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
02/09/2010US7659131 Process for producing a flat panel radiation detector and a flat panel radiation detector