| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/16/2010 | US7663200 Integrated circuit device packaging structure and packaging method |
| 02/16/2010 | US7663190 Tunable voltage isolation ground to ground ESD clamp |
| 02/16/2010 | US7663163 Semiconductor with reduced pad pitch |
| 02/16/2010 | US7663113 Semiconductor device and radiation detector employing it |
| 02/16/2010 | US7663083 Image sensor module having electric component and fabrication method thereof |
| 02/16/2010 | US7662713 Semiconductor device production method that includes forming a gold interconnection layer |
| 02/16/2010 | US7662696 Method for fabricating semiconductor devices |
| 02/16/2010 | US7662673 Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument |
| 02/16/2010 | US7662670 Manufacturing method of semiconductor device |
| 02/16/2010 | US7662664 Electronic circuit in a package-on-package configuration and method for producing the same |
| 02/16/2010 | US7662652 Chemical sensor using semiconducting metal oxide nanowires |
| 02/16/2010 | US7662007 Method of fabricating sealing substrate |
| 02/16/2010 | US7661466 Heat sink assembly having a fin also functioning as a supporting bracket |
| 02/16/2010 | CA2478626C Electrochromic rearview mirror assembly incorporating a display/signal light |
| 02/11/2010 | WO2010017512A2 Enhanced reliability for semiconductor devices using dielectric encasement |
| 02/11/2010 | WO2010017062A1 Metal wiring structure for integration with through substrate vias |
| 02/11/2010 | WO2010016975A2 Method of passivating and encapsulating cdte and czt segmented detectors |
| 02/11/2010 | WO2010016963A1 Heat exchanger device and method for heat removal or transfer |
| 02/11/2010 | WO2010016487A1 Sealing member for piezoelectric oscillation device, and method for manufacturing the sealing member |
| 02/11/2010 | WO2010016439A1 Pressure sensor package and method for manufacturing the same |
| 02/11/2010 | WO2010016426A1 Semiconductor device and power converter using the semiconductor device |
| 02/11/2010 | WO2010016390A1 Polishing solution for cmp, and method for polishing substrate using the polishing solution for cmp |
| 02/11/2010 | WO2010016351A1 Method for manufacturing semiconductor device |
| 02/11/2010 | WO2010016260A1 Semiconductor device |
| 02/11/2010 | WO2010016188A1 Connector incorporating electronic component, method for manufacturing connector incorporating electronic component, and apparatus for manufacturing connector incorporating electronic component |
| 02/11/2010 | WO2010016046A1 A cooling device |
| 02/11/2010 | WO2010016008A1 Ldmos with discontinuous metal stack fingers |
| 02/11/2010 | WO2010015678A2 Improving solder bump connections in semiconductor devices |
| 02/11/2010 | WO2010015388A1 Circuit for the parallel supplying of power during testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 02/11/2010 | WO2009131671A3 Die stacking with an annular via having a recessed socket |
| 02/11/2010 | WO2009099934A3 Methods and apparatus for heat transfer for a component |
| 02/11/2010 | US20100035382 Methods of making compliant semiconductor chip packages |
| 02/11/2010 | US20100033885 Potted electrical circuit with protective insulation |
| 02/11/2010 | US20100032848 Bond pad structure and method for producing same |
| 02/11/2010 | US20100032847 Method for forming a package-on-package structure |
| 02/11/2010 | US20100032846 Ic having viabar interconnection and related method |
| 02/11/2010 | US20100032845 Semiconductor device having an interconnect structure and a reinforcing insulating film and method of manufacturing such device |
| 02/11/2010 | US20100032844 Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same |
| 02/11/2010 | US20100032843 Through Silicon Via Layout |
| 02/11/2010 | US20100032842 MODULATED DEPOSITION PROCESS FOR STRESS CONTROL IN THICK TiN FILMS |
| 02/11/2010 | US20100032841 Semiconductor Devices and Structures Thereof |
| 02/11/2010 | US20100032840 Semiconductor Device with an Improved Solder Joint |
| 02/11/2010 | US20100032839 Electrode structure, semiconductor element, and methods of manufacturing the same |
| 02/11/2010 | US20100032838 Amorphous carbon film, semiconductor device, film forming method, film forming apparatus and storage medium |
| 02/11/2010 | US20100032837 Semiconductor device and semiconductor device manufacturing method |
| 02/11/2010 | US20100032836 Enhanced reliability for semiconductor devices using dielectric encasement |
| 02/11/2010 | US20100032835 Combination via and pad structure for improved solder bump electromigration characteristics |
| 02/11/2010 | US20100032834 Method for forming bumps in substrates with through vias |
