Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2010
02/17/2010EP1961282B1 Arrangement comprising at least one electronic component
02/17/2010EP1806037B1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
02/17/2010EP1437036B1 Latching micro magnetic relay packages and methods of packaging
02/17/2010EP1321978B1 Contact structure
02/17/2010CN201408761Y 集成电路及芯片尺寸封装集成电路 Integrated circuits and chip scale package integrated circuits
02/17/2010CN201408759Y IGBT power module
02/17/2010CN201408758Y Semiconductor finished product block
02/17/2010CN201408757Y Carrier plate chip packaging structure for SiP system packaging
02/17/2010CN201408756Y Photo-thyristor valve body for radiating heat of thermotube
02/17/2010CN201408755Y Structure of plastic lead frame with reflecting layer and conductor metal layer
02/17/2010CN201408754Y Non-pin semiconductor device without lead frame and with good radiating performance
02/17/2010CN201408753Y semiconductor chassis
02/17/2010CN201408752Y Semiconductor device
02/17/2010CN201408751Y Welding type automobile rectifier diode base
02/17/2010CN201408750Y Press-in type automobile rectifier diode shell
02/17/2010CN201408749Y Semiconductor crystal block
02/17/2010CN201408748Y Silicon deep slot structure with depth-to-width ratio
02/17/2010CN201408525Y Display screen of generator group controller
02/17/2010CN101652859A Clamping assembly
02/17/2010CN101652858A Integrated circuits and interconnect structure for integrated circuits
02/17/2010CN101652857A Cooling body
02/17/2010CN101652856A Integrated circuit package with soldered lid for improved thermal performance
02/17/2010CN101651133A Chip wiring method on film for decreasing electromagnetic interference and structure
02/17/2010CN101651132A Defect test structure of semiconductor device, defect test method and defect test structure of before-metal medium layer
02/17/2010CN101651131A Low dielectric constant insulating film and preparation method thereof
02/17/2010CN101651130A Nitrogen-containing metal cap for interconnect structures
02/17/2010CN101651129A Structure for repairing a line defect of an organic light emitting display and a method of repairing the defect
02/17/2010CN101651128A Electrical fuse and semiconductor device
02/17/2010CN101651127A Semiconductor device
02/17/2010CN101651126A Chip packing part and manufacturing method thereof
02/17/2010CN101651125A Light-emitting diode base structure with buried capacitor
02/17/2010CN101651124A Novel carrier tape for packaging mobile phone card
02/17/2010CN101651123A 功率半导体模块 Power semiconductor module
02/17/2010CN101651122A 3D conduction structure and manufacturing method thereof
02/17/2010CN100590968C Piezoelectric oscillator
02/17/2010CN100590870C Inductors having interconnect and inductor portions providing combined magnetic fields
02/17/2010CN100590864C Transmission line structure and signal transmission structure
02/17/2010CN100590863C Shallow ditch groove separation process monitoring domain and monitoring method
02/17/2010CN100590862C Wiring and organic transistor and manufacturing method thereof
02/17/2010CN100590861C Programmable through hole device, manufacturing method thereof and integrated logic circuit
02/17/2010CN100590860C Semiconductor package having plate interconnections
02/17/2010CN100590859C Projection structure with ring-shaped support and manufacturing method thereof
02/17/2010CN100590858C 半导体装置 Semiconductor device
02/17/2010CN100590857C Semiconductor device with bonding pad
02/17/2010CN100590856C Member for semiconductor device and method for manufacture thereof
02/17/2010CN100590855C Flexible substrate, manufacturing method thereof and semiconductor package
02/17/2010CN100590739C 半导体集成电路器件 The semiconductor integrated circuit device
02/17/2010CN100590732C Semiconductor memory device
02/16/2010US7665049 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
02/16/2010US7664306 Visual inspection method and visual inspection apparatus
02/16/2010US7663903 Semiconductor memory device having improved voltage transmission path and driving method thereof
02/16/2010US7663886 Electric circuit device and the manufacturing method
02/16/2010US7663884 Heat dissipation device
02/16/2010US7663883 Heat transfer mechanism, heat dissipation system, and communication apparatus
02/16/2010US7663877 Electronic apparatus and cooling component
02/16/2010US7663254 Semiconductor apparatus and method of manufacturing the same
02/16/2010US7663253 Board having electronic parts mounted by using under-fill material and method for producing the same
02/16/2010US7663252 Electric power semiconductor device
02/16/2010US7663251 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
02/16/2010US7663250 Wafer level package and manufacturing method thereof
02/16/2010US7663249 Embedded chip package structure
02/16/2010US7663248 Flip-chip component
02/16/2010US7663247 Semiconductor intergrated circuit device
02/16/2010US7663246 Stacked chip packaging with heat sink structure
02/16/2010US7663245 Interposer and stacked chip package
02/16/2010US7663244 Semiconductor device and semiconductor wafer and a method for manufacturing the same
02/16/2010US7663243 Semiconductor memory device comprising pseudo ground pad and related method
02/16/2010US7663242 Thermal interface material and solder preforms
02/16/2010US7663241 Semiconductor device
02/16/2010US7663240 Semiconductor device with multiple interconnect layers and vias
02/16/2010US7663239 Semiconductor device and method for fabricating the same
02/16/2010US7663238 Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof
02/16/2010US7663237 Butted contact structure
02/16/2010US7663235 Semiconductor die with reduced bump-to-pad ratio
02/16/2010US7663234 Package of a semiconductor device with a flexible wiring substrate and method for the same
02/16/2010US7663233 Pad part of semiconductor device having optimal capacitance between pins
02/16/2010US7663232 Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems
02/16/2010US7663231 Image sensor module with a three-dimensional die-stacking structure
02/16/2010US7663230 Methods of forming channels on an integrated circuit die and die cooling systems including such channels
02/16/2010US7663229 Lighting device
02/16/2010US7663228 Electronic component and electronic component module
02/16/2010US7663227 Liquid metal thermal interface material system
02/16/2010US7663226 Heat-releasing printed circuit board and semiconductor chip package
02/16/2010US7663224 Semiconductor BGA package having a segmented voltage plane
02/16/2010US7663223 Coupling substrate for semiconductor components and method for producing the same
02/16/2010US7663222 Semiconductor device and method for producing same
02/16/2010US7663221 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
02/16/2010US7663220 Semiconductor device module structure
02/16/2010US7663219 Semiconductor device and method of manufacturing the same
02/16/2010US7663218 Integrated circuit component with a surface-mount housing
02/16/2010US7663217 Semiconductor device package
02/16/2010US7663216 High density three dimensional semiconductor die package
02/16/2010US7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same
02/16/2010US7663214 High-capacity memory card and method of making the same
02/16/2010US7663212 Electronic component having exposed surfaces
02/16/2010US7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
02/16/2010US7663210 Optical component assembly
02/16/2010US7663209 Inlet for an electronic tag
02/16/2010US7663206 Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer
02/16/2010US7663204 Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
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