| 02/11/2010 | US20100032833 Semiconductor device and method of manufacturing the same |
| 02/11/2010 | US20100032832 Semiconductor chip and semiconductor device |
| 02/11/2010 | US20100032831 Bump structure foe semiconductor device |
| 02/11/2010 | US20100032830 Three-dimensional conducting structure and method of fabricating the same |
| 02/11/2010 | US20100032829 Structures and methods for improving solder bump connections in semiconductor devices |
| 02/11/2010 | US20100032827 Package structure |
| 02/11/2010 | US20100032826 Semiconductor package, core layer material, buildup layer material, and sealing resin composition |
| 02/11/2010 | US20100032825 Flange Package For A Semiconductor Device |
| 02/11/2010 | US20100032824 IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus |
| 02/11/2010 | US20100032823 Semiconductor device and method of fabricating the same |
| 02/11/2010 | US20100032822 Chip package structure |
| 02/11/2010 | US20100032821 Triple tier package on package system |
| 02/11/2010 | US20100032820 Stacked Memory Module |
| 02/11/2010 | US20100032819 Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates |
| 02/11/2010 | US20100032818 Lead frame package |
| 02/11/2010 | US20100032817 Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same |
| 02/11/2010 | US20100032816 Electronic Device and Method of Manufacturing Same |
| 02/11/2010 | US20100032815 Semiconductor device packages with electromagnetic interference shielding |
| 02/11/2010 | US20100032814 Circuit structures and methods with beol layers configured to block electromagnetic edge interference |
| 02/11/2010 | US20100032813 Ic formed with densified chemical oxide layer |
| 02/11/2010 | US20100032811 Through wafer vias and method of making same |
| 02/11/2010 | US20100032810 Through wafer vias and method of making same |
| 02/11/2010 | US20100032809 Metal wiring structure for integration with through substrate vias |
| 02/11/2010 | US20100032808 Through wafer via and method of making same |
| 02/11/2010 | US20100032807 Wafer level semiconductor module and method for manufacturing the same |
| 02/11/2010 | US20100032802 Assembling of Electronic Members on IC Chip |
| 02/11/2010 | US20100032798 Semiconductor device |
| 02/11/2010 | US20100032797 Electrical fuse and semiconductor device |
| 02/11/2010 | US20100032796 Integrated Circuit Structure, Design Structure, and Method Having Improved Isolation and Harmonics |
| 02/11/2010 | US20100032795 Design structure for semiconductor device having radiation hardened insulators and structure thereof |
| 02/11/2010 | US20100032792 Semiconductor device and method of manufacturing the same |
| 02/11/2010 | US20100032789 Passive temperature compensation of silicon mems devices |
| 02/11/2010 | US20100032785 Solid-state imaging device and method for manufacturing the same |
| 02/11/2010 | US20100032776 Destructor integrated circuit chip, interposer electronic device and methods |
| 02/11/2010 | US20100032750 Power Semiconductor Device And Method Therefor |
| 02/11/2010 | US20100032732 Electrical antifuse having a multi-thickness dielectric layer |
| 02/11/2010 | US20100032720 Semiconductor device and radio communication device |
| 02/11/2010 | US20100032714 Semiconductor device and protection circuit |
| 02/11/2010 | US20100032709 SMD diode holding structure and package thereof |
| 02/11/2010 | US20100032671 Degradation correction for finfet circuits |
| 02/11/2010 | US20100032670 Electrical test structure to detect stress induced defects using diodes |
| 02/11/2010 | US20100032669 Semiconductor integrated circuit capable of controlling test modes without stopping test |
| 02/11/2010 | US20100032200 Conductive connecting pin and package substrate |
| 02/11/2010 | US20100032013 Semiconductor component |
| 02/11/2010 | US20100031503 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 02/11/2010 | DE112008000826T5 Verfahren und Struktur zum Herstellen eines oberseitigen Kontakts mit einem Substrat Method and structure for fabricating a top-side contact with a substrate |
| 02/11/2010 | DE10339939B4 Intergierte Schaltungsanordnung und Verfahren zur Herstellung und Beurteilung derselben Inter-alloy circuitry and method for producing the same and assessment |
| 02/11/2010 | DE102009035623A1 Halbleitervorrichtung Semiconductor device |
| 02/11/2010 | DE102009033321A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 02/11/2010 | DE102009030325A1 Halbleiterchipbaugruppe Semiconductor chip assembly |
| 02/11/2010 | DE102009030086A1 Feldeffekteinrichtung und Verfahren zum Herstellen derselben Field effect device and method of manufacturing the same |
| 02/11/2010 | DE102009012538A1 Lichtschranke und Verfahren zur Herstellung derselben Light barrier and method of manufacturing the same |